NEPCON NAGOYA Conference


Conference covers latest topics in the electronics industry including development of engineers, top EMS providers' technologies, forefront of Micro LED, key devices for 5G, etc.
>>Conference Room Assignment

Keynote Session Pre-registration Required

NEPCON-K September, 19 (Thu) 12:00  -  13:00

DENSO's Monozukuri(manufacturing) Spirits & Development of Engineers

  • English/Japanese

Development of Human Resources and Organization for DENSO Engineers -Crafting the Core-

Yasushi Yamanaka Executive Vice President, Member of the Board, DENSO Corp.

Detail & Speaker’s Profile

<Detail>
The automobile industry is facing a once-in-a-century period of profound transformation. The environment has been rapidly changing such as technologies have been innovated dramatically and the domain has been enlarged. This presentation describes DENSO's efforts to develop human resources and organization for engineers which pass down, evolve and deepen its strengths proven by the unique history.

<Speaker’s Profile>

Special Session Pre-registration Required

NEPCON-S1 September, 18 (Wed) 10:30  -  12:00
  • FREE

Leading EMS Providers' Technologies

  • English/Japanese

Navigate the Future, Pegatron's DMS Business

Jason Cheng Vice Chairman, Pegatron Corp.

Detail & Speaker’s Profile

<Detail>
Pegatron has become one of leading companies in DMS (Design and Manufacturing Service) industry through the years. What opportunities did they grab? How did the company overcome difficulties? Its Vice Chairman Mr. Cheng will deliver the speech to elaborate the key to the company's growth, offer his perspectives on the trend of development and bring up what Pegatron has enhanced to reach next era.

<Speaker’s Profile>
Jason Cheng has served as Vice Chairman of Pegatron Corp. since 2016. He is also Chairman of some subsidiaries of Pegatron Group. Cheng has been dedicated to the business area of Design and Manufacturing Services (DMS) for electronic products since 1994 with ASUSTeK. He takes an active role in driving excellence of operation for large scale, high quality, and competitive cost. In 2008 ASUSTeK decided to refocus on the brand business and Pegatron was spun off as an independent company pursuing DMS business. Cheng was pointed to be CEO of Pegatron and the company was listed on Taiwan Stock Exchange on June 24, 2010.

"EMS+" Business by "General Purpose Robot Platform"

Shinji Kojima Senior Architect, General Manager, Robot & Business Group, Innovation Unit, VAIO Corp.

Detail & Speaker’s Profile

<Detail>
Already "Robots" aren't products that only companies which are familiar with IT technology can develop.
Aim for the day when people and "Robots" can coexist coming soon, now VAIO offer "General Purpose Robot Platform" which provide necessary technology and solutions for development of "Communication Robot".
It will make all companies can develop "Robots".
In this talk, introduce a new EMS business "EMS+" utilizing this platform.

<Speaker’s Profile>

NEPCON-S2 September, 20 (Fri) 9:30  -  11:00
  • FREE

Global Trends of Next Generation Displays

  • English/Japanese

Prospect and Technology of Samsung Micro LED
-- Breakthrough through the Open Innovation

Hakkyung Sung Corporate SVP, Alpha Product Manager Group, Visual Display Business, Samsung Electronics Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Recently, interest in micro LED displays, referred to as the new and ultimate future display, has been soaring. Micro LED display is combined with technologies, such as LED chip transfer, modular substrates and top/bottom wiring of substrates that have not been applied in conventional displays. In this presentation, I am going to describe the new technologies required for micro LED display and discuss how to build its ecosystem through Open Innovation.

<Speaker’s Profile>
Acquired Master's degree in Mechanical Engineering at Yonsei University in 1995
Acquired Doctorate degree in Systems and Control Engineering at Tokyo Institute of Technology in March 1992
Joined the Production Technology Center at Samsung Electronics Co., Ltd. in 1993
Has been in charge of developing MicroLED in the Visual Display Business since 2018

Display of the Future

Peng Wei Vice President, Royole Corp.

Detail & Speaker’s Profile

<Detail>
Royole is a global pioneer and manufactures of advanced flexible displays, flexible sensors, and smart devices. Royole developed the world's thinnest AMOLED flexible display only 0.01mm in 2014. Last year, Royole manufactured the world's first foldable smartphone, as well as wearable devices and IoT products.

<Speaker’s Profile>
Dr. Peng Wei, Vice President of Royole Corp. Peng received his B.S. and Ph.D. in Chemistry at Tsinghua University in 2002 and 2007, respectively. Between 2008 and 2012, Peng did his postdoctoral research in the Dept. of Chemical Engineering at Stanford University. In 2012, Peng cofound Royole Corp. together with CEO, Dr. Bill Liu.

NEPCON-S3 September, 20 (Fri) 14:30  -  16:00
  • FREE

Latest Trends of Electronics Industry

  • Available only in Japanese

Drastic Structural Change in Electronic Device Industry -- "In-vehicle", "Manufacturing with IoT" & "Edge" Are the Keywords

Wataru Izumiya President & CEO, Sangyo Times, Inc.

Detail & Speaker’s Profile

<Detail>
The US-China tension soars and UK voted to leave the EU. Now, globalisation is on the verge of collapse. Computers are transitioning from complete centralized control to independent decentralized control. Cloud and edge computing are simultaneously progressing. Customization and high-mix low-volume production/flexible volume production of electronic devices are rapidly increasing. This session will report, based on the latest information, the structural change of electronic device for automotive and smart factory applications and the change of direction in capital investment.

<Speaker’s Profile>

Technical Session Pre-registration Required

NEPCON-1 September, 18 (Wed) 13:00  -  14:30

Expectations for Sensing Technologies and Semiconductors for Autonomous Driving

  • Available only in Japanese

Murata's Challenge for Automotive Sensors

Makoto Kawashima Director, Sensor Products Div., Murata Manufacturing Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Accurate sensing for thermal control and position detection is required by the next generation automotive such as components, modules, ECU in electrical vehicle and autonomous driving.

<Speaker’s Profile>

Sensing Technologies for Autonomous Vehicles and Changing Semiconductor Eco System

Tsuguo Nobe Director and Chief Advanced Service Architect, Business Development, Government and Policy Group, Intel K.K. / Visiting Associate Professor, Nagoya University

Detail & Speaker’s Profile

<Detail>
There are clear two directions of Automated Vehicle market and development. One is "cars for private ownership" and the other is "cars for mobility service". Among these directions, I will explain how the sensor technologies and the semiconductor ecosystem will change.

<Speaker’s Profile>
Joined NEC in 1983. Established IBM compatible PC business in the US and Europe, and then in 1997 introduced the global standard PC architecture also in Japan. In 2001, was named CEO for Japan subsidiary of the world's largest online game company. Thought that the technology of online game, MMORPG, could be applied for Telematics and joined NISSAN in 2004. Since then, managed the integration of Information and Communication Technologies for vehicles and EV-IT was awarded the Best Mobile Innovation for Automotive and Transport at GSMA MWC 2011. In 2012, joined Intel to define and promote the globally standard architecture with emphasis on Connected Cars and Automated Vehicles. Recently, put more emphasis on integrating Artificial Intelligence and Deep Enforced Learning to accelerate the development of Autonomous Cars. Since 2014, added a position as Visiting Associate Professor at Nagoya University.

NEPCON-2 September, 18 (Wed) 15:30  -  17:00

Latest Technologies to Enhance Mounting Reliability with Soldering

  • Available only in Japanese

High Reliability Solder Material for Automotive

Shunsaku Yoshikawa Senior Researcher, Engineering Manager, Solder Technical Center, R&D Engineering Div., Senju Metal Industry Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In recent years, the development of hybrid electric vehicles (HEV) and electric vehicles (EV) is accelerating, and high reliability and high temperature of solder materials are required. In this presentation, we will introduce high reliability of board assembly materials that meet the automotive needs, and the latest solder materials for next-generation power semiconductor.

<Speaker’s Profile>
In 2006, received bachelor of Metallurgy from Tohoku University, Japan.
2018- present, has been engaged in R&D Engineering Div., Senju Metal Industry Co., Ltd.

Improving Solder Joint Reliability with Additions of Ni and Bi

Tetsuro Nishimura President, NIHON SUPERIOR Co., Ltd.

Detail & Speaker’s Profile

<Detail>
A Pb-free solder that derives its excellent performance from a controlled addition of Ni has been a great success in the global market for 20 years. Recently a further improvement in reliability has been achieved with an addition of Bi. In this presentation, how these two additives enhance the properties of a Pb-free solder will be explained.

<Speaker’s Profile>

NEPCON-3 September, 19 (Thu) 14:30  -  16:00

Forefront of FOWLP

  • English/Japanese

Advanced Fan-Out Technology for the Coming Era of AI

Sang-Hyun Lee Sr. Director, Advanced Assembly Technology Project Leader, Technology Development Center, R&D, Amkor Technology Korea, Inc.

*Please note that the speaker has been changed because of an unavoidable reason.
The speech topic remains the same. [As of Sep. 6th, 2019]

Detail & Speaker’s Profile

<Detail>
To realize the high-performance systems required for the coming era of artificial intelligence (AI), advanced packaging will play a more critical role than ever before. At the same time, semiconductor packaging is facing new challenges, such as the integration of heterogeneous chips, larger chip and package sizes and high-speed I/O connectivity. This presentation will discuss fan-out technology as a toolbox that enables the requirements of the rising AI applications.

<Speaker’s Profile>
Sang-Hyun Lee received PhD degree in electrical engineering from the University of Michigan, Ann Arbor, USA in 2009. From 2010, he had worked in Samsung Electronics for LED package development. He joined Amkor Technology in 2016 and is currently leading advanced assembly technology project to develop fine-pitch flip-chip, WLCSP, 2.5D TSV package, wafer level fan-out (WLFO) and high-density fan-out (HDFO) package platforms.

Advanced Packaging for 5G Ecosystem

Bo-Hao Ma Manager, Product Application Engineering Dept. 1, Product Application Engineering Div., Corporate R&D, Siliconware Precision Industries Co., Ltd.

Detail & Speaker’s Profile

<Detail>
A series advanced packaging technologies and development roadmap for 5G ecosystem which will cover mobile computing, high performance computing, networking infrastructure, IoT, automotive electronics. Diversity packaging requirements and characterizations will be discussed in terms of performance, form factor and cost effective.

<Speaker’s Profile>
Above 15 years of experience in the semiconductor industry company, currently working as department manager of SPIL Corporate R&D the responsibility of product application engineering.

NEPCON-4 September, 20 (Fri) 9:30  -  11:00

Thermal Management Required for Future In-vehicle and Power Electronics

  • Available only in Japanese

Thermal Management Technology and Requirement for Material & PCB

Naoki Kunimine President, Thermal Design Laboratory Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In compact and sealed devices such as in-vehicle and mobile devices, it is difficult to mount cooling devices such as heat sinks and fans. Therefore, a printed circuit board or a housing is used as a radiator. This method requires a heat dissipating material. I will explain how to design such equipment.

<Speaker’s Profile>

Thermal Management Technology and Materials for Automotive Electronics Devices

Arihiro Kamiya Project Director, Innovative Hardware Engineering Dept, Basis Electronics R&D Div., DENSO Corp.

Detail & Speaker’s Profile

<Detail>
As vehicles have been controlled by electronic control systems, many electronic products are put on a vehicle. The thermal design of electronic products put on severe deployment environment is important. Furthermore, how to use materials to secure reliability is important. I comment on how to use materials based on the use example of in-vehicle electronic products.

<Speaker’s Profile>

NEPCON-5 September, 20 (Fri) 12:00  -  13:30

5G : Key Device Development

  • English/Japanese

Package Technology Trends in 5G Era

Ian Hsu Deputy Director, Process Technology & Manufacturing Operations, Package Technology Div., MediaTek Inc.

Detail & Speaker’s Profile

<Detail>
5G provides higher data rate, higher capacity and reduces latency. New package technologies and trends will be introduced in this speech. MediaTek's package technologies solutions will be also included.

<Speaker’s Profile>
Ian Hsu received his Master degree in Microelectronic Engineering from Arizona State University. He has 20 years experience in IC packaging, substrate and thermal simulation. He is currently the Deputy Director of Package Technology Div. in MediaTek.

5G/IoT Fuel Innovation of High-Speed FPCs

Hirofumi Matsumoto Fellow/Senior Advisor, Nippon Mektron, Ltd.

Detail & Speaker’s Profile

<Detail>
High-Speed FPC technologies of 5G/IoT is introduced.
Our ultimate high-speed transmission targets are set at 10GHz of clock rate and 20Gbps of capacity.

<Speaker’s Profile>
In 1992, received Ph.D. in Mechanical Engineering of Northwestern University (USA). In 2003, assigned to the director of engineering. At present, assigned to Fellow/Senior Advisor of Nippon Mektron, Ltd.

Concurrent Conferences Pre-registration Required

AUTO-K September, 18 (Wed) 10:30  -  11:30
  • Fully Booked

Mobility Evolution and Challenge for the Future

  • English/Japanese
Shigeki Terashi Member of the Board of Directors, Executive Vice President, Toyota Motor Corp.

Detail & Speaker’s Profile

<Detail>
Automotive Industry is now in a period of drastic change, as technologies like electrification, automated driving, connected, and car-sharing are making significant progress. Presentation introduces Toyota's challenge on transformation from traditional car company to a mobility company by evolving mobility to create the future.

<Speaker’s Profile>
Shigeki Terashi joined Toyota Motor Corporation (TMC) in 1980. In 2005, he was appointed executive chief engineer. He became a senior managing officer at TMC in 2013, and an executive vice president, and a member of the board of directors in 2015. He organizes planning and development of powertrains and electrified vehicles, as well as R&D of advanced technologies which leads to future mobility society.

AUTO-S3 September, 19 (Thu) 14:30  -  16:00
  • FREE

xEV Developed from a Unique Viewpoint -- Its Strategy and Development Story

  • English/Japanese

How Jaguar Land Rover Is Rising to the Challenges of Tomorrow

Danella Bagnall Executive Vice President, Product Engineering China & Asia Pacific, Jaguar Land Rover

Detail & Speaker’s Profile

<Detail>
A short talk about how Jaguar Land Rover is facing the challenges of tomorrow including Autonomous, Connected and Electrified Technologies.

<Speaker’s Profile>
Danella was appointed Product Engineering Executive Vice President for China & Asia Pacific region in March 2017. In her role Danella is based in Shanghai and is responsible for all engineering activity in the region. Starting as a Technical Apprentice in 1987 Danella has long service with Jaguar Land Rover - mainly in the Product Engineering dept. and has worked on several cars from concept to launch increasing her technical and leadership responsibility at each step. Danella is honored to represent Jaguar Land Rover globally and has deep learning from her time in Asia.

e-BOXER "Commitment to the Customer Value" Invented Electric Technology

Tomoyuki Nunome General Manager, Subaru Product & Portfolio Planning Div., Subaru Corp.

Detail & Speaker’s Profile

<Detail>
"e-BOXER" was announced in Japan in June, 2018.
A new technology was to be particular about realization of customer's request to an SUV, and it was possible to achieve it.
And it was possible to get the good value of the market at present.
The contents gathered about this new technology "e-BOXER" are introduced in this lecture.

<Speaker’s Profile>
 

AUTO-1 September, 18 (Wed) 15:30  -  17:30

How Autonomous Driving & Connected Car Changes with 5G?

  • Available only in Japanese

Development of Automated Driving and Connected Car
Accelerated by 5G Technology

Atsushi Akagi General Manager, Technical Planning Div., Technology Sector, Managing Executive Officer, KDDI Corp.

* Please note that the order of the speech has changed. (As of Friday, September 13, 2019)

Detail & Speaker’s Profile

<Detail>
The evolution of telecommunication service has contributed to the improvement of convenient social life, moreover, it will change a car life of users in the future 5G era. This presentation introduces the evolution of telecommunication services and collaborative works for connected car and autonomous driving technology.

<Speaker’s Profile>

NTT DOCOMO's Concept and Activities for 5G/C-V2X

Takehiro Nakamura Senior Vice President, General Manager of 5G Labs., NTT DOCOMO, Inc.

Detail & Speaker’s Profile

<Detail>
Investigation and trials on 5G and Celluler-V2X(C-V2X) are progressing globally. In this presentation, NTT-DOCOMO's concept and activities on 5G and C-V2X are provided.

<Speaker’s Profile>
Takehiro Nakamura joined NTT Labs. in 1990. He is now SVP and General Manager of 5G Labs. in NTT DOCOMO, INC.
Mr. Nakamura has been working for research and development of the W-CDMA, HSPA, LTE/LTE-Advanced, 5G and C-V2X/Connected Car technologies.
He has been engaged in the standardization activities for W-CDMA, HSPA, LTE/LTE-Advanced and 5G at ARIB in Japan since 1997. He is currently the leader of 2020 and Beyond Ad Hoc (20B AH) in ARIB and Acting Chairman of the Strategy & Planning Committee in 5G Mobile Communication Promotion Forum (5GMF) in Japan.
He has been contributing to standardization activities in 3GPP since 1999. He contributed to 3GPP TSG-RAN as a vice chairman from March 2005 to March 2009 and as a chairman from April 2009 to March 2013.
He is also very active in standardization of C-V2X/Connected Car in ARIB and ITS Info-communications Forum in Japan. He is now a leader of Cellular System Application Task Group of ITS Info-communications Forum.

5G as an Enabler for Automated Driving

Hitoshi Yoshino Technical Meister, Deputy Director, Advanced Technology Strategy Dept., Advanced Technology Div., SoftBank Corp.

Detail & Speaker’s Profile

<Detail>
5G is targeting not only conventional Mobile Broadband (MBB) communication but also Ultra-Reliable and Low Latency (URLLC) communication. Recently, studies have been successfully carried out to apply radio communications to vehicle control, e.g. Cooperative ACC (Adaptive Cruise Control). In this talk, we discuss how 5G broadband and/or ultra low-latency communications can be exploited in automated driving.

<Speaker’s Profile>
Hitoshi Yoshino received the B.S. and M.S. degrees in electrical engineering from the Science University of Tokyo, Tokyo, Japan, in 1986 and 1988, respectively, and the Dr. Eng. degree in Communications and Integrated Systems from the Tokyo Institute of Technology, Tokyo, Japan in 2003.
He joined SoftBank Corp, Tokyo, Japan in 2009. He has been involved in several research projects in the areas of mobile radio communication systems, including 4G, 5G and C-V2X. He is currently a Deputy Director in Advanced Technology Div., Softbank Corp. He is also Board Director of SB Drive Corp., in which he is working on future mobility services, including automated driving.
He is a Member of IEEE and IEICE of Japan. He currently serves as chairman of WG5 (New Technologies, including ITS) of ITU-R WP5A and as deputy chairman of Radio Technology Group, Technical Committee, the 5th Generation Mobile Communications Promotion Forum (5GMF) of Japan.

SFE-K September, 18 (Wed) 13:00  -  14:30

AI & Big Data Innovate Manufacturing: Case Study & the Benefit

  • English/Japanese

Utilization of Big Data for Innovation in Semiconductor Manufacturing

Hiroshi Akahori Deputy General Manager, Yokkaichi Operations, Toshiba Memory Corp.

Detail & Speaker’s Profile

<Detail>
Toshiba Memory Corp, Yokkaichi Operations has been utilizing big data for the radical productivity improvement. In this keynote speech, I will explain the practical utilization of big data and the newest topics such as machine learning implementation.

<Speaker’s Profile>
Dr. Hiroshi Akahori has served as deputy general manager of Toshiba Memory Corp., Yokkaichi Operations. He is involved in utilizing big data for yield and productivity improvement. Since joining Toshiba Corp., he has been in the advanced semiconductor industry for more than 25 years with contributions to development of the unit process, process integration, devices, electrical reliability of memory cells, physical chemical analysis, inspection and metrology technologies.

Engineering Innovation of Vehicle Production and Future of Monozukuri in Automobile Industry

Haruhiko Yoshimura Alliance Global VP, Corporate Vice President, Vehicle Production Engineering and Development Div., Nissan Motor Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Automotive industry has been required to challenge the issue of environment, safety, and improvement of attractive quality. Technologies for Weight reduction, electrification, autonomous driving, and connected cars are expected to expand rapidly in the future. Nissan Motor has been developing new production technology in line with vehicle structure innovation. In this session, we will introduce the changes in vehicle structure through the weight reduction, electrification, autonomous driving, and connected cars and Nissan's efforts in production technology innovation.

<Speaker’s Profile>
1983 - Joined Nissan Motor Co., Ltd.
1998 - Manager, Vehicle Production Engineering Dept.
2005 - Transferred to Nissan Europe S.A.S.
2009 - GM, Vehicle Assembly Engineering Dept., Nissan Motor Co., Ltd.
2011 - Plant Manager, Oppama Plant
2014 - Alliance Global Director, Vehicle Process Engineering No.2/VP,
Vehicle Production Engineering
2015 - Alliance Global VP, Vehicle Production Engineering
2016 - Corporate Vice President, Alliance Global VP
Vehicle Production Engineering

SFE-S1 September, 18 (Wed) 15:30  -  17:00
  • FREE

Small & Medium Sized Manufacturers Can Achieve Smart Factories

  • Available only in Japanese

Concrete Example of Ricoh-style Industrie 4.0

Kazuo Nishinomiya Corporate Senior Vice President, Responsible for Production & Procurement, Executive General Manager, Production Div., Ricoh Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Ricoh has promoted digitalization having applied original tools derived from our own Gemba to achieve ideal "Smart Factory". Here is the introduction of IoT and Digital Manufacturing Ricoh with Image processing technology has practiced.

<Speaker’s Profile>

Productivity Improvement by Factory Digitalization

Naoki Tani Senior Vice President, Managing Director, IoT Business Dept., Corporate Sales and Marketing Div., NTT DOCOMO, Inc.

Detail & Speaker’s Profile

<Detail>
DOCOMO provides IoT solutions to improve productivity and address issues related to labor shortage in manufacturing industry. This presentation will introduce examples of the IoT solutions that were tested via multiple PoCs with SMEs; in particular, IoT platform, failure sign detection for factory equipment, and bottleneck process detection solution for product manufacturing lines.

<Speaker’s Profile>

ROBO-2 September, 19 (Thu) 9:30  -  11:00

Collaborative Robots in Manufacturing

  • Available only in Japanese

New Integrated Control World by Collaborative Robot "COBOTTA"

Yosuke Sawada General Manager, FA Robot Business Unit, Product Planning Dept., Denso Wave Inc.

Detail & Speaker’s Profile

<Detail>
Introduce case studies with featuring "safety design", "portable body", "easy to use" & "open platform" and extended products by our integrated development environment.

<Speaker’s Profile>
Joined DENSO Corp. formerly known as Nippon Denso Co. Ltd. in 1985, and started working on a development, sales and technical supports for a commercialization of an industrial robot in 1992.
From 2004, was sent to DENSO EUROPE B.V in Germany for 7 years to establish the sales expanding systems of DENSO robotics in Europe.
Since 2011 has been in charge of planning new products at the product planning dept. at DENSO WAVE Inc.

Case Study: Human Cooperative Robots in the Production Process

Miyako Shiraishi Expert, Engine Sec., Manufacturing Dept No.1, Yokohama Plant, Nissan Motor Co., Ltd.

Detail & Speaker’s Profile

<Detail>
At the Yokohama plant, more streamlined production processes are required. Nissan designed, produced, and programmed their first human-coordinated robot that identifies issues in the field of Monozukuri Genba. Nissan's production lines by utilizing this human-coordinated robot contribute to significant improvement of productivity in Nissan's "Monozukuri Genba".

<Speaker’s Profile>

<Concurrent Conference>