NEPCON Conference 2021

Keynote Session

NEPCON-K Jan. 20 (Wed)   12:30  -  14:00
  • Pre-registration Required Pre-registration Required

Murata's President Talks about Its 5G Strategies!

Norio Nakajima President Murata Manufacturing Co., Ltd.

Special Session

NEPCON-S1 Jan. 20 (Wed)   10:00  -  11:00
  • Free/Pre-registration Required Free/Pre-registration Required

Future Shaped by IoT/Sensors

Katsunori Hirata Chief Executive Officer CONNECTEC JAPAN Corp.
NEPCON-S2 Jan. 20 (Wed)   15:00  -  16:30
  • Free/Pre-registration Required Free/Pre-registration Required

Moving towards 6G! Unveiling Challenges and a New World

Takehiro Nakamura Senior Vice President, General Manager of 6G Labs. NTT DOCOMO, Inc.

Hiroshi Fujiwara Chairman & President, CEO BroadBand Tower, Inc./ President Internet Association Japan
NEPCON-S3 Jan. 21 (Thu)   10:00  -  11:30
  • Free/Pre-registration Required Free/Pre-registration Required

The Latest Trends in Electronics Industry

Wataru Izumiya President & CEO Sangyo Times, Inc.
NEPCON-S4 Jan. 21 (Thu)   12:30  -  14:00
  • Free/Pre-registration Required Free/Pre-registration Required

Electronics Manufacturers' Smart Factory Strategies

Atsuo Takemoto Executive Officer, Manufacturing and Procurement Headquarters Konica Minolta, Inc.

Atsuto Shimada Group General Manager,
Manufacturing Process Solution Dept., Process Automation Business Div., Connected Solutions Company,
Panasonic Corp.
NEPCON-S5 Jan. 21 (Thu)   15:00  -  16:00
  • Free/Pre-registration Required Free/Pre-registration Required

Exploring the Innovative Cooling Design of PlayStation(R)5

Yasuhiro Ootori VP
Mechanical Design Dept., Hardware Design Div.
Sony Interactive Entertainment Inc.
NEPCON-S6 Jan. 22 (Fri)   9:30  -  11:00
  • Free/Pre-registration Required Free/Pre-registration Required

Leading Semiconductor Companies' Next-generation Technologies

Doohwan Lee Director and Principal Eng,
Test & System Package (TSP)
Samsung Electronics Co., Ltd.

Masahiro Koike Director,
Field Technical Support & Marketing
TSMC Japan Ltd.
NEPCON-S7 Jan. 22 (Fri)   12:00  -  13:00
  • Free/Pre-registration Required Free/Pre-registration Required

AI in Materials Development

Yasumitsu Orii Executive Officer
New Value Creation Office, General Manager
NAGASE & Co., Ltd.

Electronics Advanced Technology Forum

Jan. 20 (Wed)

10:30

11:30
NEPCON-F1
Development of Soldering Materials to Support 5G
NIHON SUPERIOR Co., Ltd.

President Tetsuro Nishimura
12:30

13:30
NEPCON-F2
Structure and Jisso of mmWave 5G Smartphones
Semi Consult

Representative Hirotaka Ueda
14:30

15:30
NEPCON-F3
Current Status and Future Outlook of Room Temperature Bonding for Heterogeneous-integration of Future Devices
Meisei University/

Professor Collaborative Research Center The University of Tokyo Tadatomo Suga

Jan. 21 (Thu)

10:30

11:30
NEPCON-F4
Recent Progress in the Development of Gallium Oxide Power Devices
Novel Crystal Technology Inc.

Director, CTO, Senior Manager Development Dept. Kohei Sasaki
12:30

13:30
NEPCON-F5
Outlook on Turbulent Smartphone Industry
Mizuho Securities Co., Ltd.

Global Head of Technology Research/Senior Analyst Equity Research Dept. Yasuo Nakane
14:30

15:30
NEPCON-F6
Chiplets Package Roadmap for High Performance AI Chips
SBR Technology Co., Ltd.

CEO Toshihiko Nishio

Jan. 22 (Fri)

10:30

11:30
NEPCON-F7
Development of Solder Materials for Each Solution
Senju Metal Industry Co., Ltd.

Senior Researcher, Deputy Director Solder Technical Center, Metal Div., R&D Engineering Div. Shunsaku Yoshikawa
12:30

13:30
NEPCON-F8
Latest Trends and Future Prospects for SiC Power Semiconductor Modules.
Mitsubishi Electric Corp.

Manager Business Planning Project Group, Power Device Works Junji Yamada
14:30

15:30
NEPCON-F9
Murata's Challenge for Automotive Sensors
Murata Manufacturing Co., Ltd.

Director Functional Devices Div. Makoto Kawashima

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