NEPCON Conference


Conference for advanced electronics and its R&D and manufacturing technology. High reliability bonding, automotive electronics, 5G, and power device, etc. will be addressed in the Conference.

Keynote Session Pre-registration Required

NEPCON-K January, 18 (Fri) 12:00  -  13:30

Next-generation Display -- MicroLED Development and its Market Prospects

  • English / Korean /
    Chinese / Japanese

The Development of Micro-LED Technology in ITRI

Chih-l Wu Vice President & General Director, Electronic and Optoelectronic System Research Labs., ITRI(Industrial Technology Research Institute) / Professor, Dept. of Electrical Engineering, National Taiwan University

Detail & Speaker’s Profile

<Detail>
ITRI has developed micro-LED technology from 2009. We focus on the technology of chip design, mass transfer, and high speed inspection. For now, we build up the platform to integrate industry from up-stream to down-stream to speed up the research for micro-LED application.

<Speaker’s Profile>
Dr. Chih-I Wu is the VP and General Director of Electronic and Optoelectronic System Research Laboratories, Industrial Technology Research Institute (ITRI). The team he leading in ITRI includes micro-assembly technology, R2R production, intelligent vision system, advanced lighting, new semiconductor architectures, IoT data link, flexible AMOLED technology, transparent display application system technology, and Fan-Out panel level packaging technology.

Micro LED Development Status and Trends

Paul Schuele CTO, eLux, Inc.

Detail & Speaker’s Profile

<Detail>
Direct emission µLED displays can replace LCD and OLED displays with better performance, efficiency and lifetime. Displays are made by integrating µLEDs with two mainstream technologies, namely LEDs developed for general lighting and back planes developed for television. The unique challenge is the manufacturing technology to precisely position millions of µLEDs with high yield. The presentation will discuss µLED mass transfer and the prospects for µLED products.

<Speaker’s Profile>
Dr. Schuele has been the technical lead for µLED display development at Sharp Labs of America until 2016. In October 2016 he co-founded eLux to commercialize µLED technology where he is currently CTO and process integration dept. The current work is a collaboration with µLED manufacturers, materials suppliers and display backplane manufacturers to make large area direct emitting displays.

Special Session Pre-registration Required

NEPCON-S1 January, 16 (Wed) 13:00  -  14:30

Next Generation Vehicle Development Race -- Its Impact on Electronics Industry

  • English / Japanese

Japan Will Hold the Leading Position in the Global Automotive Industry among Japan, US, China and Europe
-- Huge Influence on Electronics Device Industry from Green Vehicles, Connected Cars and Autonomous Vehicles

Wataru Izumiya President & CEO, Sangyo Times, Inc.

Detail & Speaker’s Profile

<Detail>
The worldwide competition over next-generation vehicle development is intensifying. The rapid rise of green vehicles such as HEVs, EVs and FCVs, the rapid development of autonomous driving technology, and connected cars are attracting attention. In this lecture, I will analyze strategies of leading Japanese automakers such as Toyota, Nissan and Honda based one the latest information acquired from our interviews. Also, I will provide the outlook on capital investment planning of Japanese suppliers including material manufacturers, in-vehicle semiconductor manufacturers, sensors and electronic component manufacturers.

<Speaker’s Profile>

NEPCON-S2 January, 17 (Thu) 10:00  -  11:30

5G Innovates Manufacturing

  • English / Japanese

About Strategy for 5G Technology & IoT Business and Future Efforts & Activities by KDDI

Keigo Harada General Manager, IoT Business Planning Dept., IoT Business Development Div., KDDI Corp.

Detail & Speaker’s Profile

<Detail>
After giving an overview of 5G technology & IoT business mainly focusing on 5G technology, introduce some impacts to customer's business that is currently trying PoC for 5G technology or having already leveraged that.

<Speaker’s Profile>

Samsung's 5G Strategy

Speaker to be announced shortly, Samsung Electronics Co., Ltd.

Detail & Speaker’s Profile

<Detail>
To be announced shortly.

<Speaker’s Profile>

NEPCON-S3 January, 17 (Thu) 12:30  -  14:00

Leading Semiconductor Manufacturers Discuss Next-generation Business

  • English / Japanese

Xilinx Adaptive Automotive Solutions Build a Safer, Intelligent World

Daniel Isaacs Director, Automotive Strategy & Market Development, Xilinx, Inc.

Detail & Speaker’s Profile

<Detail>
Xilinx Adaptable technology is at the forefront driving the next wave of intelligent Automotive and Transportation systems. This presentation describes the benefits of Xilinx's Adaptable technology through specific applications as exemplified in production ADAS systems and Autonomous Drive (AD) platforms.

<Speaker’s Profile>
Dan is Director of Automotive Strategy in the Automotive Business Unit at Xilinx.
Also, he is the representative to the Industrial Internet Consortium, and is the co-chair of the Automotive Task Group.
He has over 25+ years of experience working in automotive, aerospace/defense and consumer based companies including Ford, NEC, LSI Logic and Hughes. During his career, Dan has held positions in software design, FPGA design engineer, systems engineer and system verification, applications, other technical related management. He holds degrees in Computer Engineering- EE from Cal State University, B.S. Geophysics from ASU.

3D NAND Technology Enabling the Future, Today

Oded Sagee Sr. Director, Product Marketing, Embedded Solutions, Western Digital Corp.

Detail & Speaker’s Profile

<Detail>
As automotive system architectures change and new applications and sub-systems require highly reliable, high performance and high capacity storage solutions, Western Digital's TLC 3D NAND automotive products provide a path to achieve all of this - today.

<Speaker’s Profile>
Oded Sagee is Western Digital's senior director of embedded solutions which includes automotive, industrial, connected home, mobile and compute market segments. Sagee brings a diverse background to Western Digital with more than 20 years of high-tech experience in a variety of marketing, sales and technology roles. He is currently responsible for developing and driving product and go to market strategies for the growing market segments such as autonomous drive, IoT, AR/VR and smart city. Prior to this, Sagee served in managerial positions in both marketing and sales capacities. Sagee holds an LLB in commercial law from Hebrew University and an MBA from the London Business School (LBS).

Technical Session Pre-registration Required

INTERNEPCON JAPAN

INJ-1 January, 16 (Wed) 9:30  -  12:00
  • Apply
  • Early Bird Rate until December 5

Latest Technologies to Enhance Mounting Reliability with Soldering

  • Available only in Japanese

High Reliability Solder Material for Automotive

Shunsaku Yoshikawa Senior Researcher, Engineering Manager, Solder Technical Center, R&D Engineering Div., Senju Metal Industry Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In recent years, the development of hybrid electric vehicles (HEV) and electric vehicles (EV) is accelerating, and high reliability and high temperature of solder materials are required. In this presentation, we will introduce high reliability of board assembly materials that meet the automotive needs, and the latest solder materials for next-generation power semiconductor.

<Speaker’s Profile>
In 2006, received bachelor of Metallurgy from Tohoku University, Japan.
2018- present, has been engaged in R & D Engineering Div., Senju Metal Industry Co., Ltd..

High Reliable Interconnect Materials to Support Security of Automotive Safety

Yozo Matsukawa Manager, Product Development Dept., Plastic Materials Business Unit Electronic Materials Business Div., AIS Co., Panasonic Corp.

Detail & Speaker’s Profile

<Detail>
ADAS, self-driving and other systems are challenging the current design and reliability capabilities of semiconductor packaging and circuit board assembly processes. Advances in functionality and processing speed are driving increases in package size and a proliferation in the number of semiconductor package to printed circuit board connections, resulting in smaller and more tightly spaced solder interconnects. As a solution to that, we will introduce improvement of packaging reliability such as secondary underfill.

<Speaker’s Profile>

Improving Solder Joint Reliability with Additions of Ni and Bi

Tetsuro Nishimura President, NIHON SUPERIOR Co., Ltd.

Detail & Speaker’s Profile

<Detail>
A Pb-free solder that derives its excellent performance from a controlled addition of Ni has been enjoying great success in the global market for 20 years. Recently a further improvement in reliability has been achieved with an addition of Bi. In this presentation the mechanisms by which these two additives enhance the properties of a Pb-free solder will be explained.

<Speaker’s Profile>

INJ-2 January, 17 (Thu) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

Forefront of Automotive Electronics Development and SMT

  • Available only in Japanese

Valeo's Innovation toward the Automated Driving and the Digital Cockpit

Takahisa Iwai R&D Director, Japan/ASEAN Regional Operations, Comfort and Driving Assistance Systems, Valeo Japan Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In the conference, Valeo will present its latest innovation such as Smart Car Valeo My Mobius and new solution with connectivity Valeo XtraVue.

<Speaker’s Profile>

Total Autonomous Driving System
-- From DRIVE Platform to Supporting Cloud

Toru Baji Technical Advisor, NVIDIA Japan

Detail & Speaker’s Profile

<Detail>
DRIVE is an AD(Autonomous Driving) platform supporting up to level 5. However, AD cannot be realized by just the ECU. GPU based cloud system is essential to support the development, deployment and operation phases. In this lecture, this total AD system will be introduced.

<Speaker’s Profile>
Toru Baji graduated from Osaka University Graduate School and joined Hitachi's Central Research Lab in 1977. There he conducted research in solid-state image sensors and processor architecture. He was engaged in analog-digital circuit and processor architecture research at University of California, Berkeley and Hitachi America R&D respectively. He also filed an US patent for neuro processor. After transferring to Hitachi's Semiconductor Division in 1993, the Division was moved to Renesas and he served as a GM of Automotive Application Technology Department. He joined NVIDIA in 2008 as a Solution Architect for automotive business, supporting worldwide customers for Tegra automotive processors applications. Since 2016, he serves as an NVIDIA technical advisor and GPU Evangelist.

Future Trends of Jisso Technology & PWB for Automotive Electronics

Henry Utsunomiya President, Interconnection Technologies, Inc.

Detail & Speaker’s Profile

<Detail>
In automotive electronics, evolution of information and communication technologies such as connected car, and reduction of functional complexity by centralized ICT architecture is expected. To facilitate these trends, Jisso Technologies and PWB has been developing embedding technology and conformal electronics for adopting better fuel economy and electrical performance, as well as cost reduction.

<Speaker’s Profile>
President of Interconnection Technologies from 1999.
Chiarman of JPCA Technology Roadmap for PWBs from 2014.

INJ-3 January, 18 (Fri) 9:30  -  12:00
  • Apply
  • Early Bird Rate until December 5

Power Electronics Gaining in Importance

  • Available only in Japanese

The Latest Packaging Technology of Power Semiconductor Modules

Tomoyuki Yamazaki Senior Manager, Packaging Development Dept., Development Div., Electronic Devices Business Group, Fuji Electric Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Due to the improvement of IGBTs and wide band gap devices, the power density of power semiconductor modules has been rapidly increased. The thermal design and the mounting technology that support advanced power semiconductor modules are described.

<Speaker’s Profile>

SiC Device Market and Technology Trend

Akifumi Enomoto Senior Engineer, Product Planning Group, High Power Device Div., Power Device Production Headquarters, ROHM Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Recently SiC devices are adopted in several applications especially industrial equipment and automotive market. In the session, the advantages of SiC and application examples are introduced. Future market and technology trend are also remarkable points.

<Speaker’s Profile>
In 2004 Joined ROHM and engaged in Product strategy div.(Passive and Discrete components).
In 2013 Transferred to Germany and engaged in Product marketing (Mainly European automotive market).
Since 2017 has been engaged in Product marketing of Power devices (SiC and IGBT).

Die Attach Technology for High Temperature Operation of
Power Semiconductor Devices

Yasushi Yamada Professor, Graduate School of Engineering Master's Course Electrical and Electronic Engineering, School of Engineering Dept. of Electrical and Electronic Engineering, Daido University

Detail & Speaker’s Profile

<Detail>
Power semiconductor devices using SiC or GaN have a potential for high temperature operation excess 200 deg. C. Packaging technologies, especially die attach technology are required. Overview of the joints, research topics of Cu nano-particle joints and characterization method of the joints are mentioned.

<Speaker’s Profile>
Since 1986, Yasushi Yamada had been with Toyota Central Research and Development Labs., Inc., and he joined Daido University in 2011. He has been engaged in packaging technologies of power semiconductor modules, especially die attach technology for high temperature operation.

IC & SENSOR PACKAGING TECHNOLOGY EXPO

ISP-1 January, 16 (Wed) 14:30  -  17:00
  • Apply
  • Early Bird Rate until December 5

Packaging Roadmap for the Era of 5G, Mobile and IoT

  • English / Japanese
Course Leader Chiaki Takubo, Technology Executive, Package and Test Technology, Toshiba Memory Corp.
Sub Leader Tsutomu Sekiya, Director, General Manager, Tokyo Sales Branch, Sales Div., C. Uyemura & Co., Ltd.

Semiconductor Market Outlook '19

Masami Inaba Deputy Editor in Chief, Electronic Device Industry News, Sangyo Times, Inc.

Detail & Speaker’s Profile

<Detail>
We will report on the overall outlook of the semiconductor market and forecast for memory/logic application. In addition to reporting the outlook for semiconductor CapEx and SPE(Semiconductor Process Equipment) market in 2019, we will also introduce the remarkable Chinese semiconductor market with the latest information.

<Speaker’s Profile>
'05 Sangyo Times, Inc. joined. Thereafter, the Electronic Device Industry News: as (former Semiconductor Industry News) editorial dept. reporter, to continue the coverage activities of semiconductor market. Deputy editor chief from '15.

Packaging Technology Roadmap Gearing Up the Evaluation of AI

Toshihiko Nishio CEO, SBR Technology Co., Ltd.

Detail & Speaker’s Profile

<Detail>
5G communication that begins around 2020, it enables the collection of massive big data, low latency and large capacity mobile communication data rate exceeding 10 gigabits. And 400GbE is being deployed from this year to implement 4 times higher data traffic rates. Those infrastructure gears up and accelerates the evolution of AI from edges to clouds.
This presentation shows semiconductor roadmaps and their challenging items in the categories of IoT sensor, smart phones, autonomous cars, 5G base stations and 400GbE and beyond network infrastructures and cloud servers.

<Speaker’s Profile>

Packaging Challenges and Solutions in the Age of 5G

Scott Sikorski Vice President - Group Technology Strategy, STATS ChipPAC, Inc, JCET Group

Detail & Speaker’s Profile

<Detail>
The fifth Generation (5G) mobile communication era is expected to address the insatiable need for data communication by introducing mmWave technology and protocols. The key to enabling this architecture is packaging and system integration, especially involving an effective antenna structure and RFIC communication in cost-effective, miniaturized packages. This presentation will provide a comprehensive landscape of development options including LTCC, eWLB/FOWLP as well as laminate based packaging.

<Speaker’s Profile>
Dr. Scott Sikorski joined STATS ChipPAC after a twenty year career with IBM Microelectronics during which time he held positions related to semiconductor packaging in Research and Development, Manufacturing, Product Line Management, Business Management, and Marketing. Dr. Sikorski has held various responsibilities including Business Development, Corporate Strategy, Product Line Management and Marketing during his eight years with STATS ChipPAC. He is currently head of Technology Strategy and Marketing and is responsible for creating and maintaining the technology roadmaps for JCET Group as well as for leading the Group's technology marketing efforts. Dr. Sikorski received his Bachelor of Science degree from Columbia University's School of Engineering and Applied Sciences in Metallurgical Engineering and his Master's degree and Ph.D. from the Massachusetts Institute of Technology, both in Materials Engineering.

ISP-2 January, 16 (Wed) 14:30  -  17:00
  • Apply
  • Early Bird Rate until December 5

Future of Smart Semiconductor Fab -- IoT Changes Manufacturing

  • English / Japanese
Course Leader Osamu Nogimura, President, Renesas Semiconductor Package & Test Solutions Co., Ltd.
Sub Leader Shoji Uegaki, Senior Director, Business Development/Technical Support Dept., ASE Group

How to breakthrough the WALL -- Manufacturing Revolution by AI

Kazuhisa Okada Senior Manager, Monozukuri Solution Div., NEC Corp.

Detail & Speaker’s Profile

<Detail>
Although expectations for manufacturing innovation utilizing AI are increasing day by day, it is also true that there is a "wall" to be overcome in the practical utilization phase. In this lecture, we will introduce the points for that with the latest examples and others.

<Speaker’s Profile>
To be announced shortly

Integration of Improved Machine Control and Data Handling

Toshiki Natsui Manager, Controller Product Management Group, Controller Div., Product Business Div. HQ., Industrial Automation Company, OMRON Corp.

Detail & Speaker’s Profile

<Detail>
There is a strong trend to get better texture and handling more information.
At the manufacturing site, we will line up machineries and equipments by combining field data.
OMRON is challenging to realize improved machine control and sustainable production by the integration of control and data handling.

<Speaker’s Profile>

Challenges towards Production Efficiency -- Connected Bonder

Nelson Wong Senior Vice President, Ball Bonder Business Unit, Kulicke & Soffa Pte Ltd

Detail & Speaker’s Profile

<Detail>
In today's manufacturing world, driving efficiency and consistent quality at the right cost is important. The challenge is to develop a equipment that is smart, connected and at the right cost to help to achieve the efficiency and quality goals.

<Speaker’s Profile>
Nelson had been involved in semiconductor packaging for more than 30 years. He is currently the Senior Vice President of Ball Bonder Business Unit at Kulicke & Soffa. Prior to joining K&S, Nelson was the Process and Packaging Engineering Manager at STMicroelectronics involved in package development.

ISP-3 January, 17 (Thu) 14:30  -  17:00
  • Apply
  • Early Bird Rate until December 5

Latest Technology & Market Trends of Next-generation Power Devices

  • English / Japanese
Course Leader Hidenori Onodera, Representative Director, Kulicke and Soffa (Japan), Ltd.
Sub Leader Chiaki Takubo, Technology Executive, Package and Test Technology, Toshiba Memory Corp.

Expanding Adoption of GaN Power Transistors

Ken Shono Senior Director, WW Quality Assurance, Transphorm Japan, Inc.

Detail & Speaker’s Profile

<Detail>
GaN power transistor is the key device of small form factor and high efficiency power supply. In this paper, we present advantage of GaN, products line-up, and application of Transphorm GaN power transistor. Quality and reliability(Q+R) are also presented. Transphorm GaN power transistor achieved automotive qualification standard of AEC-Q101.

<Speaker’s Profile>
Received MS degree in 1979 from Osaka University in Applied Physics. From 1979 to 2014 he worked for reliability physics in Fujitsu. He joined Transphorm in 2014.

Technology Trend for SiC Device

Junji Yamada General Manager, Application Engineering Dept., Power Device Works, Mitsubishi Electric Corp.

Detail & Speaker’s Profile

<Detail>
Power modules with SiC semiconductors are continually being improved in characteristics, reliability, and cost. This time the latest situation and trends are explained.

<Speaker’s Profile>
Joined Mitsubishi Electric Corp. in 1985.
About 20 years experience as development engineer of power module.
Approximately 8 years experience of application engineer.

Reaping the Merits of Wide Band Gap Semiconductors
for Vehicle Electrification

Mark Münzer Vice President, Innovation & Emerging Technologies, Automotive High Power, IFAG ATV HP IET, Infineon Technologies AG

Detail & Speaker’s Profile

<Detail>
Wide band gap materials offer unique properties for development of power semiconductors. To create customer value of these for an electrified vehicle measures have to be taken in each step from raw material to system design. This paper will discuss key aspects, which have to be addressed when introducing SiC and GaN into automotive applications.

<Speaker’s Profile>
M. Münzer graduated in power electronics from RWTH Aachen in 1997. After 8 years in development of power semiconductor modules at Eupec GmbH (an Infineon subsidiary), he transferred to Infineon headquarter in Munich to establish a new business segment targeting the electric drive train market. In 2018 M. Münzer got promoted to Vice President Innovation & Emerging Technologies Automotive High Power. As part of his new role he is responsible for introduction of wide band gap semiconductors to the automotive market.

ISP-4 January, 17 (Thu) 14:30  -  17:00
  • Apply
  • Early Bird Rate until December 5

Forefront of FOWLP

  • English / Japanese
Course Leader Akio Katsumata, Development Engineering Officer, Vice President, J-Devices Corp.
Sub Leader Chuichi Miyazaki, Chief Technical Director, Packaging Solution Center, Packaging Materials Business Sector, Advanced Performance Materials Business Headquarters, Hitachi Chemical Co., Ltd.

Drivers and Applications for FO-WLP: What's Next?

E. Jan Vardaman President, TechSearch International, Inc.

Detail & Speaker’s Profile

<Detail>
Fan-out wafer level packages (FO-WLPs) are in production for APs, RF, PMICs, audio CODEC, and radar. High-performance packages for network systems are using FO-WLP. What formats are the most popular? This presentation examines new applications and the latest trends.

<Speaker’s Profile>
E. Jan Vardaman is president and founder of TechSearch International, Inc., a 29-year-old market research leader specializing in advanced packaging. She authored the first reports on ball grid array packages, wafer level packaging, and predicted the rise of FO-WLP. She is a member of IEEE CPMT and is a distinguished lecturer, IMAPS, and SEMI. She is a columnist with "Printed Circuit Design & Fab/Circuits Assembly Magazine", and the author of numerous publications on microelectronics market and technology trends.

Past, Present and Future of Fanout Package Technology

Shin-Puu Jeng Director, New Tech. Mgmt. Program, Backend Technology and Service Div., Taiwan Semiconductor Manufacturing Company, Ltd.

Detail & Speaker’s Profile

<Detail>
Significant technical advancement and business progress have been recently achieved in the area of advanced fanout package technology. These packages exhibit excellent performance, power and form factor, and meets the ever increasing bandwidth demand. For mobile PoP applications, fine pitch Cu vias and traces form finer power mesh, which improves power delivery, and reduces noise. The thin RDL structure increases thermal transfer efficiency. New multi-die chiplets fanout packages are possible alternatives to traditional chip scaling, which allows I/O reuse, for example. The heterogeneous integration with high bandwidth memory using fine pitch 2/2 um RDL lines further brings the fanout technology to a new height. In this talk, we will elaborate these advantages, and discuss future technology trend.

<Speaker’s Profile>
Dr. Shin-Puu Jeng is a director in TSMC. He was the recipient of National Industrial Innovation Award from the Ministry of Economic Affairs of ROC, Outstanding Engineer Award from Chinese Institute of Engineers, as well as TSMC Prolific Inventor and Best Disclosure Awards. He also received the best paper and outstanding paper awards from the IMPACT and ECTC conferences, respectively. He was the general chair of IITC and the executive co-chair of IMPACT. He works on advanced package technology, including far-backend, CPI, Si interposer, 3DIC, TSV and fan-out packages. He received his Ph.D degree from University of Florida in Gainesville, and conducted his post-doctoral studies at Yale University.

Future Trends of Materials and Test Vehicle Fabrication of Fan Out Package

Toshihisa Nonaka Technical Director, Packaging Solution Center, Packaging Materials Business Sector, Hitachi Chemical Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Various materials are used in FO package production. The results and the issues, which were obtained through the TV fabrication at Open laboratory of Hitachi Chemical and JOINT consortium, will be introduced including the equipment and the process from the view point of the material.

<Speaker’s Profile>

ISP-5 January, 18 (Fri) 9:30  -  12:00
  • Apply
  • Early Bird Rate until December 5

Expectations for Sensing Technologies and Semiconductors for Autonomous Driving

  • English / Japanese
Course Leader Sumitoshi Asakuma, Director & Senior Managing Executive Officer, Sumitomo Bakelite Co., Ltd.
Sub Leader Osamu Nogimura, President, Renesas Semiconductor Package & Test Solutions Co., Ltd.

Automotive Radar Development for ADAS/AD and Expectation
for Semiconductors

Kazuma Natsume Director, AD & ADAS Engineering Div. 2, DENSO Corp.

Detail & Speaker’s Profile

<Detail>
DENSO is one of ADAS/AD supplier and has been mass-producing millimeter-wave electronically scanning radar for automotive use since 2003, which is the longest market track record in the world. In my presentation, I will introduce these activities for the next generation and our expectation for semiconductors development.

<Speaker’s Profile>
Natsume joined DENSO corp. in 1996, engaged in rearch & development and mass production design of millimeter-wave radar for automotive use. Director of AD&ADAS Engineering Div. 2 since 2016.

Murata's Challenge for Automotive Sensors

Makoto Kawashima Director, Sensor Products Div., Murata Manufacturing Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Accurate sensing for thermal control and position detection is required by the next generation automotive such as components, modules, ECU in electrical vehicle and autonomous driving.

<Speaker’s Profile>

Change in Sensing Technology and Semiconductor Ecosystem for Automated Driving

Tsuguo Nobe Director and Chief Advanced Service Architect, Business Development, Government and Policy Group, Intel / Visiting Associate Professor, Institute of Innovation for Future Society, Nagoya University

Detail & Speaker’s Profile

<Detail>
Will examine future semiconductor ecosystems and Japanese issues required to develop Automated Driving and MaaS technologies which will be going toward data-driven and Software-defined solutions, based on the exponential growth of information and communication technologies.

<Speaker’s Profile>
Joined NEC in 1983. Established IBM compatible PC business in the US and Europe, and then in 1997 introduced the global standard PC architecture also in Japan. In 2001, was named CEO for Japan subsidiary of the world's largest online game company. Thought that the technology of online game, MMORPG, could be applied for Telematics and joined NISSAN in 2004. Since then, managed the integration of Information and Communication Technologies for vehicles and EV-IT was awarded the Best Mobile Innovation for Automotive and Transport at GSMA MWC 2011. In 2012, joined Intel to define and promote the globally standard architecture with emphasis on Connected Cars and Automated Vehicles. Recently, put more emphasis on integrating Artificial Intelligence and Deep Enforced Learning to accelerate the development of Autonomous Cars. Since 2014, added a position as Visiting Associate Professor at Nagoya University.

ISP-6 January, 18 (Fri) 9:30  -  12:00
  • Apply
  • Early Bird Rate until December 5

Latest Trends and Future Prospects of FOPLP -- Volume Production Just around the Corner

  • English / Japanese
Course Leader Chuichi Miyazaki, Chief Technical Director, Packaging Solution Center, Packaging Materials Business Sector, Advanced Performance Materials Business Headquarters, Hitachi Chemical Co., Ltd.
Sub Leader Shoji Uegaki, Senior Director, Business Development/Technical Support Dept., ASE Group

Towards Industrialization of Panel Level Packaging

Rolf Aschenbrenner Deputy Director, Head of Dept., IEEE Fellow, Fraunhofer IZM

Detail & Speaker’s Profile

<Detail>
Large area mold embedding technologies and embedding of active components into printed circuit boards are two major packaging trends. Both technologies are under the frame of Panel Level Packaging research at Fraunhofer IZM. This presentation describes the potential of heterogeneous integration technologies researched at Fraunhofer IZM with a strong focus on new developments of Panel Level Packaging.

<Speaker’s Profile>
Since March 1994 Rolf Aschenbrenner has been employed at the Fraunhofer Institute for Reliability and Microintegration Berlin (IZM) where he is presently the Deputy Director and Head of the Department System Integration and Interconnection Technologies. From January 2010 until December 2011 he was IEEE EPS President and in 2012 he became IEEE Fellow.
He received the iNEMI International Recognition Award in 2005, the CPMT David Feldman Outstanding Contribution Award 2013 and the European Semi Award 2016.

Next Generation Interconnection by Panel RDL Interposer/Substrate Manufacturing Platform

Yu-Hua Chen Vice President, New Business Development, CEO Office/R&D Dept., Carrier SBU Taiwan, Unimicron Technology Corp.

Detail & Speaker’s Profile

<Detail>
For next generation IC substrate development, finer, thinner, system integration, multi-functionality & higher performance are the trend. There are many challenges by using organic core for future IC substrate requirements. Glass could be a good candidate to achieve good scaling for IC substrate. Unimicron is developing panel RDL interposer/substrate platform for next generation advanced package.

<Speaker’s Profile>
Yu-Hua Chen received the Ph.D. Degree in Chemistry from National Taiwan University, Taiwan, R.O.C., in 2001. Since 2001, he has been with the Industrial Technology Research Institute (ITRI), Electronics and Optoelectronic Research Laboratories (EOL), as a member of the Packaging Technology Division in 2001~2012. Since 2012, he joined the Unimicron to develop the next generation substrate technology.

Liquid Photolithographic Material Application Technique for FO-PLP
in SCREEN FT Co.,Ltd.

Koichi Jono Manager, Engineering Section 3, Engineering Dept., New Business Operations Div., SCREEN Finetech Solutions Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Recently, development of cost-superior Fun-out PLP over WLP is actively underway. Also the photolithography materials for RDL are being evaluated for conversion from dry film to liquid. And we will introduce the state of the latest equipment utilizing slit coating technology cultivated by our company in FPD manufacturing equipment.

<Speaker’s Profile>

ISP-7 January, 18 (Fri) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

For Higher Reliability of In-Vehicle Semiconductors

  • English / Japanese
Course Leader Soichiro Kishimoto, Senior Executive Officer, Global Sales & Marketing Div. Head, Dexerials Corp.
Sub Leader Naohiko Hirano, Director, Sensor Engineering Div., DENSO Corp.

Packaging for Automotive Applications -- Challenges and Solutions

Thorsten Meyer Principal Package Concept Engineering, Infineon Technologies AG

Detail & Speaker’s Profile

<Detail>
Today, up to 80% of all innovations in a modern car are supported by electronics. Applications in all areas of motor and chassis functions, comfort, security and safety are addressed. These applications are requiring highly innovative solutions in chip design and technology, and especially in packaging. This presentation will introduce package requirements and applications in automotive power electronics. System integration solutions will be introduced and discussed with respect to concepts, materials, processes and co-design aspects.

<Speaker’s Profile>
Thorsten Meyer is Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package Platform concepts. Until March 2015 he was leading the Package Technology and Innovation Dept. at Intel Mobile Communications (IMC) in Regensburg. Prior joining IMC, he was overall project leader for the development of Wafer Level Packaging Technologies at Infineon in Regensburg and earlier in Dresden.
Thorsten is author of multiple publications and holds more than 150 patents and patent applications in the area of advanced packaging.

Analytical Technique of Heat Related to Improvement of Reliability of Semiconductor Devices for Vehicle

Ryo Endoh Research Associate, Materials Characterization Labs., Toray Research Center, Inc.

Detail & Speaker’s Profile

<Detail>
Semiconductor devices for automobile are used under severe conditions, but high reliability is required. It is necessary to perform various reliability tests, investigate the cause of degradation of material and failure, and feed back to the design. In this presentation, we will introduce examples of analysis of packaging materials and power devices.

<Speaker’s Profile>

Theoretical Approach for Improving Interconnect Reliability by Simulation
(Focusing on Structural and Thermal Analysis)

Yoshiharu Kariya Professor, Dept. of Materials Science and Engineering, Shibaura Institute of Technology

Detail & Speaker’s Profile

<Detail>
A demand for enhancement of interconnect reliability of automotive electronic packaging is increasing. A theoretical approach using numerical simulation is indispensable for improving the reliability. In this presentation, a theoretical approach for reliability of solder, resin and sintered material, mainly for power semiconductor packaging using the simulation will be presented.

<Speaker’s Profile>

ISP-8 January, 18 (Fri) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

Latest Trends of Semiconductor & Packaging Technologies for the 5G Era

  • English / Japanese
Course Leader Tsutomu Sekiya, Director, General Manager, Tokyo Sales Branch, Sales Div., C. Uyemura & Co., Ltd.
Sub Leader Sumitoshi Asakuma, Director & Senior Managing Executive Officer, Sumitomo Bakelite Co., Ltd.

5G: a Service Delivery Platform

Takao Okamawari Director, Advanced Technology Research Div., SoftBank Corp.

Detail & Speaker’s Profile

<Detail>
5G is great as it can provide high data-rate, low latency and dense multiple access services. However it is not good enough to provide a new service for enterprise customers. SoftBank will create a new platform with 5G and high performance computers for our enterprise customers.

<Speaker’s Profile>

Package Technology Trends in 5G Era

Ian Hsu Deputy Director, Process Technology & Manufacturing Operations, Package Technology Div., MediaTek Inc.

Detail & Speaker’s Profile

<Detail>
5G provides higher data rate, higher capacity and reduces latency. New package technologies and trends will be introduced in this speech. MediaTek's package technologies solutions will be also included.

<Speaker’s Profile>
Ian Hsu received his Master degree in Microelectronic Engineering from Arizona State University. He has 20 years experience in IC packaging, substrate and thermal simulation. He is currently the Deputy Director of Package Technology Div. in MediaTek.

Packaging Target is Changed from Chip to Board for 5G Data Transmission

Shigeru Koshibe President, IPAK Inc.

Detail & Speaker’s Profile

<Detail>
It's necessary for 5G realizing to improve the data transmission speed of Electronics Devices. The most important thing is to shorten the Electric Circuit Distance. Its key technology is to thin the Board (ex. Interposor). I explain the R&D situation about Thinner Core, Coreless and RDL.

<Speaker’s Profile>
1976 Completed Master Course of Osaka University and joined to "Sumitomo Bakelite". Developed Resins and Compounds (Phenol, Epoxy). 1989 Moved to "Tonen Chemical".
Developed Silica & Silicone. 2001 Established "IPAK".

PWB EXPO

PWB-1 January, 16 (Wed) 9:30  -  12:00
  • Apply
  • Early Bird Rate until December 5

High Speed FPC Market & Technology Trends amid the 5G Revolution

  • Available only in Japanese
Course Leader Hirofumi Matsumoto, Fellow/Senior Advisor, Nippon Mektron, Ltd.
Sub Leader Mitsuaki Toda, Executive Officer, General Manager, Product Development Dept., Meiko Electronics Co., Ltd.

Outlook on FPD/Smartphone Industry

Yasuo Nakane Global Head of Technology Research/Senior Analyst, Equity Research Dept., Mizuho Securities Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Analysis on FPD/smartphone industry from different viewpoints such as technology(LCD vs OLED), regional(Japan, Korea, Taiwan and China), end products (smartphone, tablet, automotive, TV, etc.), brands (Apple, Samsung, Sony, etc.), and value chain (materials and equipment).

<Speaker’s Profile>

Antenna and Package Board for Smartphones
Which High Frequency Correspondence is Demanded from

Hirotaka Ueda Representative, Semi Consult

Detail & Speaker’s Profile

<Detail>
In 2019, the trial operation of the 5G communication is going to be started. It is going to be gradually spent a market a smartphone equipped with 5G communication functionality. Some circuit boards and their structural changes in an antenna part and the RFIC part are expected. I will investigate the trend of these high frequency circuit boards while introducing the jisso examples of the latest smartphones.

<Speaker’s Profile>
With the technology development at the semiconductor package materials maker as a start, I had been in charge of quality control and the semiconductor package development since 1981. Making use of experience as a quality inspector to the famous manufacturers of the world and the technology development engineer at Sumitomo, Motorola, Mitsui High-Tec, and Amkor, I have established a technology consultant company in 2002 and have managed it to the present.

High Frequency Characteristics of Liquid Crystal Polymer Film
and Its Application to FPC

Tatsuya Sunamoto Senior Staff, Vecstar Business Promotion Dept., Research and Development Div., kuraray Co., Ltd.

Detail & Speaker’s Profile

<Detail>
We describe the environmental resistance characteristics of the circuit board of liquid crystal polymer film "Vecsar TM" and multilayer circuit processing technology.

<Speaker’s Profile>
Joined Kuraray in 1987. Developing liquid crystal polymer film "Vecstar" since 1999.

PWB-2 January, 16 (Wed) 9:30  -  12:00
  • Apply
  • Early Bird Rate until December 5

Technology Trends of M-SAP

  • English / Japanese
Course Leader Takayuki Suzuki, Manager/PWB Materials, PWB Materials Business Sector, Advanced Performance Materials Business Headquarters, Hitachi Chemical Co., Ltd.
Sub Leader Hiroshi Iinaga, General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.

ZDT Group Avary's Board Business Strategy -- Quality and Reliability

Yi-Ho Chen Director, Product Management, ZDT Group Avary Holding Co., Ltd.

Detail & Speaker’s Profile

<Detail>
10L any-layer HDI by using mSAP process is the most high-end PCB for top tier smart phones. ZDT built up the new mSAP factory within 9 months and achieved good quality and reliability performance. Both technology and manufacture management are the key factors to fulfill the requirement and expectation from customers.

<Speaker’s Profile>
Yi-Ho Chen, MS of Electrical Engineering and PhD of Mechanical Engineering, has 20 years experience in PCB related industries and was in charge of different functional Depts., such as R&D, manufacturing, sales and product management. He has joined Avary since 2013 and participated the mSAP (SLP) project from the earliest stage. He is the director of mSAP Product Management.

MSAP Patterning Process Technology and Solutions

Yasushi Kimura Vice President Marketing/Products, Orbotech Asia East, Orbotech Japan Co., Ltd.

Detail & Speaker’s Profile

<Detail>
MSAP technology is being employed these days on smartphones and related communication PCB applications with expectation for better properties and ROI. Here in this session, while mentioning about improvement points that are in process in mass production, direct Imaging solution will be presented with following process of AOI and AOS (automated Optical Shaping).

<Speaker’s Profile>
Joined Orbotech as marketing manager in 2001. Product marketing, business development on all product portfolio, became PCB Div. manager of Orbotech Japan in 2010, and promoted to VP Marketing/Products of Orbogtech Asia East.

Development Trend of Photosensitive Dry Film Resist
for HDI-MSAP Application

Tetsuro Yamashita Photosensitive Materials R&D Dept., Electronics-related Materials Development Center, R&D Headquarters, Hitachi Chemical Co., Ltd.

Detail & Speaker’s Profile

<Detail>
HDI substrate for smartphones is demanded fine circuit formation with L/S=30/30um or less in recent years. These fine wiring can realize by utilizing MSAP instead of conventional subtractive process. Miniaturization of wiring rule for HDI substrate is expected to be advancing, thus the photosensitive film is requested to achieve fine circuit formation. We will report the latest development trend of photosensitive film which can realize the next generation MSAP manufacturing.

<Speaker’s Profile>

Trends of Surface Treatment Chemicals in M-SAP for Fabrication of
Fine Pattern

Shigeru Watariguchi Team Leader, Research & Development, Technology Development Dept., Meltex Inc.

Detail & Speaker’s Profile

<Detail>
In this presentation, an overview of the chemicals which are used for DFR stripping and Cu seed layer etching in M-SAP, as well as the current approaches for fabrication of fine pattern and pattern shape after etching, are reported.

<Speaker’s Profile>

PWB-3 January, 17 (Thu) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

Thermal Management Required for Future In-vehicle and Power Electronics

  • Available only in Japanese
Course Leader Hiroshi Kondo, Principal Engineer, Jisso Technology Development Div., Processing Process Development Center, Production Engineering Headquarters, Canon Inc.
Sub Leader Koji Ikawa, Chief Engineer, Research Engineer, Production Technology Div., CMK Corp.

Thermal Management Technology and Requirement for Material & PCB

Naoki Kunimine President, Thermal Design Laboratory Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Due to miniaturization of electronic components and equipment, it has become difficult to mount a cooling device such as a heat sink or a fan. So recently, substrates and housings are used for cooling. In this lecture I will explain the design method of such equipment.

<Speaker’s Profile>

Thermal Management Technology and Materials for Automotive Electronics Devices

Arihiro Kamiya Project Director, Basis Electronics R&D Div., DENSO Corp.

Detail & Speaker’s Profile

<Detail>
As a vehicle is made with an electronic control system, many electronic goods are put on a vehicle. The thermal design of electronic goods put on severe deployment environment is important. Furthermore, how to use materials to secure reliability is important. I comment on how to use materials based on the use example of in-vehicle electronic goods.

<Speaker’s Profile>

PCB Technology for Automobiles and High Heat Dissipation PCB

Masayuki Shiobara General Manager, Technical Development Dept. 2, Technical Development Div., CMK Corp.

Detail & Speaker’s Profile

<Detail>
We will introduce market demand on PCB for automotive applications and heat dissipation structure and heat dissipation effect by PCB structure.

<Speaker’s Profile>

PWB-4 January, 17 (Thu) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

Latest RF, Materials, PCB and FPC Technologies in the Era of 5G

  • Available only in Japanese
Course Leader Hiroshi Iinaga, General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.
Sub Leader Hirofumi Matsumoto, Fellow/Senior Advisor, Nippon Mektron, Ltd.

5G Key Technologies and System Trials for 5G Applications

Yukihiko Okumura Leader of 5G Radio Access Network Research Group, 5G Labs., NTT DOCOMO, Inc.

Detail & Speaker’s Profile

<Detail>
5G is a system having features such as enhanced mobile broadband, massive machine type communications, and ultra-reliable low-latency communications. In this talk, I will describe the key technologies of 5G, and DOCOMO's latest activities on creation of various new applications by 5G and its system trials.

<Speaker’s Profile>
Dr. Yukihiko Okumura has been engaged in the research, standardization and development of wideband/broadband mobile radio communication technologies, terminals and systems, at NTT DOCOMO, INC since 1992. He is currently engaged in the research of 5G radio access technologies and is promoting field trials of 5G system. He is a Leader of 5G Radio Access Network Research Group, 5G Labs., NTT DOCOMO, INC.

Halogen-free Ultra-low Transmission Loss Circuit Board Material R-5515

Hajime Otsuka Staff Engineer, Product Development Dept., Electronic Materials Business Div., Industrial Business, AIS Co., Panasonic Corp.

Detail & Speaker’s Profile

<Detail>
We have developed "Halogen-free Ultra-low Transmission Loss Circuit Board Material ". This material is suitable for millimeter-wave band antenna circuit boards. It achieves the industry's lowest transmission loss in the millimeter-wave band signal with thermosetting resins. As the result, it achieves higher transmission efficiency and lower losses of antenna signal, and also reduces the processing costs. 

<Speaker’s Profile>

PCB Technology Realizing High-speed Transmission for Next-generation

Takahiro Yagi Manager, Simulation Technology Team, Oki Printed Circuits Co., Ltd.

Detail & Speaker’s Profile

<Detail>
There is a growing need for high-speed transmission PCB such as 5G.As the frequency becomes higher, it is indispensable to consider materials, manufacturing process and design in total to meet characteristics.We will introduce latest technologies and the relation between each element and characteristics.

<Speaker’s Profile>

5G Fuel Innovation of High-Speed FPCs

Hirofumi Matsumoto Fellow/Senior Advisor, Nippon Mektron, Ltd.

Detail & Speaker’s Profile

<Detail>
As a near future market, FPCs that accommodate high-transmission will be needed as the needs for FPC sensor modules are expected to increase with evolving advanced smartphone and 5G/IoT device market. The ultimate target values of high-speed FPCs are 10GHz of clock signal frequency and 20Gbps of high-capacity transmission. New FPC materials that achieve the target value of High-Speed FPCs will be introduced.

<Speaker’s Profile>
In 1992, received Ph.D. in Mechanical Engineering of Northwestern University (USA). In 2003, assigned to the director of engineering. At present, assigned to Fellow/Senior Advisor of Nippon Mektron, Ltd.

PWB-5 January, 18 (Fri) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

Downsizing of Electronics Devices -- Approaches & Challenges by Device, Components and Material Manufacturers

  • Available only in Japanese
Course Leader Kiyotaka Komori, Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co., Panasonic Corp.
Sub Leader Hiroshi Kondo, Principal Engineer, Jisso Technology Development Div., Processing Process Development Center, Production Engineering Headquarters, Canon Inc.

Image Sensor's Technology to Achieve Downsizing/high-performance of Image Acquisition Apparatus

Tadakuni Narabu Chief Engineer, Planning Dept., Business Exploration, Technology Strategy Div., R&D Center, Sony Corp.

Detail & Speaker’s Profile

<Detail>
The advancement of the performance and the function of image sensors has contributed to the progress of image acquisition systems like smartphones. On the occasion of 2019 which is the 50th year after CCD was invented, this presentation is explained about the situation up to the present regarding the technology innovation of image sensors and the downsizing of image acquisition apparatus, and is shown future trends.

<Speaker’s Profile>
Tadakuni Narabu received his B.S. degree in Electronic Engineering in 1978 from Tohoku University. He joined Sony Corp., Research Center, the same year, and participated in the research and development of CCD. In changes of organizations for the industrialization of CCD, he developed and commercialized CCD delay lines and CCD linear image sensors. Furthermore he started developing and commercializing CMOS image sensors. Since 2002 he has belonged to an organization of semiconductor technology development, and developed technologies regarding CMOS image sensors. He received a Ph.D. in engineering from Tohoku University in 2012. Since 2016 he has also belonged to an organization of Planning Dept., Business Exploration, Technology Strategy Div., R&D Center.

Taiyo Yuden's Circuit Products Contributing to Society 5.0

Masashi Miyazaki Deputy General Manager, Product Development Dept., Integrated Module & Device Business Div., Taiyo Yuden Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In Japan, Society 5.0 has been advocated by digitization to solve social problems, and human-centered social construction is underway. Specifically, various things are connected by IoT, cyber space and real world are fused to generate high quality data, from which new value and solution to solve the problem are created. This time we will present Taiyo Yuden's circuit products that contribute to the realization of these societies.

<Speaker’s Profile>

Technology Trend of Ultra-thin Electronic Circuit Board Materials
Supporting Miniaturization of Electronic Equipment

Yoshinori Matsuzaki Staff Engineer, AIS Co., Panasonic Corp.

Detail & Speaker’s Profile

<Detail>
Mobile devices in advanced information society are required to improve information processing capacity and downsize. In order to meet the demand, it is necessary to increase the mounting density of the electronic circuit board, and thinning of each layer is indispensable. In order to answer these needs, we have developed materials for insulation layers of several microns and will be introduced here.

<Speaker’s Profile>

PWB-6 January, 18 (Fri) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

Technology Trends of In-Vehicle Millimeter-wave Radar -- Semiconductors, SMT, RF Resins, Manufacturing & PCBs

  • English / Japanese
Course Leader Mitsuaki Toda, Executive Officer, General Manager, Product Development Dept., Meiko Electronics Co., Ltd.
Sub Leader Takayuki Suzuki, Manager/PWB Materials, PWB Materials Business Sector, Advanced Performance Materials Business Headquarters, Hitachi Chemical Co., Ltd.

Semiconductor Devices and Packaging Technology
for Automotive Radar Application

Shinji Yamaura General Manager, RF Semiconductor Development Dept., Tokyo Office, DENSO Corp.

Detail & Speaker’s Profile

<Detail>
Millimeter wave radar is promised as the one of the main sensor technologies to fulfill the safe car society. In this session, outline of the millimeter wave radar system and the recent progress of the semiconductor devices, packaging and printed board technologies for millimeter wave radar will be presented.

<Speaker’s Profile>

The Isobaric HELD Double Belt Press
-- Technology for Continuous Production of FCCL

Timo Geiges Business Economist, Held Technologie GmbH

Detail & Speaker’s Profile

<Detail>
The production of high value FCCL will become increasingly important in the future. Our outstanding technology of the Isobaric HELD Double Belt Press enables a continuous production of FCCL. This lecture presents this outstanding technology, the different production processes, the advantages of an oil supported Double Belt Press and the scope of application.

<Speaker’s Profile>
Timo Geiges joined HELD in 2012 as a business economist and since then has been responsible for sales in Asia, preferably Japan, Korea and Taiwan. He is responsible for all sales activities and sales of the unique double belt presses, including the market area of FCCL products. The press is also ideally suited for many other applications (e.g. carbon and glass fiber composites).

NORYL® Oligomers, a Perfect Fit for Evolving Needs
for Circuit Boards Applications

Scott Fisher Business Director, Thermosets & Additives, Specialties, SABIC

Detail & Speaker’s Profile

<Detail>
NORYL® Oligomers products (SA9000, SA90 & SA120) are low molecular weight additives that are used in a variety of thermoset systems including epoxies and free radical cure systems. These additives impart key properties to circuit board materials that include reduced dielectric properties, higher toughness, reduced moisture absorption and higher heat performance. The data for SA9000 in model systems will be discussed in detail.

<Speaker’s Profile>
Experience as a Business Director & Technical Director for global teams working in market analysis, business development, research, applied technology development, application development, and chemical process engineering with most experience in engineering thermoplastics, thermosets, and hybrid material. Currently leading strategy and business responsibility for a high growth and heavily technical product line focusing on thermoset formulators in a variety of application areas.

Only a Car? What are the Challenges for PWB that Can Handle
Millimeter Waves?

Hiroshi Iinaga General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Millimeter waves are attracting attention as car radars, but 5G 4k broadcast high speed communication applications are expected. I will talk about issues on printed wiring boards and their countermeasures.

<Speaker’s Profile>
Has been engaged in development of PWB long time, and now in High speed Design.

Exhibitors' Presentation Free / No Registration Required

Exhibitors will give presentations about the latest products/technologies.

>> Program

No registration required.
Please go to the venue (inside exhibition hall) directly.
Please note that some presentations might be given only in Japanese.

Concurrent Conferences Pre-registration Required

AUTO-K January, 16 (Wed) 10:30  -  12:00

Connected & Autonomous Vehicles Change the Mobility Society

  • English / Korean /
    Chinese / Japanese

Envisioning Smart Mobility Society in the Connected Future

Keiji Yamamoto Executive Vice President, Connected Company, Managing Officer, Toyota Motor Corp.

Detail & Speaker’s Profile

<Detail>
The automotive industry is facing the biggest change in the last 100 years by the advances in the technologies of Electrification, AI, and Connectivity. This keynote lecture will discuss how mobility itself will change along with the progress of Autono-Mass, and what we are envisioning the future of mobility society as well as the importance of mobility service platform.

<Speaker’s Profile>

Autonomous Driving: A Mobility Revolution

Helge Neuner Head of Automated Driving, Group Research, Volkswagen AG

Detail & Speaker’s Profile

<Detail>
Automated Driving could become a key technology to enhance traffic safety and to use the existing mobility infrastructure more efficiently. Possible applications range from comfortable ownership vehicles over efficient transport of goods to mobility as a service. These various applications are accompanied by specific technical challenges and have their specific impact on future mobility.

<Speaker’s Profile>
Dr. Helge Neuner studied Electrical Engineering and completed his studies with a PhD in Engineering at the University of Braunschweig, Germany. He began his professional career at Volkswagen in 2002. He worked in a number of different positions in Electrics and Electronics development division of Volkswagen brand and from 2008 in Volkswagen Group Research. He held leading positions and was responsible for Information Architecture and Human Machine Interaction. Since 2017 Helge Neuner is head of Automated Driving at Volkswagen Group Research.

AUTO-S1 January, 16 (Wed) 15:30  -  17:00

Electrification Technology -- Technological Advancement & Future Prospects

  • English / Japanese

R&D Activities of Automotive Batteries in Panasonic

Munehisa Ikoma Fellow, CTO in charge of Energy Business, AIS Co., Panasonic Corp.

Detail & Speaker’s Profile

<Detail>
Lithium ion batteries for automotive use (for EV, PHEV and others) have been attracting attention because of the expectation of future remarkable growth. R&D activities of automotive batteries in Panasonic which leads the industry will be shown in the presentation.

<Speaker’s Profile>

Honda Initiatives for the Electrification of Society

Kiyoshi Shimizu Chief Engineer, LPL, Automobile R&D Center, Honda R&D Co., Ltd.

Detail & Speaker’s Profile

<Detail>
As the automobile industry, realization of electrified society is required toward CO2 reduction.
Honda's approach toward this, including the background, the history of efforts of Honda's environmental vehicle development and the latest technology introduction, future development and introduction of demonstration test examples in each region.

<Speaker’s Profile>
1984, Joined Honda R&D Co., Ltd. and
2005, assigned as FCV powertrain development dept. manager.
2007, assigned as Zero Emission Vehicle research dept. manager of Honda R&D Americas, Inc. Los Angeles Center.
2013, assigned as CLARITY Series(FCV/BEV/PHEV) Large Project Leader(LPL).

AUTO-S2 January, 17 (Thu) 15:00  -  16:30

How to Make Innovations Happen for the Future

  • English / Japanese

Toyota's "Future of Mobility"

James Kuffner CEO, Toyota Research Institute-Advanced Development, Inc.

Detail & Speaker’s Profile

<Detail>
What will the mobility of a future with automated driving be? We introduce the role of TRI-AD, at the forefront of automated driving development within Toyota, furthering the transformation from an automotive company to a mobility company.
In an automotive industry that is facing its first period of change in 100 years, what is the key to innovating and creating a next-generation mobility company? CEO James Kuffner, who has been head of Google's Robotics division and CTO of the Toyota Research Institute, explains.

<Speaker’s Profile>
Prior to being named CEO at TRI-AD in March 2018, Dr. Kuffner was the Chief Technology Officer at TRI. Dr. Kuffner received a Ph.D. from the Stanford University Dept. of Computer Science Robotics Laboratory in 1999, and was a Japan Society for the Promotion of Science (JSPS) Postdoctoral Research Fellow at the University of Tokyo working on software and planning algorithms for humanoid robots. He joined the faculty at Carnegie Mellon University's Robotics Institute in 2002. Before joining TRI, Dr. Kuffner was a Research Scientist and Engineering Director at Google from 2009 to 2016. Dr. Kuffner was part of the initial engineering team that built Google's self-driving car. Dr. Kuffner was appointed head of Google's Robotics division in 2014, which he co-founded. Dr. Kuffner continues to serve as an Adjunct Associate Professor at the Robotics Institute, Carnegie Mellon University.

Technology and Culture for the Digital Innovation in MaaS Era

Takeshi Narisako Director, MaaS R&D Div., Digital Innovation Dept., DENSO Corp.

Detail & Speaker’s Profile

<Detail>
The lecturer will present Denso's efforts, describing the technologies and techniques for creating digital innovations that may encompass "Mobility as a Service", one of the once-in-every-100-years great reforms, and the culture that applies these technologies and techniques.

<Speaker’s Profile>
 

AUTO-7 January, 18 (Fri) 13:30  -  16:00
  • Apply
  • Early Bird Rate until December 5

LiDARs, Radars, Infrared Cameras -- Latest Technologies

  • English / Japanese

Semiconductor Device Technology for Realizing High-Performance LiDAR Systems

Nobu Matsumoto Chief Specialist, Center for Semiconductor Research & Development, Toshiba Electronic Devices & Storage Corp.

Detail & Speaker’s Profile

<Detail>
LiDAR has long been recognized as a candidate of prerequisite sensors for autonomous driving. In the next few years, significant progress can be expected on the major concern about the performance as well as cost reduction. This talk presents outline of key technique, which enables such progress, and a discussion on the future prospects.

<Speaker’s Profile>
Nobu Matsumoto received the M.E. degree from Waseda University and joined Toshiba Corp. in 1983. He worked as a senior manager in Center for Semiconductor Research & Development during 2006 - 2014, where he managed development of ESL design methodology, media-embedded processors and software-development tools/Operating Systems. Since then, he has been engaged in research of novel sensor technology.

Radar Technology for Assisted and Automated Driving

Norbert Hammerschmidt Vice President Program Management Radar, BU Advanced Driver Assistance Systems, Continental AG / ADC Automotive Distance Control Systems GmbH

Detail & Speaker’s Profile

<Detail>
The Radar Technology is a key technology for assisted driving functions today and will be even more important for the challenges regarding automated driving in the future. The presentation shows the way of Radar Technology from today to tomorrow.

<Speaker’s Profile>
After finishing studies I started to work for the Automotive Industrie in different companies. Since 2001 I am working for Continental AG in the Business Unit ADAS with experience in Engineering, Sales, Project Management, Product Strategy and General Management. I lived 5 years in Japan with responsibility for the Asian ADAS Business.

Thermal Sensor Value Add for ADAS / Autonomous System

Katz Hanazaki Senior Business Development Manager, Japan OEM Component, FLIR Systems Japan K.K.

Detail & Speaker’s Profile

<Detail>
Autonomous driving system development is very hot worldwide. Sensing requires sensor fusion, a combination of several types of sensors. This presentation will try to explain about features and values of thermal sensor.

<Speaker’s Profile>
Joined FLIR Systems Japan in Y2015 and role is new business development for OEM thermal sensor products. Especially automotive business opportunities are main target.

WEA-K January, 16 (Wed) 13:00  -  14:30

Wearable Technology is Changing the Society

  • English / Korean /
    Chinese / Japanese

The Real Value of Wearable Devices and the Way to Commercialization

Masahiko Tsukamoto Professor, Dept. of Electrical and Electronics Engineering, Faculty of Engineering, Graduate School of Engineering, Kobe University

Detail & Speaker’s Profile

<Detail>
Wearable devices such as HMD, Smart Watch, Wearable Sensor, etc. are increasingly becoming practical with repeated experiments, and their market is expanding year by year mainly in business and health and sports fields. In this presentation, we will explain the potential and points of these wearable devices and their uses from the viewpoint of their essential points, "human augmentation" and "a step toward becoming a cyborg".

<Speaker’s Profile>
Masahiko TSUKAMOTO received the B.E., M.S., and Dr.E. degrees from Kyoto University, Kyoto, Japan, in 1987, 1989, and 1994, respectively. From 1989 to 1995, he was a research engineer at Sharp Corp. In 1995, he joined the Department of Information Systems Engineering of Osaka University as an assistant professor, and from 1996 to 2004, he was an associate professor at the same department. Since 2004, he has been a professor at the department of electrical and electronics engineering, graduate school of engineering, Kobe university.

Bringing a Revolutionary Smartwear to a Wearable Industry

Ayumu Mitera CEO, Mitsufuji Corp.

Detail & Speaker’s Profile

<Detail>
Mitsufuji has provided safe and secure platforms to various business fields with the wearable solution "hamon" released on December 2016. Mitsufuji is here to introduce their next strategy and case study to solve social issues.

<Speaker’s Profile>

WEA-S1 January, 17 (Thu) 12:30  -  14:00

New Materials & Electronic Components for Dramatic Quality Improvement of Wearables

  • English / Japanese

Creating a Future That Can Only Be Realized with the Materials Expertise of Mitsui Chemicals

Shin Fukuda Managing Executive Officer, Center Executive, R&D Center, Mitsui Chemicals, Inc.

Detail & Speaker’s Profile

<Detail>
Whether WEARABLE technology will become an accepted and welcome part of society or not depends not only on technology or materials, but also on our ability to create a vision of the future that people can empathize with. As a materials producer, Mitsui Chemicals can help shape the future direction of society while maintaining harmony with the global environment.

<Speaker’s Profile>
Ph.D., plasma-surface interactions, Hokkaido University, Japan, 1986, a visiting scientist in Sandia National Laboratory, Livermore, found a position in Aerospace Div. of Nissan Motor Co., Ltd. and belonged to a design team of apparatuses which operated under microgravity environments, joined Mitsui Chemicals, Inc. in 1992, worked for functional film, recently he is creating new businesses concerning renewable energy, rapid diagnostic system of infectious diseases, new irrigation system, a member of Applied Physics Society Japan and AVS (former American Vacuum Society, American Institute of Physics), was recently designated as the vice-president of Chemical Society of Japan. Currently his responsibilities are R&D and the creation of new business. His latest field of interests are R&D management and corporate venturing.

Wearable Sensors Corresponding to Various Applications in Medical/Healthcare Field

Koji Miyamoto BU Head, IoT Systems Business Unit, New Business Promotion Center, TDK Corp.

Detail & Speaker’s Profile

<Detail>
TDK has positioned wearable sensors as key devices in a broad range of medical/healthcare fields including preventive medicine, prognosis and nursing care, fleet management and productivity improvement. I will introduce those with examples such as the Wristband for medical and nursing care for 24-hour remote monitoring system and for Sentiment analysis.

<Speaker’s Profile>
Koji Miyamoto's early career at Toshiba was engaged in the development of advanced CMOS logic processes and devices including embedded memories. Additionally he led yield management methodology and the concurrent engineering work bench tool. From 2002 to 2006, he worked at IBM Semiconductor Research and Development Center (SRDC) as a 65nm SOI technology device manager within the Advance Semiconductor Technology Alliance (ASTA). From 2006 to 2014, he headed Toshiba's LSI business unit managing a portfolio of standard products as well as custom circuits (ASIC) implementations. In 2013, He initiated collaboration with Rakuten which resulted in the new services business using Toshiba sensor devices. From 2014 to 2016, He was appointed to General Manager for Digital Health Business Development Dept. in Toshiba Healthcare Company as well. Appointed to current position in 2016. TDK acquired Toshiba wearables products and business operations in 2016. Earned Harvard Business school AMP179 (Advanced Management Program 179) in 2010.

ROBO-1 January, 16 (Wed) 13:30  -  15:00
  • Apply
  • Early Bird Rate until December 5

Forefront of Robot Development and What Developers Expect from Component Suppliers

  • Available only in Japanese

To be announced shortly

Yousuke Sawada Product Planning Department., Engineering Division., FA Robot Business Unit, DENSO WAVE Inc.

Detail & Speaker’s Profile

<Detail>
 

<Speaker’s Profile>
 

About Yaskawa Electric Corp.'s Next Generation Robot Development and Required Materials

Hidenori Matsuura Dept. Manager, New Generation Robot Development Dept., Yaskawa Electric Corp.

Detail & Speaker’s Profile

<Detail>
Introduction of Yaskawa Electric Corp., and further, our thinking of next-generation robot development. For this, we will introduce the necessary materials and components.

<Speaker’s Profile>

ROBO-S2 January, 17 (Thu) 15:00  -  16:30

Speech by Leaders of Next-generation Robot Development

  • English / Japanese

Sony's Efforts in the Robotics Business from the Perspective of aibo

Izumi Kawanishi Senior Vice President, AI Robotics Business, Senior General Manager of AI Robotics Business Group, Sony Corp.

Detail & Speaker’s Profile

<Detail>
A look inside the development process of autonomous entertainment robot aibo and a product/business summary including its cloud platform and services.

<Speaker’s Profile>

To the Machine the Work of Machines, to Man the Thrill of Further Creation

Tom Mathias President & CEO, Omron Adept Technologies, Inc.

*Please note that the speaker has been changed because of an unavoidable reason. [As of Oct. 25th, 2018]

Detail & Speaker’s Profile

<Detail>
OMRON has been improving lives and contributing to a better society through our business, innovating manufacturing with strategic concept "innovative-Automation!"
Advances in our core technology which is sensing, control, and "thinking" are revolutionizing human and machine collaboration in manufacturing.

<Speaker’s Profile>
Tom Mathias is President & CEO of Omron Adept Technologies, a global leader in intelligent, vision-guided robotics systems and services based in San Ramon, California (SF Bay Area). Tom has over 20 years of global experience in the automation industry, having worked in the US, Europe, and Japan, and speaks fluent English, German, and Japanese. Omron Adept Technologies is a division of Omron Corp. (6645 : Tokyo Stock Exchange).

SFE-K January, 16 (Wed) 13:00  -  14:30

Smart Factories of World's Leading Manufacturers

  • English / Korean /
    Chinese / Japanese

Utilization of Big Data for Innovation in Semiconductor Manufacturing

Hiroshi Akahori Deputy General Manager, Yokkaichi Operations, Toshiba Memory Corp.

Detail & Speaker’s Profile

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Toshiba Memory Corp, Yokkaichi Operations has been utilizing big data for the radical productivity improvement. In this keynote speech, I will explain the practical utilization of big data and the newest topics such as machine learning implementation.

<Speaker’s Profile>
Dr. Hiroshi Akahori has served as deputy general manager of Toshiba Memory Corp., Yokkaichi Operations. He is involved in utilizing big data for yield and productivity improvement. Since joining Toshiba Corp., he has been in the advanced semiconductor industry for more than 25 years with contributions to development of the unit process, process integration, devices, electrical reliability of memory cells, physical chemical analysis, inspection and metrology technologies.

MONOZUKURI Competitiveness Enhancement by Realization of SMART Production Plant

Mitsunori Kitao Vice President, Plant General Manager, Mizushima Plant, Mitsubishi Motors Corp.

Detail & Speaker’s Profile

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Issues surrounding automotive industries are the challenges we have to overcome by our MONOZUKURI competitiveness. Here is the introduction of IoT utilization at our Mizushima plant aiming at value addition to QCT (Quality, Cost, Time), foreseeing operation troubles and technology transfer as MONOZUKURI competitiveness enhancement.

<Speaker’s Profile>
In March 1983, joined Mitsubishi Motors Corp., after graduating from Kyoto University Faculty of Engineering Dept. of Metallurgy. Enrolled in Production Engineering, Stamping and Plastic Engineering. Oversea working career;
1998 - 2003 working at MMNA (Mitsubishi Motors North America, Inc.), 2013 - 2018 Executive Vice President and COO of MMTh(Mitsubishi Motors Thailand Co., Ltd.). In April 2018, appointed as Mitsubishi Motors Mizushima Plant General Manager.

SFE-S1 January, 17 (Thu) 10:00  -  11:30

Practical Plan for Smart Factories -- The Latest Case Studies

  • English / Japanese

Evolution of Robotics and Revolution of Industrial Automation through the Use of i3 Mechatronics

Masahiro Ogawa Executive Officer, General Manager, Robotics Div., Yaskawa Electric Corp.

Detail & Speaker’s Profile

<Detail>
Yaskawa Electric has pursued the automation of production sites by adopting mechatronics devices, such as industrial robots, servos, and AC drives. With the recent growth of the concept of "transforming MONOZUKURI" through the use of IoT and AI, Yaskawa created a solution called "i3 Mechatronics" to revolutionize industrial automation.
Yaskawa sets goals to provide solutions to help customers enhance sustainable productivity by connecting and integrating mechatronics devices in production sites using data.
Yaskawa will introduce the current status of and future prospects in the evolution of production automation including robots using examples of applications.

<Speaker’s Profile>

Innovation in Manufacturing Site of Monozukuri by "i-Automation!"

Junta Tsujinaga Executive Officer, Senior General Manager, Product Business Div. HQ, Industrial Automation Company, OMRON Corp.

Detail & Speaker’s Profile

<Detail>
While management problems faced by Japanese manufacturers such as shortage of workers at production sites, aging of experienced engineers and difficulties in successors become a social issue, Japanese manufacturing is undergoing a major turning point accelerated by the progress of technological innovation such as AI, IoT and robotics. Introducing manufacturing innovation initiatives which have been materialized the concept of i-Automation through development at Omron's own factories and through co-creation with customers, propose the direction of manufacturing innovation in the near future. The Omron's concept of manufacturing innovation, i-Automation, is the following three "i's" of automations:
1)"integrated" automation which improves productivity through fine tuning of control devices 2)"intelligent" automation which let people and machine learn and evolve through usage of data at production floor 3)"interactive" automation which provides flexible manufacturing with harmonizing people and machine

<Speaker’s Profile>

<Concurrent Conference>