NEPCON NAGOYA Conference 2020


Sony’s vision towards the future of image sensors, Mirise Technologies’ in-vehicle semiconductors development for the CASE era, remarkable technologies going beyond 5G – towards 6G – and more!

Keynote Session Pre-registration Required

NEPCON-K
October, 21 (Wed) 12:00  -  13:00

Sony's Strategy on Image Sensors

  • English/Japanese

The Future of Imaging and Sensing Technology by Sony

Terushi Shimizu Senior Executive Vice President, Officer in charge of Imaging & Sensing Solutions Business, Sony Corp. / Representative Director, President and CEO, Sony Semiconductor Solutions Corp.

The date of the session is changed from Thursday 22nd to Wednesday 21st.

Detail & Speaker’s Profile

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Image sensor, which is currently growing mainly in mobile filed, is also expected to be widely used in various market such as FA, surveillance and automobile in future. Will illustrate some activities of Imaging and Sensing technologies by Sony, which is No.1 company in revenue share in image sensor market, and its future direction.

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Special Session Pre-registration Required

NEPCON-S1 October, 21 (Wed) 10:30  -  11:30

New Material Development with AI

  • Available only in Japanese

Development of Materials Informatics Platform

Yasumitsu Orii Executive Officer, New Value Creation Office, General Manager, NAGASE & Co., Ltd.

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This Session will be given only in Japanese.

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NEPCON-S2 October, 21 (Wed) 13:00  -  14:30

Leading Semiconductor Companies' Next-generation Technologies

  • English/Japanese

Automotive Semiconductor Trend for CASE

Yasushi Shinojima Corporate Officer, MIRISE Technologies Corp.

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"CASE" (Connected, Autonomous, Shared, Electrified) has become the basic strategy of automotive industry.
Semiconductor devices, especially power devices, vehicle periphery sensors, and SoC are key technologies for CASE.
In this talk, development trend of these technologies will be shown.

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Heterogeneous Integration: Applications Driving Material and Process Diversity

Thorsten Meyer Lead Principal, Package Concept Engineering, Infineon Technologies AG

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Heterogeneous Integration is a major technology driving force for microelectronic systems. It refers to the integration of separately manufactured components into a higher level of assembly, which is providing enhanced functionality and operating characteristics. The requirements for integration of different applications are differing strongly. Heterogeneous integration combined with miniaturization capability will drive us in future microelectronics in all areas of application.

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Thorsten Meyer is Lead Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package concepts. He received his diploma from the Friedrich-Alexander-University of Erlangen, Germany. Thorsten is author of multiple publications and holds more than 150 patents and patent applications in the area of advanced packaging.

NEPCON-S3 October, 22 (Thu) 9:30  -  11:00

Moving towards 6G! Unveiling Challenges and a New World

  • Available only in Japanese

5G Evolution and 6G

Takehiro Nakamura Senior Vice President, General Manager of 6G Labs., NTT DOCOMO, Inc.

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This Session will be given only in Japanese.

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Japan, World Approach for Beyond 5G

Hiroshi Fujiwara Chairman & President, CEO, BroadBand Tower, Inc. / President, Internet Association Japan

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This Session will be given only in Japanese.

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NEPCON-S4 October, 22 (Thu) 14:30  -  16:00

The Latest Trends in Electronics Industry

  • Available only in Japanese

Electronic Devices Will Lead the Post-COVID-19 World Economy: Explosive Growth of 5G, Data Centers, Core Networks, Semiconductors, etc. Expected

Wataru Izumiya President & CEO, Sangyo Times, Inc.

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This Session will be given only in Japanese.

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NEPCON-S5 October, 23 (Fri) 15:00  -  16:30

Forefront of In-vehicle Electronics Packaging

  • English/Japanese

Voids in SMT Solder Joints --Trends in Automotive Electronics
Sponsor Companies: IPC, JAPAN UNIX

Udo Welzel Senior Expert, Automotive Electronics - Engineering Technology Integration, Robert Bosch GmbH

Detail & Speaker’s Profile

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A discussion on acceptable voiding levels in solder joints of electronic assemblies is in full blast in various industries including automotive electronics. This work, outlining consensus found within a working group of the German Electrotechnical Commission (DKE) among various stakeholders in the automotive electronics supply chain, may be used as a starting point in discussions among other stakeholders concerned.

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With a profound background in physics (diploma), chemistry and materials science (doctoral degree), Udo joined the Automotive Electronics Division of the Robert Bosch GmbH in 2012, where he now serves as a senior expert and leads a team responsible for Assembly and Interconnect Technology Integration for Automotive Electronic Control Units for Driving Assistance and Autonomous Driving Systems. He has wide expertise in standardization activities and is involved with IPC - Association Connecting Electronic Industries and IEC - International Electrotechnical Commission. At IPC he acts as co-chair of the 5-21M (Cold Joining Press Fit) and 7-31BV (A610/J001 Automotive Addenda) tasks groups, at IEC he is the chair of Technical Committee TC91 (Electronics Assembly Technology).

Electronics Packaging Technology Trend of Automotive Electronics Product

Arihiro Kamiya Semiconductor Strategy Planning Dept., Electronics Platform Hardware R&D Div., DENSO Corp.

The time slot of this session is changed from 9:30-11:00 to 15:00-16:30. (as of September 17)

Detail & Speaker’s Profile

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For electrification, realization of the automatic operation, as for the car, becoming it accelerates electronic control. Electronic goods realizing these function in car are equipped with a lot. By each stress of temperature, humidity and the vibration, the install, mount condition of the electronics product becomes severe year by year. I introduce trend of the electronics packaging technology realizing the electronics product which is high Credibility in long-life.

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Technical Session Pre-registration Required

NEPCON-1 October, 21 (Wed) 10:30  -  12:00

Soldering Technologies for the Coming 5G Era

  • Available only in Japanese

Solder Material Development & Solution Proposal for 5G 

Shunsaku Yoshikawa Senior Researcher, Senior Manager, Solder Technical Center, Metal Div., R&D Engineering Div., Senju Metal Industry Co., Ltd.

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This Session will be given only in Japanese.

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Development of Soldering Materials to Support 5G

Tetsuro Nishimura President, NIHON SUPERIOR Co., Ltd.

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This Session will be given only in Japanese.

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NEPCON-2 October, 21 (Wed) 13:00  -  14:30

Technological Innovation of PCBs for 6G

  • Available only in Japanese

Novel FPC Technology for 5G/6G Era

Hirofumi Matsumoto CEO, FlexLink Technology Co., Ltd.

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This Session will be given only in Japanese.

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What Are the Requirements for Printed Wiring Boards in 6G?

Hiroshi Iinaga General Manager, DESIGN Dept., Oki Printed Circuits Co., Ltd.

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This Session will be given only in Japanese.

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NEPCON-3 October, 21 (Wed) 15:30  -  17:00

SiC Power Device Development & Its Penetration into the Market

  • Available only in Japanese

Solution for the Spread of SiC Power Devices

Takeshi Inoue Senior Engineer, Energy & Industry Group, Power Device Application Dept., Application Engineer Div., ROHM Co., Ltd.

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This Session will be given only in Japanese.

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Latest Trends and Future Prospects for SiC Power Semiconductor Modules

Junji Yamada Manager, Business Planning Project Group, Power Device Works, Mitsubishi Electric Corp.

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This Session will be given only in Japanese.

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NEPCON-4 October, 22 (Thu) 14:30  -  16:00

Thermal Design and EMC -- Key Points for In-vehicle Semiconductors

  • Available only in Japanese

Automotive Semiconductor Thermal Design and EMC Front Loading

Takao Egami Automotive Marketing Group III , System Devices Marketing Dept.III , Toshiba Electronic Devices & Storage Co.

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This Session will be given only in Japanese.

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Advanced Thermal and Life Time Design Techniques for Automotive Power Applications

Masayoshi Yamamoto Professor, Institute of Materials and Systems for Sustainability (IMaSS), Nagoya University

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This Session will be given only in Japanese.

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NEPCON-5 October, 23 (Fri) 14:30  -  16:00

Latest Technological Trends for 5G and High-speed Communication Applications

  • Available only in Japanese

Module Technology to Realize 5G

Hisao Hayafuji General Manager, Module Engineering Group, Network Technology Development Dept., Murata Manufacturing Co., Ltd.

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This Session will be given only in Japanese.

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Electrical Property Evaluation Technology and Latest Laminate Materials Technology for 5G

Shuji Gozu Chief Researcher, Lainate Materials R&D Dept., Information and Communication R&D Center, Information and Communication Business Headquarters, Hitachi Chemical Co., Ltd.

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This Session will be given only in Japanese.

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Concurrent Conferences Pre-registration Required

AUTO-K
October, 21 (Wed) 10:30  -  12:00

How Will Mobility Change after COVID-19?

  • English/Japanese
Akira Amari Chairperson, Research Commission on the Tax System, LDP, Member of the House of Representatives

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To be announced shortly.

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Automotive Industry: Current Status and Future Direction

Naoyasu Yoshimura Director, Automobile Div., Manufacturing Industries Bureau, Ministry of Economy, Trade and Industry

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As represented by CASE, the automotive industry is in the midst of a major transformation that is said to happen once in a hundred years. Moreover, with the pandemic virus, the industry is facing the biggest challenges from both the short- and mid-term point of views. Yoshimura will speak of the current status and future direction of the automotive industry.

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AUTO-S1 October, 21 (Wed) 15:30  -  17:00

Mega-suppliers' Strategy for Connected, Autonomous, Sharing & Electric Vehicle Technology 1

  • English/Japanese

Our Strategy towards MaaS and Future Mobility System

Klaus Meder President & Representative Director, Bosch Corp.

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Automotive industry is heading to an era of reshaping the world of transportation.
Adapting product portfolio and business model are essential to remain as a key player in the field.
Bosch is leading this change by providing various solutions of mobility system and technology.

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Klaus Meder has various and long experiences in engineering in Bosch.
One of his noteworthy experiences is that he resided in Japan for 5 years, when he was Vice President in charge of Engineering, Quality and Manufacturing of Automotive Electronics Japan from 1996 until 2000. After various positions with the division Chassis Systems, he became President of Automotive Electronics of Robert Bosch GmbH in January 2012. Since July 2017 he has been President and Representative Director of Bosch Corporation in Japan.

The Evolution of Mobility - Our Contribution to Quality of Life

Bert Wolfram President, Chief Executive Officer, Continental Automotive Corp.

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The future of mobility is facing many challenges. Smart, electrically powered and supported by sharing concepts - Seamless Mobility can reduce the traffic density in cities and enhance the accessibility of transportation for rural areas. Technological solutions in this field have advanced within Continental; they are supporting continuous evolution of the mobility sector and contribute to an improved and sustainable quality of life.

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Wolfram has extensive and diverse experience in the automotive industry. He held various, leading positions within Continental, including two assignments to the United States. Wolfram has been Senior Vice President of Continental's Chassis & Safety Div. for Japan/Korea since July 2016. In addition, he became President and CEO of Continental Automotive Corp. and Head of Continental Japan in October 2016

SFE-S1 October, 21 (Wed) 15:30  -  17:00

How Will 5G Change the Manufacturing Industry?

  • English/Japanese

5G for Futuristic Smart Manufacturing through Co-creation with Partners

Keisuke Okushima Senior Manager, 5G&IoT Business Dept., NTT DOCOMO, Inc.

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5G is emerging as a key connectivity solution that offers manufacturers the chance to build smart factories. This presentation provides you with our vision and introductions of some cases regarding smart manufacturing with 5G that we've created with our partners.

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Impact of 5G for Industries

Luca Orsini President and Representative Director, Ericsson Japan K.K.

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Many industries are looking at 5G as an indispensable platform for the Fourth Industrial Revolution. I will discuss the potential 5G would bring to industries and what we should be prepared for based on our extensive experiences and insights from various markets in the world.

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ROBO-K
October, 21 (Wed) 10:30  -  11:30

Production Innovation Brought by Robotics and Automation Technologies

  • English/Japanese

Tackling This Profound Transformation Once in a Century --Diversity and Uncertainty in Car Line-up

Toshiyuki Isobe Senior General Manager, Production Engineering Planning Field, Production Group, Toyota Motor Corp.

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The automobile industry is facing a profound transformation once in a century. While providing a wide range of lineup of EVs, FCVs, etc., we are required to respond to the market in a timely manner at lower cost coping with volume fluctuations. I would like to introduce our approach to our future Mono-zukuri based on the two axes; creating new value from zero-base resource, and promoting TPS-based improvement of added value.

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Being in charge of production preparations for introduction of new vehicle models to 50 affiliated companies in 27 countries around the world, have advanced the development of next-generation production lines as a mobility company, and been enhancing the competitiveness of real Mono-zukuri.

ROBO-S5 October, 23 (Fri) 9:30  -  11:00

Robots in Manufacturing: Automation Innovation in Large-scale Factories

  • Available only in Japanese

Searching for the Ideal GEMBA with the Lean Automation : Expectation vs Reality

Keisuke Kawano Project Director, Production Innovation Center, DENSO Corp.

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This Session will be given only in Japanese.

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Daikin's Manufacturing Innovation and Global Expansion by Utilizing Robots

Isao Hasegawa Honorary Officer, Deputy General Manager, Dept. Manager, Production Engineering Dept., Air Conditioning Manufacturing Div., DAIKIN Industries, Ltd.

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This Session will be given only in Japanese.

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