NEPCON Conference 2020


Conference for latest topics in the electronics industry. AI & smart home, 5G & IoT, smart factory, 3D Packaging, FOWLP, power devices, autonomous driving, and more!

Keynote Session Pre-registration Required Early Bird Rate until December 4

NEPCON-K January, 15 (Wed) 10:30  -  12:00

AI & IoT in Smart Homes -- Practical Use & Future Prospects

  • English / Korean /
    Chinese / Japanese

Road to Smart Life

Ryosuke Akahane CEO, AIoT Cloud Inc. / Former Executive Managing Officer, BU President, IoT BU, Sharp Corp.

Detail & Speaker’s Profile

<Detail>
The utilization of IoT data is expected to create a smart life market where people, devices and services are connected. People's life issues and social problems can be improved by linking devices and services across industries. Thinking about promoting this collaboration is the path to a true smart life.

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Potential of AI & IoT at Home -- Case Study of Daiwa Connect

Yoshinori Ariyoshi Director and Managing Executive Officer, Legal Compliance and Quality Assurance, Daiwa House Industry Co., Ltd.

Detail & Speaker’s Profile

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We will propose some examples of life realized by using new technologies in relation to our past efforts in response to challenges to tackle such as demographic dynamics, change of sense of value and various natural disasters. In cooperation with our customer companies, we will endeavor to further continue to contribute to the societies.

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Special Session Pre-registration Required

NEPCON-S1 January, 15 (Wed) 13:00  -  14:30

Leading Semiconductor Companies' Next-generation Technologies

  • English / Japanese

Intelligence Accelerated: Memory's Essential Role in Autonomous Driving

Robert Bielby Sr. Director, Strategic Marketing, Automotive Div., Embedded Business Unit, Micron Semiconductor Products, Inc.

Detail & Speaker’s Profile

<Detail>
The highlight of 2020 Olympics technology will be the self-driving, autonomous vehicle. Only possible through the advent, maturation and application of artificial intelligence and specifically deep neural networks (DNN), an often overlooked, but essential, component plays a critical role in these vehicles: memory.

<Speaker’s Profile>
Robert brings a wealth of experience at the system level in architecture, strategy, vertical marketing and product planning roles. Robert has authored multiple articles on broad industry topics and holds 28 patents in the areas of channel coding, digital signal processing and programmable logic devices.

Advanced Fanout Packaging Technology

Shin-Puu Jeng Director, New Tech. Mgmt. Program, Advanced Packaging Technology and Service, Taiwan Semiconductor Manufacturing Company, Ltd.

Detail & Speaker’s Profile

<Detail>
The fanout organic interposer package is an excellent heterogeneous integration platform for high performance computing applications. Multi-layers of interconnection provide design flexibility for chiplets and HBM integration with good electrical performance, such as large eye height, low jitter, and nearly zero layer-to-layer crosstalk performance. This unique scheme, due to the flexible organic RDL layers used as a stress buffer layer to protect fine pitch Cu lines and bump joints, offers good reliability and scalability to larger and more complicated packages.

<Speaker’s Profile>
Dr. Shin-Puu Jeng is a director in TSMC. He was the recipient of National Industrial Innovation Award from the Ministry of Economic Affairs of ROC, Outstanding Engineer Award from Chinese Institute of Engineers, as well as Prolific Inventor, Best Disclosure and, more recently, Most Valuable Invention Awards from TSMC. He and his team won the Outstanding Paper Award from ECTC and several Best Paper Awards from IMPACT. He was the general chair of IITC and the executive co-chair of IMPACT. He involved in the development of TSV, interposer and fanout packages in TSMC. He received his Ph.D degree from University of Florida, and conducted his post-doctoral studies at Yale University.

NEPCON-S2 January, 16 (Thu) 10:00  -  11:30

5G Brings Industrial Revolution -- Shift from Demonstration Phase to Practical Use

  • English / Japanese

KDDI 5G & IoT Initiatives and Application to Manufacturing Industry

Kazuhiro Noguchi General Manager, 5G IoT Services Planning Dept., Solution Bussiness Planning Div., KDDI Corp.

Detail & Speaker’s Profile

<Detail>
Presentation of overview of KDDI's 5G and IoT solutions followed by further introduction of various 5G and IoT PoC and use cases and their impact on customers' business, as well as the application to manufacturing industries. Also the progress in KDDI "IoT Worldwide Architecture" that contributes to customer's overseas manufacturing business will be introduced.

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Initiative towards Co-creation Business in 5G Era

Hiroyuki Arita Senior Manager, Business Promotion, 5G & IoT Solution Office, NTT DOCOMO, Inc.

Detail & Speaker’s Profile

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We will introduce the outline of 5G, the impact of 5G on the industry.

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NEPCON-S3 January, 17 (Fri) 10:00  -  11:30

Electronic Device Industry and the Impact of the Trade Conflict on It

  • English / Japanese

Electronic Device Industry Enters into an Era of Turbulence
-- How Will Japan Compete in the Global Trade War?

Wataru Izumiya President & CEO, Sangyo Times, Inc.

Detail & Speaker’s Profile

<Detail>
The current disturbing trade friction is negatively affecting the actual economy. Nonetheless, high waves of IoT, often seen as the fourth industrial revolution, are surging everywhere in the world and going to gain momentum. Growth of AI, 5G high-speed communication, next-generation vehicles, robots, edge computing and new-generation terminals depend on innovation and mass-production of electronic devices in particular. Although it is expected that the turbulent era will continue in 2020 too, activities of some world-top Japanese manufacturers of sensor devices, power devices and capacitors will raise expectations. Some people say that nothing could be manufactured without advanced Japan-made materials. Japanese world-strongest power in materials is now attracting huge attention. The presentation will report current capital investments and product developments for semiconductors, electronic and automotive components, using his latest findings.

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NEPCON-S4 January, 17 (Fri) 12:30  -  14:00

Electronics Manufacturers' Smart Factory Strategies

  • English / Japanese

Innovation with Digitalization on Field Power

Atsuo Takemoto Executive Officer, Manufacturing Headquarters, Konica Minolta, Inc.

Detail & Speaker’s Profile

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Our aim at Konica Minolta is to continuously create new value for human society by providing solutions to our customers and assisting them in enhancing their businesses. We will share our vision of revolutionizing of the Manufacturing Technology (Monozukuri) in the era of digitalization and rapid progress of IoT technologies.

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The Way We Operate Factory in the Digital Age
-- Practical Example of Panasonic's Solutions

Atsuto Shimada General Manager, Manufacturing Process Solution Dept., Process Automation Business Div., Connected Solutions Company, Panasonic Corp.

Detail & Speaker’s Profile

<Detail>
Affordable IoT/M2M technology enables recent digital transformation in production process to maximize its customer's value. Panasonic's solution for this kind of activity is to connect each manufacturing process which was managed individually. We share the real use case in our factory to show our solution.

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NEPCON-S5 January, 15 (Wed) 15:30  -  17:00

The World’s Trend of Smart Factories and Robot Usage

  • English / Japanese

To be announced shortly

Masahiro Yoshida Senior Expert Specialist, MFE&MOM, Portfolio Development Div., Siemens DI Software, Siemens K.K.

Detail & Speaker’s Profile

<Detail>
The trend of Industry 4.0 and how Smart Factory is realized in our own factory and the efforts in domestic factories, together with their effects.

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How Digitalization Transforms Supply Chain

Atsushi Morimoto Operating Officer, Global Order Operation, Asia Pacific, GE Healthcare

Detail & Speaker’s Profile

<Detail>
GE'S Brilliant Factory initiative started reaching all GE manufacturing sites in 2016. Seven showcase sites were chosen from over 450 GE factories and Hino plant is one of them. This session provides its strategy, concept and real example of Hino factory.

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Technical Session Pre-registration Required Early Bird Rate until December 4

INTERNEPCON JAPAN

INJ-1 January, 15 (Wed) 10:30  -  12:00

Soldering Technologies for the Coming 5G Era

  • Available only in Japanese

Solder Material Development & Solution Proposal for 5G 

Shunsaku Yoshikawa Senior Researcher, Senior Manager, Solder Technical Center, R&D Engineering Div., Senju Metal Industry Co., Ltd.

Detail & Speaker’s Profile

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The environment surrounding soldering and soldering materials is changing day by day as 5G becomes full-scale. In particular, we will introduce the development of soldering materials for next-generation power semiconductors and fine connection materials of electronic devices.

<Speaker’s Profile>
In 2006, received bachelor of Metallurgy from Tohoku University, Japan.
2018- present, has been engaged in R&D Engineering Div., Senju Metal Industry Co., Ltd.

Development of Soldering Materials to Support 5G

Tetsuro Nishimura President, NIHON SUPERIOR Co., Ltd.

Detail & Speaker’s Profile

<Detail>
With the emergence of 5G come higher expectations for the performance of electronic circuitry.
The miniaturization of components means each joint is smaller so that the performance and reliability of the solder alloy is becoming more important. In this paper we will report the development of soldering materials and soldering processes for the 5G era.

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INJ-2 January, 16 (Thu) 10:00  -  11:30

Automotive Electronics for Autonomous Driving Era

  • English / Japanese

Adaptive Technology Platform for ADAS to Automated Driving Systems

Daniel Isaacs Director, Automotive Strategy & Market Development, Xilinx, Inc.

Detail & Speaker’s Profile

<Detail>
Today, Automated Driving (AD) platforms require a multitude of sensors and sensor types resulting in a flood of data. The processing of this mountain of data is mandating new vehicle system architectures. These architectures must address the management of high speed sensor data -including synchronization and pre-processing, in addition to providing the means to deliver efficient packetized workloads through low latency distribution to computational elements within the AD platform. The sensing, perception and compute engines of these systems must in turn be highly adaptable to accommodate and react appropriately to the dynamic scenarios encountered during the various levels of automated driving. Programmable technology, whether FPGA, Programmable SOC or ACAP solutions, provides an ideal flexible and scalable platform to address the adaptability necessary to meet these system challenges. This presentation provides real world examples of how adaptive technology is being used today across the varying levels of Automated Driving.

<Speaker’s Profile>
Dan is Director of Automotive Strategy in the Automotive Business Unit at Xilinx.
Also, he is the representative to the Industrial Internet Consortium, and is the co-chair of the Automotive Task Group. He has over 25 years of experience working in automotive, aerospace/defense and consumer based companies including Ford, NEC, LSI Logic and Hughes. During his career, Dan has held positions in software design, FPGA design engineer, systems engineer and system verification, applications, other technical related management. He holds degrees in Computer Engineering- EE from Cal State University, B.S. Geophysics from ASU.

Advanced Automotive Electronics and Semiconductor Strategy of Infineon Technologies

Hirotaka Kizuki Senior Manager, OEM Business Development & System Competence, Regional Center Automotive Japan, Infineon Technologies Japan K.K.

Detail & Speaker’s Profile

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Evolution of semiconductor devices is inevitable for realizing the advanced automotive systems such as autonomous driving and vehicle electrification. In this presentation, the recent trend of the advanced automotive electronics is overviewed, and discuss how semiconductors contribute the evolution of them in connection with the strategies of Infineon Technologies.

<Speaker’s Profile>
In 1988, Hirotaka Kizuki received his M.S. degree in physics from Tokyo University of Science, Japan and Joined Mitsubishi Electric Corporation where he engaged in optical and high frequency device development and business planning. During the period, he worked as a guest researcher at Heinrich Hertz Institute for Telecommunications Berlin, Germany from 1996 to 1997. In 1998, he received his Ph.D. degree in engineering from Hokkaido University, Japan. In 2004, he joined Infineon Technologies Japan K.K., and hold senior management positions of "Automotive Power" and "Powertrain & Electric Vehicle" segments. He is now the senior manager of the department of "OEM Business Development & System Competence", Infineon Technologies Japan K.K.

INJ-3 January, 17 (Fri) 10:00  -  11:30

SiC Power Device Development & Its Penetration into the Market

  • Available only in Japanese

Development of SiC Superjunction MOSFET with Extremely Low On-resistance

Shinsuke Harada Team Leader, SiC Device Process Team, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology (AIST)

Detail & Speaker’s Profile

<Detail>
Power loss reduction of power transistor has been successfully progressed by silicon carbide (SiC). For further breakthrough, we developed superjunction MOSFET in 1200 V-class where the large markets such as electric vehicle are expected, and demonstrated extremely low on-resistance and high reliability.

<Speaker’s Profile>
Ph. D in Engineering, Kyushu University (2000).
Researcher of National Institute of Advanced Industrial Science and Technology (AIST) (2004).
Team leader of Advanced Power Electronics Research Center (2014).

Solution for the Spread of SiC Power Devices

Takeshi Inoue Senior Engineer, Power Device Application Dept., Application Engineer Div., System Solutions Engineering Headquarters, ROHM Co., Ltd.

Detail & Speaker’s Profile

<Detail>
There are supply issue and cost issue relative to current power devices to further popularize SiC power devices. Challenges for using SiC power devices for high-speed switching. Introduce the company's efforts and future trends for the two points.

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IC & SENSOR PACKAGING TECHNOLOGY EXPO

ISP-1 January, 15 (Wed) 10:30  -  12:00

Technology Roadmap for the Coming IoT Society -- Trends on Cutting-edge Packaging Technology and Future Prospect

  • English / Japanese
Course Leader Chuichi Miyazaki, Chief Technical Director, Packaging Solution Center, Information and Communication Business Headquarters, Hitachi Chemical Co., Ltd.
Sub Leader Soichiro Kishimoto, Senior Executive Officer, Business Innovation Div. Head, Dexerials Corp.

IoTs Impact on Advanced Packaging: Drivers and Trends

E. Jan Vardaman President, TechSearch International Inc.

Detail & Speaker’s Profile

<Detail>
Increased connectivity everywhere, or the Internet of Things (IoT) is driving the adoption diverse packages. Different packages are used for sensors to collect data, data storage and computation, in the cloud or the edge. This presentation discusses trends and issues.

<Speaker’s Profile>
E. Jan Vardaman is president and founder of TechSearch International, Inc., a research leader specializing in advanced packaging. She authored the first reports on ball grid array packages, wafer level packaging, and predicted the rise of FO-WLP. She is a member of IEEE EPS and is a distinguished lecturer, and member of IMAPS, and SEMI. She is a columnist with "Printed Circuit Design & Fab/Circuits Assembly Magazine", and the author of numerous publications on microelectronics market and technology trends.

Chiplets Packaging Technology Roadmap Gearing Up the Evolution of AI

Toshihiko Nishio CEO, SBR Technology Co., Ltd.

Detail & Speaker’s Profile

<Detail>
5G and 400GbE infrastructure brings edge devices to the cloud are connected with high-speed networks seamlessly. AI systems and applications are enhanced getting huge big data with high data traffic. In this presentation, the perspective of the semiconductor performance requirements from the edge to the cloud are shown. Then the roadmap of chiplets package technology and their challenges to realize those requirements are explained.

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ISP-2 January, 15 (Wed) 10:30  -  12:00

Power Semiconductor Packaging Technology Trends for EVs

  • English / Japanese
Course Leader Shigeki Sako, Vice President, Automotive & Power Discrete Strategy, J-Devices Corp.
Sub Leader Keiichiro Kata, Distinguished Engineer, Production and Technology Unit, Acting Corporate Strategy & Finance Div., Renesas Electronics Corp.

Development Trend of Die Attach Materials for Power Semiconductors

Yoshie Tachibana Senior Researcher, Taguchi Lab., Senju Metal Industry Co., Ltd.

Detail & Speaker’s Profile

<Detail>
As the market for power semiconductors expands, the selection of diattach materials that affect the performance of modules is becoming multifaceted. As a solder material manufacturer, we will introduce the trend of bonding materials for power semiconductors and the latest development trends.

<Speaker’s Profile>
Graduated from Ibaraki University in March 2006. In the same year, joined Senju Metal Industry Co., Ltd. Belongs to the Technical Center, Handa Technical Center, working on Pb-free solder alloy development. He has been engaged in the development of power device bonding materials at Taguchi Laboratories since 2013.

Maximize Reliability and Power Density through Die Top System

Anton Zoran Miric Head of Product Management, Customer Solutions, Global Business Unit, Heraeus Electronics, Heraeus Deutschland GmbH & Co. KG GmbH

Detail & Speaker’s Profile

<Detail>
Die Top System (DTS®) consists of a thin copper foil with pre-applied sinter paste placed on top of the die that enable copper wire or ribbon bonding. DTS® is sintered together with the die in one step and replaces aluminum wire bonding and soldering, which are technologies limiting the reliability and current density of standard modules.

<Speaker’s Profile>
Anton Miric studied Mechanical Engineering, Foreign Trade and Sales & Marketing Management and works at HDE-HET-Material Solution House in Germany as Vice President Product Management - focus of the activity are Materials Solutions for power electronics.

ISP-3 January, 15 (Wed) 15:30  -  17:00

Heterogeneous 3D Integration Technologies Becoming Full-scale

  • English / Japanese
Course Leader Chiaki Takubo, Technology Executive, Package and Test Technology, KIOXIA Corp.
Sub Leader Chuichi Miyazaki, Chief Technical Director, Packaging Solution Center, Information and Communication Business Headquarters, Hitachi Chemical Co., Ltd.

Coming Three-dimensional Large-scale Integration from Conventional Scaling Limits

Takayuki Ohba Professor, The WOW Alliance, Heterogeneous and Functional Integration Unit, Tokyo Institute of Technology

Detail & Speaker’s Profile

<Detail>
A promising approach to overcome conventional two-dimensional (2D) scaling problems is to combine 3D (z-direction) stacking with 2D scaling. For the Tera-byte memory capacity and Tera-byte bandwidth without sacrificing power efficiency, 3D integration technology achieved by using bumpless TSV interconnects and ultra-thinning of 300 mm wafers will be presented.

<Speaker’s Profile>
Fujitsu Limited 1984, The Univ. of Tokyo 2004, Prof. of Tokyo Institute of Technology 2013. Visiting Professor of NCTU Taiwan and Ph.D. from Tohoku Univ. in 1995.

Current Status and Future Outlook of Room Temperature Bonding for Heterogeneous-integration of Future Devices

Tadatomo Suga Professor, Collaborative Research Center, Meisei University / Professor Emeritus, The University of Tokyo

Detail & Speaker’s Profile

<Detail>
The surface activated bonding (SAB) has been developed for heterogeneous bonding between different materials at room temperature, attracting increasing interest due to its simple process flow, no need for additional intermediate materials for bonding, and compatibility with CMOS technology. Recent development and future outlook will be summarized for the new field of hetero-integration for 3D, flexible and power electronics.

<Speaker’s Profile>
He joined the Max-Planck Institut für Metallforschung in 1979 after getting a master's degree from Tokyo University and received the Ph.D. degree in materials science from University of Stuttgart in 1983. Since 1993, he has been a professor at the Department of Precision Engineering of the School of Engineering. In March 2019, he retired from the University of Tokyo and joined Meisei University as a professor of the Collaborative Research Center on April 1. 2019.

ISP-4 January, 16 (Thu) 12:30  -  14:00

FO-PLP towards Next Level: Heterogeneous Integration

  • English / Japanese
Course Leader Keiichiro Kata, Distinguished Engineer, Production and Technology Unit, Acting Corporate Strategy & Finance Div., Renesas Electronics Corp.
Sub Leader Shigeki Sako, Vice President, Automotive & Power Discrete Strategy, J-Devices Corp.

Development of Fan-out Panel Level Packaging for Mobile Application

Doohwan Lee Director and Principal Eng., PLP Development Team, Samsung Electronics Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Samsung fan-out panel level packaging (FOPLP) utilizes panel with 2.5 times larger working size, which enables higher production efficiency and lower cost than the 12" wafer level packaging. This FOPLP technology was successfully implemented in a AP package for wearable application. Utilizing 7/8um RDL, 20um via, PoP stack pitch of 0.15mm, and die-backside RDL, FOPLP provides packaging size minimization (25%) compared to the conventional technology (1.4 times increase in battery life). The reliability has been thoroughly investigated and production yield is similar to the conventional package.

<Speaker’s Profile>
Doohwan Lee is currently the group leader of the Product Development Group working on the development of FOPLP at Samsung Electronics. After receiving his Ph.D. in electronic engineering from Tohoku University, he joined Samsung where he developed component embedded substrates for 12 years. He then went on to work on FOPLP product development where he has been working as a group leader for the past 4.5 years.

Packaging Innovations for Silicon Scaling and Heterogeneous Integration

David Fang CTO, Vice President, Package Research & Development, Assembly Engineering & Operations, Powertech Technology Inc.

Detail & Speaker’s Profile

<Detail>
Moor's law is slowing down but Si scaling will continue. More function will be integrated into SoC with advanced wafers node. Chip is getting small and I/O pitch becomes smaller by Si scaling. Traditional organic substrate couldn't handle fine I/O pitch. Industry is developing novel advanced chip carrier to support Si scaling. This article will introduce a variety of chip carriers and their advantage and disadvantage. Panel level FO technology could build RDL substrate with fine line and space. It might be one of advanced chip carriers for heterogeneous integration. The latest panel level FO development status will be updated. Processor and memory will be integrated in a package to improve system performance. HBM is indispensable for embedded memory of HPC. 3D stack with TSV interconnect is used for HBM cube assembly. Conventional testing method couldn't meet HBM requirement. Have to develop unique memory testing for HBM. The presentation will point out not only the challenge of assembly and testing but also address the solution based on OSAT point of view.

<Speaker’s Profile>
David Fang joined PTI in 1999 as Manager of Package Development. Since then, he has established packaging R&D capability and set up an R&D Lab, and held various positions in engineering and R&D. In 2015 he was promoted to CTO, heading up corporate R&D. Before joining PTI, David held managerial positions with several semiconductor companies. He has been granted and pending 50 patents.

ISP-5 January, 16 (Thu) 15:00  -  16:30

Integration Realised by Embedded Packaging Technologies

  • English / Japanese
Course Leader Soichiro Kishimoto, Senior Executive Officer, Business Innovation Div. Head, Dexerials Corp.
Sub Leader Tsutomu Sekiya, Director, General Manager, Tokyo Sales Branch, Sales Div., C. Uyemura & Co., Ltd.

SESUB - Its Leadership in Embedded Die Packaging Technology

Toshikazu Endo Manager, Products Planning Subsection, Functional Substrate Section, Package & Foundry BD, Electronic Components BC, TDK Corp.

Detail & Speaker’s Profile

<Detail>
Introduce concept of TDK's die embedding SESUB technology and its core benefits and features. An overview of the latest quality indicators will be highlighted to prove this technology maturity in high volume manufacturing. Lastly, examples of product for possible leverage of this technology will be presented.

<Speaker’s Profile>
Education: Tokyo Denki University
Experience: Engineering Manager 10+ years in TDK for SESUB technology
Design team Manager 5+ years in TDK (Japan)
Technical Manager & FAE 4+ years in TDK Corporation in America
Technical Manager 1+ year in TDK (Japan)

The Features and Applications of Embedded Device Package, MCeP®

Yasushi Araki Senior Manager, IC Assembly Div., Shinko Electric Industries Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Along with miniaturization and high functionality of electronics, a variety of embedded device substrates and packages have been developed by various companies. We have also been developing an embedded device package named MCeP, Molded Core embedded Package. We started high volume production from 2014.

<Speaker’s Profile>

ISP-6 January, 16 (Thu) 15:00  -  16:30

Evolution of Sensors Paving the Path for Future Mobility

  • English / Japanese
Course Leader Sumitoshi Asakuma, Director & Senior Managing Executive Officer, Sumitomo Bakelite Co., Ltd.
Sub Leader Kulicke and Soffa (Japan) Ltd.

Sensor Technology Trends and Software Development Ecosystem to Increase the Value of Automobiles

Tsuguo Nobe Chief Advanced Service Architect and Director, Business Development, Government and Policy Group, Intel K.K. / Visiting Associate Professor, Nagoya University

Detail & Speaker’s Profile

<Detail>
Most automobiles will become connected and new added value will be expanded through the integrated use of various external and internal embedded sensors. MaaS is an example and similar solutions are expected to be released with various services and products. Such an overview and future developments will be examined.

<Speaker’s Profile>
Joined NEC in 1983. Established IBM compatible PC business in the US and Europe, and then in 1997 introduced the global standard PC architecture also in Japan. In 2001, was named CEO for Japan subsidiary of the world's largest online game company. Thought that the technology of online game, MMORPG, could be applied for Telematics and joined NISSAN in 2004. Since then, managed the integration of Information and Communication Technologies for vehicles and EV-IT was awarded the Best Mobile Innovation for Automotive and Transport at GSMA MWC 2011. In 2012, joined Intel to define and promote the globally standard architecture with emphasis on Connected Cars and Automated Vehicles. Recently, put more emphasis on integrating Artificial Intelligence and Deep Enforced Learning to accelerate the development of Autonomous Cars. Since 2014, added a position as Visiting Associate Professor at Nagoya University.

Highly Innovative, Safety Focused LiDAR Solutions and Opportunities
in the Standardization of their Features and Validation

Mircea Gradu Senior Vice President Product Management and Quality, Velodyne Lidar, Inc.

Detail & Speaker’s Profile

<Detail>
More than 90% of the newly produced vehicles include Advanced Driver Assist Systems offering features like Automated Emergency Braking, Adaptive Cruise Control and Lane Keep Assist. These continuously improving vehicle systems greatly increase driving safety and contribute significantly to the reduction of deaths and injuries on roadways. Velodyne Lidar offers multiple ADAS sensing solutions and this presentation covers their technical characteristics, along with the methods used to validate their performance, reliability and durability. A new, comprehensive set for rating the ADAS feature performance is introduced and proposed for standardization, with the goal of offering consumers an easy way for comparing system performance between vehicle models and for clearly understanding their true capabilities and limitations.

<Speaker’s Profile>
Mr. Mircea Gradu, Ph.D. is Senior Vice President of Product Management and Quality at Velodyne Lidar. He leads Velodyne Lidar to design, develop and manufacture world-class products compliant with the international quality standards.
Mr. Gradu is an Officer of SAE International and the 2018 President and Chairman of the Board.
With over 25 years of experience in the automotive and commercial vehicle industry, Mr. Gradu started his career at Daimler-Benz AG in Stuttgart, Germany, served as Vice President of Transmission Powertrain and Driveline at Fiat Chrysler Automobiles and prior to Velodyne led Engineering and Quality at Hyundai Motor America.
An SAE Fellow Mr. Gradu has been awarded 56 patents on mechatronic automotive systems, published over 40 technical papers, was honored with the SAE Edward N. Cole Award for Automotive Engineering Innovation and listed among the 50 most influential Automotive Executives by Motor Trend, being credited with the revival of the rear-wheel-drive automotive platforms through the introduction of the novel and fuel efficient transmission solutions. He holds a master's degree in mechanical engineering from the Polytechnic Institute of Bucharest and a doctorate in mechanical engineering from the Technical University of Stuttgart, Germany.

ISP-7 January, 17 (Fri) 10:00  -  11:30

Autonomous Driving: Latest Technologies and Challenges

  • English / Japanese
Course Leader Tsutomu Sekiya, Director, General Manager, Tokyo Sales Branch, Sales Div., C. Uyemura & Co., Ltd.
Sub Leader Naohiko Hirano, Head of Business Unit, Sensor Business Unit, DENSO Corp.

Technical Challenges toward Mobility for All

Shinichiro Tanaka Professional Partner, Automated Driving System Development Project, Automated Driving & Advanced Safety System Development Div., Toyota Motor Corp.

Detail & Speaker’s Profile

<Detail>
Our technical challenges beyond 2020 toward mobility for all based on latest outcome of stakeholders.

<Speaker’s Profile>

Enabling Autonomous Driving by NVIDIA End to End AI Solution

Masaru Hamada Director, Japan Automotive, NVIDIA

Detail & Speaker’s Profile

<Detail>
To be announced shortly

<Speaker’s Profile>

ISP-8 January, 17 (Fri) 12:30  -  14:00

Latest Trends of Technologies for 5G and High-speed Communication

  • English / Japanese
Course Leader Kulicke and Soffa (Japan) Ltd.
Sub Leader Sumitoshi Asakuma, Director & Senior Managing Executive Officer, Sumitomo Bakelite Co., Ltd.

5G Enablement through Highly Integrated Electronic Packaging

Rajneesh Kumar Principal Engineer & Manager, SIP & Module Packaging Technology, Qualcomm Inc.

Detail & Speaker’s Profile

<Detail>
As 5G is gaining traction for next generation of mobile connectivity, new packaging challenges have surfaced in mobile and infrastructure connectivity devices. Module/SIP packaging technology gives an opportunity to integrate multiple functionalities into dense packaging and hence enabling delivery of compact form-factor, without compromising performance.

<Speaker’s Profile>
Rajneesh Kumar is a Principal Engineer and Manager at Qualcomm Incorporated. He currently leads successful development and new product introduction (NPI) team focused to deliver SIP/Module Packaging solutions for 5G and beyond. Rajneesh has 14 years of experience in microelectronics packaging, has over 25 issued patents in the field and holds Ph.D. in Materials Science & Engineering from Pennsylvania State University.

Module Technology to Realize 5G

Hisao Hayafuji General Manager, Network Technology Development Dept., Engineering Group Module Business Unit, Murata Manufacturing Co., Ltd.

Detail & Speaker’s Profile

<Detail>
For 5G, not only Sub6 but also millimeter wave has been introduced in each country.
In this presentation, we will explain the features of millimeter-wave modules and the necessary elemental technologies such as substrate technology, mold technology, and antenna technology.

<Speaker’s Profile>

PWB EXPO

PWB-1 January, 15 (Wed) 15:30  -  17:00

FPC Evolution Driven by 5G -- Trends in 5G Smartphone Technology and the Latest Display Market

  • Available only in Japanese
Course Leader Hirofumi Matsumoto, Fellow/Senior Advisor, Nippon Mektron, Ltd.
Sub Leader Hiroshi Iinaga, General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.

Jisso Technology of 5G Smartphones and New Role of FPC

Hirotaka Ueda Representative, Semi Consult

Detail & Speaker’s Profile

<Detail>
The era of 5G communication has come in 2019. The mmWave smartphones have to handle high-frequency radio. One solution for high-frequency radio system is an Antenna in Package(AiP). Between AiP and main board, FPC cable need to handle around 10GHz signals. So the FPC cable must meet this requirements. What must FPC cable be?

<Speaker’s Profile>
With the technology development at the semiconductor package materials maker as a start, I had been in charge of quality control and the semiconductor package development since 1981. Making use of experience as a quality inspector to the famous manufacturers of the world and the technology development engineer at Sumitomo, Motorola, Mitsui High-Tec, and Amkor, I have established a technology consultant company in 2002 and have managed it to the present.

Outlook on Smartphone Industry from the Viewpoint of Value Chain incl. FPD

Yasuo Nakane Global Head of Technology Research/Senior Analyst, Equity Research Dept., Mizuho Securities Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Analysis on smartphone industry from different viewpoints such as display (technical perspective including OLED/LCD and foldable display), camera (progress in function), 3D sensing module, exterior appearance, and case.

<Speaker’s Profile>

PWB-2 January, 15 (Wed) 15:30  -  17:00

Challenges towards Finer and Higher Functional Wiring Board

  • English / Japanese
Course Leader Takayuki Suzuki, Manager/PWB Materials, PWB Materials Business Sector, Advanced Performance Materials Business Headquarters, Hitachi Chemical Co., Ltd.
Sub Leader Kiyotaka Komori, Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co., Panasonic Corp.

Material and Technology Introduction for High Density Printed Wiring Board

Masahisa Ose Manager, Laminate Materials R&D Dept., Information and Communication R&D Center, Information and Communication Business Headquarters, Shimodate Works, Hitachi Chemical Co., Ltd.

Detail & Speaker’s Profile

<Detail>
A wide variety of IoT Devices will come in the market by the 5G practical realization and need to develop smaller and thinner Printed Wiring Board. In this presentation, we will report on the materials and technology trends about high density printed wiring boards and fine line pattern fabrication.

<Speaker’s Profile>
Joined Hitachi Chemical Co., Ltd. in 1994. Experience as development engineer of High Tg halogen-free laminate, Low CTE laminate and primer material for Fine line pattern fabrication. Manager of Laminate Materials R&D since 2018.

Possible Solutions for Finer MSAP Pattern

Yi-Ho Chen Director, Product Management, Zhen Ding Technology Holding Ltd.

Detail & Speaker’s Profile

<Detail>
MSAP is the latest technology to make top tier HDI PCBs for mobiles or other portable electronic devices lighter and thinner. To make lines or patterns finer by MSAP is a complicated engineering task. High reliability and high yield are the essential fulfillment for pushing MSAP road map forward. There are different approaches such as materials, equipment and designs to make MSAP pattern finer. Some possible solutions will be introduced in the speech.

<Speaker’s Profile>
Yi-Ho Chen, MS of Electrical Engineering and PhD of Mechanical Engineering, has 20 years experience in PCB related industries and was in charge of different functional departments, such as R&D, manufacturing, sales and product management. He has joined Avary since 2013 and participated the mSAP (SLP) project from the earliest stage. He is the director of mSAP Product Management.

PWB-3 January, 16 (Thu) 10:00  -  11:30

Latest Trend of Ultra-high-speed Modules -- 6G Package Roadmap and 5G Smart Phone Disassembly

  • Available only in Japanese
Course Leader Koji Ikawa, Chief Engineer (Qualified as 1st Grade of PWB Design Engineer), Research Engineer, Technical Development Div., CMK Corp.
Sub Leader Hiroshi Kondo, Principal Engineer, Jisso Technology Development Div., Processing Process Development Center, Production Engineering Headquarters, Canon Inc.

Package Technology Roadmap toward the Next-generation 6G Mobile and 1.6TbE High Speed Network

Toshihiko Nishio CEO, SBR Technology Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Prior to the start of 5G, 400GbE was introduced with a transmission speed of 50Gbps in the core network. In 2024, the next-generation communication specification of 1.6TbE, which will be four times the performance, is expected to be enacted, but there are many challenges to achieve. In this lecture, we will explain the package technology roadmap for next-generation communication.

<Speaker’s Profile>

The New Trend of the 5G Smartphones in 2019

Hiroharu Shimizu CEO, TechanaLye Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In 2019, a lot of 5G smartphones were released from the world's top vendors. We analyzed the boards and chips in the products and today report new trend of structures and systems of the 5G smartphone.

<Speaker’s Profile>

PWB-4 January, 16 (Thu) 10:00  -  11:30

Beyond 5G -- Substrate Materials and Challenges towards 6G

  • Available only in Japanese
Course Leader Hiroshi Iinaga, General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.
Sub Leader Hirofumi Matsumoto, Fellow/Senior Advisor, Nippon Mektron, Ltd.

Low Loss Material for High-speed Communication

Yoji Nakajima Vice President of Global Technology and Strategy, AGC Nelco

Detail & Speaker’s Profile

<Detail>
Next-generation communication system will be supported by high-frequency and high-speed communication technology using such as 5G and high-speed servers. Many technological innovations are required to achieve high-frequency and high-speed communications, and low loss CCL is required. In this presentation, I will introduce our efforts to develop low loss CCL.

<Speaker’s Profile>
In 2004, after obtaining Ph.D, joined AGC and assigned to research center. Since 2015, had been engaged in the launch of new business areas centered on low loss materials at planning department in AGC head office. In 2018, received Master of Management of Technology (MOT). Currently has engaged in global R&D promotion and strategic planning at AGC Nelco (head office at AZ, USA).

The Fluoropolymer Copper-clad Laminate for Millimeter-wave Band

Takaoki Maeyama Manager, Product Development Sect., Technical Development Dept., Chukoh Chemical Industries, Ltd.

Detail & Speaker’s Profile

<Detail>
Chukoh Chemical Industry Ltd. has fluoropolymer processing as our core technology, and fluoropolymer copper-clad laminate is one of the our products. This time, we will introduce the structure and characteristics of the low-loss copper-clad laminate for millimeter-wave band using fluoropolymer with the top-class low-loss characteristics among plastic materials.

<Speaker’s Profile>

What is the Problem with Printed Circuit Boards in the 100GHZ

Hiroshi Iinaga General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In order to increase the transmission speed in 6G that will definitely arrive,-widen the band-improve efficiency-change the modulation method, etc.
Necessary technology comes out.
In this situation, the use of higher frequencies will continue. The printed wiring board at 100GHZ is
What will happen? )

<Speaker’s Profile>
Since joining the company, the company has developed and mass-produced high-layer build-up flex rigid parts. Currently, as the head of the design headquarters, engaged in high-speed SIM, board design, etc.

PWB-5 January, 16 (Thu) 15:00  -  16:30

Wireless Electric Power Transmission to Mobile Objects -- Key to the Power Electronics Evolution

  • Available only in Japanese
Course Leader Hiroshi Kondo, Principal Engineer, Jisso Technology Development Div., Processing Process Development Center, Production Engineering Headquarters, Canon Inc.
Sub Leader Koji Ikawa, Chief Engineer (Qualified as 1st Grade of PWB Design Engineer), Research Engineer, Technical Development Div., CMK Corp.

Development of Wireless In-wheel Motor with In-motion Charging

Hiroshi Fujimoto Associate Professor, Dept. of Advanced Energy, Graduate School of Frontier Sciences, / Associate Professor, Dept, of Electrical Engineering, Graduate School of Engineering, The University of Tokyo

Detail & Speaker’s Profile

<Detail>
In-motion wireless charging technology can drastically extend driving range of electric vehicles. In this talk, the 2nd and 3rd generation Wireless In-Wheel Motors (WIWMs) are introduced. The experimental results are demonstrated by EV with WIWMs to show the effectiveness of dynamic wireless power transfer.

<Speaker’s Profile>
Hiroshi Fujimoto received the Ph.D. degree from the University of Tokyo in 2001. After Nagaoka University of Technology, Purdue University, and Yokohama National University, he became an associate professor of the University of Tokyo since 2010. His interests are in control engineering, electric vehicle control, and wireless power transfer.

Wireless Power Supply for Industrial Equipment and Forthcoming Challenges

Yoichi Kyono Group Manager, WPT Development Group, System Power Supply Dept., R&D Div., TDK-Lambda Corp.

Detail & Speaker’s Profile

<Detail>
Introduce some examples of wireless power supply for industrial equipment, that be attracted attention recently, and forthcoming challenges for their spread.

<Speaker’s Profile>

PWB-6 January, 17 (Fri) 12:30  -  14:00

Evolution by 5G Communication, Latest Trend of Autonomous Driving, Electrification and PCB Technology

  • English / Japanese
Course Leader Mitsuaki Toda, Executive Officer, General Manager, 5G Product Planning and Development Dept., Engineering Headquarter,, Meiko Electronics Co., Ltd.
Sub Leader Kiyotaka Komori, Assistant General Manager, Yokkaichi Circuit Board Material Dept., Circuit Board Materials Business Unit, Electronic Materials Business Div., AIS Co., Panasonic Corp.

Autonomous Driving and Electrification:
Impact on PCB Technology and Reliability Requirement

Sebastian Maass Head of PCB Development APAC, PCB Technology Development, Automotive Electronics, Robert Bosch Co., Ltd.

Detail & Speaker’s Profile

<Detail>
In this presentation automotive mobility trends are described and directions for future PCB products are shown. Particular emphasis is on the reliability aspect in order to raise awareness among PCB manufacturers including their supply chain.

<Speaker’s Profile>
2013-2019 Robert Bosch GbmH Germany, Automotive Electronics, responsible team leader for PCB materials and reliability. Since Oct 2019 Robert Bosch Co., Ltd. Hong Kong, Automotive Electronics, Head of PCB development APAC

PCB Technology Trend for 5G, Autonomous Driving and Electrification

Mitsuaki Toda Executive Officer, General Manager, 5G Product Planning and Development Dept., Engineering Headquarters, Meiko Electronics Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Due to realization of 5G communication, various technology innovations are beginning in communication and automotive industry. Given this situation, new applications appear and autonomous driving and electrification are accelerated.
Meiko presents PCB Technology trend to realize this innovation.

<Speaker’s Profile>
Joined JVC in 1988 and transferred to Meiko by the business transfer in 2008.
Has been engaged in the technology development & new production launch of embedded devices, fine pattern, Anylayer and automotive PCB.

Exhibitors' Presentation Free / No Registration Required

Exhibitors will give presentations about the latest products/technologies.

>> Program

No registration required.
Please go to the venue (inside exhibition hall) directly.
Please note that some presentations might be given only in Japanese.

Concurrent Conferences Pre-registration Required Early Bird Rate until December 4

AUTO-K January, 15 (Wed) 10:30  -  12:00

Technology-driven Mobility Can Enrich People’s Lives

  • English / Korean /
    Chinese / Japanese

The Evolution of Advanced Technology:
How We Are Shaping the Future of Our Mobility Society

Kunio Nakaguro Executive Officer, Executive Vice President, Nissan Motor Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Expectations towards the automotive industry are widening to address not only social issues such as an aging population and urbanization, but also needs as society becomes more connected to vehicles. This session explores the direction and benefits advanced technologies are taking society towards the future of mobility.

<Speaker’s Profile>
Nakaguro joined Nissan Motor Co., Ltd.(NML) in 1987, following his graduation from the faculty of science and engineering at Waseda University in Tokyo. He has held various executive positions in engineering, research and development, and information technologies for NML in Japan, Europe, and North America. He serves as executive vice president, leading global research and development for all products under the Nissan, Infiniti, and Datsun brands.

Honda's Approach to Serve People Worldwide
with the "Joy of Expanding their Life's Potential"

Yoshiharu ltai Managing Director, Chief Operating Officer, Life Creation Center, Honda R&D Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Even in times when society is changing drastically and various values are swirling, Honda creates technologies and products creating the "future" of life and bringing "usefulness" and "joy" to a higher level, under the universal idea serving people worldwide with the "joy of expanding their life's potential".

<Speaker’s Profile>

AUTO-S1 January, 15 (Wed) 13:00  -  14:30

Mega-suppliers' Strategy for Connected, Autonomous, Sharing & Electric Vehicle Technology

  • English / Japanese

DENSO's Approach to a New Mobility Society

Yoshifumi Kato Senior Executive Officer, Engineering Research & Development Center, DENSO Corp.

Detail & Speaker’s Profile

<Detail>
In this session, we will introduce DENSO's activities and technologies regarding the future mobility society image that DENSO considers, and the autonomous driving and digital twin technologies that support them.

<Speaker’s Profile>

Our Strategy Towards MaaS and Future Mobility System

Klaus Meder President & Representative Director, Bosch Corp.

Detail & Speaker’s Profile

<Detail>
Automotive industry is heading to an era of reshaping the world of transportation.
Adapting product portfolio and business model are essential to remain as a key player in the field.
Bosch is leading this change by providing various solutions of mobility system and technology.

<Speaker’s Profile>
Klaus Meder has various and long experiences in engineering in Bosch.
One of his noteworthy experiences is that he resided in Japan for 5 years, when he was Vice President in charge of Engineering, Quality and Manufacturing of Automotive Electronics Japan from 1996 until 2000. After various positions with the division Chassis Systems, he became President of Automotive Electronics of Robert Bosch GmbH in January 2012. Since July 2017 he has been President and Representative Director of Bosch Corporation in Japan.

Speech Title: To be announced shortly

Bert Wolfram President, Chief Executive Officer, Continental Automotive Corp.

Detail & Speaker’s Profile

<Detail>
To be announced shortly

<Speaker’s Profile>

AUTO-1 January, 15 (Wed) 15:30  -  17:00

Practical Application of Autonomous Driving -- From Highway to Downtown

  • English / Japanese

Nissan Intelligent Mobility
-- Autonomous Driving Technology Development of Nissan

Takashi Sunda Deputy General Manager, HMI Development Group, AD/ADAS Advanced Technology Engineering Dept., EE and Systems Engineering Div., Nissan Motor Co., Ltd.

Detail & Speaker’s Profile

<Detail>
Nissan continues to provide new experiences to customers through "Nissan Intelligent Mobility". "Intelligent drive", one of its pillars, aims at "More confident" through advanced driver assistance technology. The ProPILOT 2.0 launched in Autumn 2019 is the symbol of that. This time, evolution and development of driver assistance together with core technologies will be introduced.

<Speaker’s Profile>

Towards Realization of Automated Driving System Cooperating
with Other Traffic Participants

Yuji Yasui Chief Engineer, Safety & Secure feeling, Innovative Research Excellence, Honda R&D Co., Ltd.

Detail & Speaker’s Profile

<Detail>
An automated driving system has to understand intentions of other traffic participants, predict various risks and act appropriate behavior in order to realize safe and comfortable driving like that of an experienced driver, when its driving condition is expanded from high-ways to surface streets in urban areas, etc. Honda is researching AI and advanced control technologies to realize aforementioned intelligent automated driving system, and introduces them in this conference.

<Speaker’s Profile>
Yuji Yasui joined Honda Motor Co., Ltd. In Honda R&D Co, Ltd., he researched and developed powertrain systems for low-emission and low-fuel consumption vehicles by using robust control, adaptive control and neural networks. He has been involved in research of automated driving system using AI (artificial intelligence) and advanced control technologies since 2016

AUTO-8 January, 17 (Fri) 10:00  -  11:30

Next-generation E/E Architecture: Its Technological Evolution

  • English / Japanese

Adaptive AUTOSAR Is on the Road
-- Challenges and Experiences for Series Development at Volkswagen

Marcel Wille Head of Software Platform Standards, Volkswagen AG

Detail & Speaker’s Profile

<Detail>
Digitalization is changing the automotive industry dramatically. The smart vehicle becomes an integral part of the digital world. It consistently increases performance and functionality via updates. This requires new approaches with respect to electronic architectures, SW-platforms and communication paradigms heavily influenced by technologies established for long time in software industry and consumer electronics. Volkswagen will introduce those approaches in its new electrical car platform MEB. It comes along with a centralized functional architecture, the introduction of the Adaptive AUTOSAR software platform and service-oriented communication. With this combination of a new architectural approach, an AUTOSAR standard that was under development and never proven in use and unknown impact of service-oriented communication in such an environment a couple of challenges has been mastered. The presentation explains challenges and experiences with respect to system performance, handling of inconsistencies in an emerging AUTOSAR standard, limitations of service-oriented communication in interaction between embedded systems and Adaptive AUTOSAR as well as portability of applications.

<Speaker’s Profile>
Dr. Wille studied computer science at Clausthal University of Technology. After a work stay at Intershop Communication AG, he received his PhD in the area of automotive communication networks. In 2008 Dr. Wille joined Volkswagen. 2011 he took over responsibility for AUTOSAR at Volkswagen and represents the Volkswagen group in the AUTOSAR project leader team. Since 2017 he is team lead for Software Platform Standards.

E/E Architecture Trends and Power Net Solutions

Aleksandar Duric RBU Body Electronics General Manager & Body Electronics Gr. 1 Section Manager, Automotive Electronics Japan, Bosch Corp.

Detail & Speaker’s Profile

<Detail>
Several trends like autonomous driving and connected cars sparked a big discussion several years ago about expected disruptive changes within the automotive industry, including the need to change the E/E architecture. This speech gives an update on current E/E trends and power net solutions.

<Speaker’s Profile>
Aleksandar Duric has 10 years experience in Bosch Automotive as project leader for car multimedia projects and head of the competence center for displays. He joined the body electronics div. in 2017 and is since 2019 responsible for the regional business unit body electronics in Japan.

System Approach for Optimal E/E Architecture to Solve Future Complexity

Hagen Boehmert Head of Systems Engineering Japan/Korea, Advanced Technology, Systems Engineering, Systems & Technology, Continental Automotive Corp.

Detail & Speaker’s Profile

<Detail>
Mobility is the heartbeat of life. Continental's seamless mobility solutions will use novel technologies in eco-friendly ways while honoring Continental's Vision Zero for safety. The ever-increasing complexity arising from multi-faceted stakeholder needs can be mastered by "systems thinking" -- thus enabling well-balanced future E/E architectures.

<Speaker’s Profile>
Hagen Boehmert received his diploma in Electrical Engineering and Information Technology from the University of Applied Sciences and Arts in Hanover in 2007 before working within the automotive industry (focus on verification and validation) in Michigan, USA. After his return in 2010 he was employed as safety engineer for series development of chassis components before switching to Continental in 2013 as functional safety manager for automated driving. Since 2017 his responsibility increased into systems engineering and within his role he builds up the knowhow as well as the team in Yokohama, Japan.

AUTO-M2 January, 16 (Thu) 12:30  -  14:00

To Realise Japanese MaaS: Effort and Future Road Map

  • English / Japanese

Multi-Modal Mobility Service "my route" for the Cities of Future

Nariaki Amano Deputy General Manager, Future Project Dept., Group Manager, Innovation Group, Toyota Motor Corp.

Detail & Speaker’s Profile

<Detail>
Toyota Motor Corp. (Toyota) conducted trials of the multi-modal mobility service "my route" for smartphones with Nishi-Nippon Railroad Co., Ltd. (Nishitetsu) in Fukuoka City, in collaboration with eight service providers for traffic, shop, and event information. In this presentation, we introduce the background of this activity and show some initial results to discuss the feasibility of multi-modal mobility service.

<Speaker’s Profile>

Mobility Innovation

Minoru Uemura Director, Business Promotion Dept., MONET Technologies Inc.

Detail & Speaker’s Profile

<Detail>
Talking about the role of Monet Technologies Inc. which started in the fall of 2018, its social significance, and the MaaS business development concept.

<Speaker’s Profile>

<Concurrent Conference>