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Next-gen. Semiconductor Technologies Discussed by Leading Companies from Japan & Korea

                Early Bird Rate: 24,000JPY until Wed. December 21st! (Regular price: 27,000JPY)
Jan. 25 (Wed)
 
13:00
 - 
14:10
Paid Session
English/Japanese
NEPCON-K
NEPCON JAPAN Conference Keynote Session
UCIe™: Building an Open Ecosystem of Chiplets for On-package Innovations
Cheolmin Park
President,
UCIe Consortium/
Corporate VP and head of New Business Planning team at Memory Div.,
Samsung

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<Details>

UCIe™ (Universal Chiplet Interconnect Express™) is an open specification that defines the interconnect between chiplets within a package to enable an open chiplet ecosystem and ubiquitous interconnect at the package level.
This presentation will explore:
- UCIe usages and key metrics
- The different layers and software models
- Compliance and interoperability mechanisms
- Plans for future usage models

<Speaker Profile>

Cheolmin Park is a Samsung Corporate VP and head of New Business Planning team at Samsung Memory Division. He has over 18 years of experience in the semiconductor industry and has been leading new memory and system architecture solution since he joined Samsung in 2020. He is a strong advocate for emerging technology and standards such as UCIe, CXL, PCIe and DRAM/NAND, forging technology partnerships with peers across the ecosystems to accelerate the time to market.

Currently, he is President of the UCIe (Universal Chiplet Interconnect Express) consortium and Board of Directors for CXL (Compute Express link).

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Possibilities of Imaging & Sensing Technology and the Future Envisioned with Sense the Wonder
Terushi Shimizu
Representative Director, President and CEO,

Sony Semiconductor Solutions Corp.

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<Details>

Introduce the future envisioned by Sony Semiconductor Solutions under its corporate slogan "Sense the Wonder," and the latest trends and future possibilities in imaging and sensing technologies centered on image sensors.

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Future Outlook of Flying Vehicles and Commercial Space Rockets - Next Gen. Mobility

Jan. 25 (Wed)
 
10:30
 - 
11:40
Free Session
NEPCON-S1
NEPCON JAPAN Conference Special Session 1
The Future of the Space Industry and Launch Vehicle Development
Takafumi Horie
Founder,

Interstellar Technologies Inc.

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<Details>

The space business is expected to expand its market globally. Interstellar Technologies was the first private company in Japan to reach outer space. I will share the future of the space industry, our current initiatives and future plans.

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Mobility Revolution
Maki Kaplinsky
CoFounder & Chair/COO,

ASKA

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<Details>

The mobility revolution is happening, on the road and in the air. ASKA™, the drive & fly electric Vertical Takeoff and Landing (eVTOL) vehicle revolutionizes the future of mobility, our towns, and the way we live.

<Speaker Profile>

Maki Kaplinsky is a serial entrepreneur with a track record of successful startups in the global tech industry. Her first start-up specialized in government-related technology transfer projects in over 15 countries. Her second start-up, IQP Corporation, was an early innovator in the Internet of Things and she concluded a successful M&A to GE in 2017. Currently she is the Co-founder & COO of a Silicon Valley air mobility company founded in 2018, and developer of the ASKA™ Drive & Fly Electric Vertical Take-off and Landing vehicle (eVTOL).

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"Beyong 5G/6G" -- Key Points to Achieve It

Jan. 25 (Wed)
 
15:30
 - 
16:40
Free Session
NEPCON-S2
NEPCON JAPAN Conference Special Session 2
5G Evolution and 6G
Takehiro Nakamura
Chief Technology Architect,
R&D Innovation Div.,
NTT DOCOMO, Inc.

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<Details>

Based on the challenges of early 5G and market needs, studies and international standardization of 5G are underway. In addition, in Japan and overseas, discussions on Beyond 5G/6G are already actively underway, and many projects have been launched. The company is also actively pursuing the advancement of 5G and the study of 6G. The company will talk about 5G advancements, 6G concepts and its latest initiatives.

<Speaker Profile>

Mr. Takehiro Nakamura joined NTT Laboratories in 1990. He is now SVP and General Manager of the 6G IOWN Promotion Department in NTT DOCOMO, Inc.
Mr. Nakamura has been engaged in R&D and the standardization activities for advanced radio and network technologies of W CDMA, HSPA, LTE/LTE Advanced 5G and 6G.

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Technology Trend of Radio Base Stations for 5G and Beyond
Masanobu Fujioka
Vice President & Chief Technology Officer (CTO),

Ericsson Japan K.K.

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<Details>

Radio base station consists of baseband unit, radio unit and antenna. For 5G baseband, evolution from ASIC or FPGA to virtualization with general-purpose processor is taking place. While, radio unit and antenna are integrated for millimeter wave. Latest trend of 5G base stations as those will be presented.

<Speaker Profile>

Masanobu Fujioka joined Ericsson Japan in 1998 and assumed positions of Director IMT-2000 Product Management, Director New Business and Technology, and since 2005 he has been Vice President & Chief Technology Officer. Before joining Ericsson, he worked in KDD in research in network architecture and development of new telephony services. He authored "Introduction to ISDN", "Wireless Broadband Textbook", "5G Textbook", "Introduction to 5G" etc. and obtained Ph.D from Osaka Univ.

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Power of "Monozukuri" that Support the Japanese Manufacturing Industry

Jan. 26 (Thu)
 
10:00
 - 
11:10
Free Session
NEPCON-S3
NEPCON JAPAN Conference Special Session 3
Perfect Fluid Control!! Latest High-tech Dispensing Technology to Transform Manufacturing
Naotoshi Ikushima
Vice President,

MUSASHI ENGINEERING Inc.

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<Details>

"Precision control technology to give shape to fluids" called "Unsung key technology" of manufacturing.
Introduce potential of Dispensing technology with our history and activity to change future manufacturing and contribute to low-carbon society.

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Revolution IoT Implementation with Change and Connect
Katsunori Hirata
CEO,

Connectec Japan Corp.

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<Details>

We will introduce the implementation technology issues in the expanding IoT market and the contract development business model OSRDA to solve these issues.

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Forecast of the Transforming Electronics Industry

Jan. 26 (Thu)
 
15:00
 - 
16:10
Free Session
NEPCON-S4
NEPCON JAPAN Conference Special Session 4
Analyzing the Future of Semiconductor Industry That Leaps Forward in Age of Metaverse! -- Smart Glasses, Smart Watches, and Edge Servers Are Key Points
Wataru Izumiya
President & CEO,

Sangyo Times, Inc.

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<Details>

Electronic devices have now hit the 100 trillion yen mark. Of which, semiconductors account for 65 trillion yen, general electronic components for 32 trillion yen, and when displays and batteries are counted in, the figure exceeds now well over 100 trillion yen. The next big impact would come from none other than the metaverse where smart glasses and smart watches are considered to become important terminal equipment that displaces smartphones. At the same time, edge servers will be placed ubiquitously, putting an end to the era of cloud-based centralized control only. This presentation will report on the latest coverage of the innovative worlds of capacitors and printed circuit boards, in addition to semiconductors such as OLEDs, micro-LEDs, microcontrollers, memory chips and analogue devices.

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Next-gen Power Semiconductor Technologies by Leading Companies

Jan. 27 (Fri)
 
10:00
 - 
11:10
Free Session
English/Japanese
NEPCON-S5
NEPCON JAPAN Conference Special Session 5
Heterogeneous Integration in Package - Applications Driving Material and Process Diversity
Thorsten Meyer
Senior Principal,
Package Concept Engineering,
Infineon Technologies AG

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<Details>

Heterogeneous Integration is a major technology driving force for microelectronic systems. More-than-Moore (MtM), System-in-Package (SiP), as well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices. This presentation will discuss challenges and introduce potential solutions for different integration technologies and applications.

<Speaker Profile>

Thorsten Meyer is Senior Principal Engineer Package Concept Engineering at Infineon Technologies in Regensburg, Germany, responsible for New Package concepts. Until March 2015 he was leading the Package Technology and Innovation department at Intel Mobile Communications (IMC) in Regensburg. Prior joining IMC, he was overall project leader for the development of Wafer Level Packaging Technologies at Infineon in Regensburg and earlier in Dresden.
Thorsten is author of multiple publications and holds more than 150 patents and patent applications in the area of advanced packaging.

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The latest packaging technology of power semiconductor module
Tomoyuki Yamazaki
Senior Manager

Fuji Electric Co.,Ltd.

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<Details>

Due to the improvement of Si-IGBTs and the wide band gap devices by SiC, the high power density of power semiconductor module has been rapidly advanced. The thermal design and the mounting technology that support advanced power semiconductor module are described.

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Latest Trends of Rapidly Evolving in-vehicle Electronics and Mounting Technologies

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
English/Japanese
ISP-1
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 1
Course Leader:Chiaki Takubo, KIOXIA Corp.
Sub Course Leader:Shigeki Sako, Amkor Technology Japan, Inc.
Roadmap for Next Generation xEV in 2030 and Its Technical Trend of Power Devices Applications
Masayoshi Yamamoto
Professor,
Institute of Materials and Systems for Sustainability (IMaSS),
Nagoya University

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<Details>

Power electronics technical trends and predictions for Next Generation xEVs in 2030 will discuss from the power semiconductor device module techniques, the current sensor application techniques and the material application techniques point of views for the e-Axle and the in-wheel motor systems.

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Trends of Automotive Semiconductors for CASE and Challenges in Packaging Technology
Shinji Baba
Senior Principal Specialist,
Packaging Technology Div., Production and Technology Unit,
Renesas Electronics Corp.

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<Details>

Semiconductors such as SoCs for thinking, MCUs for control, and Analog/Power devices for actuating have various packaging technology challenges. The examples are high speed signaling, electromigration by high current, and isolation for high voltage. We introduce trends in the safe and secure packaging technologies we are pursuing, focusing on autonomous driving and electrification.

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3D Packaging Technology for the Latest Logic and Power Devices

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
English/Japanese
ISP-2
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 2
Course Leader:Tsutomu Sekiya, C. Uyemura & Co., Ltd.
Sub Course Leader:Keiichiro Kata, Renesas Electronics Corp.
Advanced 3D Packaging and Integration Technology
Takafumi Fukushima
Associate Professor,

Tohoku University

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<Details>

From the dichotomization between TSV-less FOWLP and CoWoS with TSV, advanced interposers and technologies that fuse the two have emerged one after another, bringing us to an era in which semiconductor system performance is determined by microelectronics packaging. The latest trends in these technologies, including solderless Cu-Cu hybrid bonding, will be discussed.

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Advanced Sinter Joining for Power Devices
Katsuaki Suganuma
Director,
Flexible 3D System Integration Lab.,
Osaka University

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<Details>

With the commercialization of SiC, the advance in packaging material technology is remarkable. Silver (Ag) sinter joining is applied to wiring and TIM developments not only to die attach in order to improve heat dissipation. There is no need to use nanoparticles, and high performance can be realized without any concern in affordability.

<Speaker Profile>

He received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center of ISIR in 2007-2009, the director of ISIR in 2018-2020. He is currently Specially Appointed Professor and Professor Emeritus of Osaka University.

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Semiconductor Power Devices (Si, SiC) That will Achieve Low-carbon Society

Jan. 25 (Wed)
 
15:30
 - 
17:00
Free Session
English/Japanese
ISP-3
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 3
Course Leader:Takashi Matsumoto, DENSO Corp.
Sub Course Leader:Chiaki Takubo, KIOXIA Corp.
Power Device Development Trends Supporting the Realization of a Low-carbon Society
Shinichi Izuo
Dept. manager,
Mitsubishi Electric Corp.

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<Details>

To realize a low-carbon society, power electronics technology has a wide range of applications, including in the automotive, railway, industrial, consumer, and renewable energy sectors. Power devices as key parts are evolving to meet various market needs such as small size, high function, light weight and long life by applying not only Si but also wide bandgap semiconductors such as SiC. Technological developments supporting these evolutions are introduced.

<Speaker Profile>

Shinichi Izuo received his BSc and MSc in material engineering from Kyoto University, Japan in 1996 and 1998, respectively. In the same year, he joined Mitsubishi Electric Corporation, Japan. He has been engaged in the development of microfabrication technology and automotive sensors. He had been involved in power module development since 2010 and assumed his current position since April 2022.

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Chinese Government' Support for the Semiconductor Industry and the Latest Trends of SiC for Vehicle
Yao Ying
General Manager,

Beijing Fuji Chimera Consulting

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<Details>

Based on the Chinese government's support for the semiconductor industry, the latest trends of SiC and GaN attracting attention toward the dual carbon goals, will be introduced as well as the application cases of automobile industry and development direction of local semiconductor manufacturers.

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Key to the 3D Package Supply Chain: Development Trends and Future Perspective on the Latest Substrate Technology

Jan. 26 (Thu)
 
12:30
 - 
14:00
Free Session
English/Japanese
ISP-4
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 4
Course Leader:Keiichiro Kata, Renesas Electronics Corp.
Sub Course Leader:Katsuhiko Suzuki, Showa Denko Materials Co., Ltd.
Semiconductor Package Substrate Development Trends Driving Heterogeneous Integration
Kiyoshi Oi
Senior Manager,
Process Development dept., RESEARCH & DEVELOPMENT Div.,
SHINKO ELECTRIC INDUSTRIES Co., Ltd.

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<Details>

Increasing size, density, and multi-device integration of semiconductor packages have come to play a role in improving the characteristics of electronic devices. Substrate and assembly technology are key elements in the evolution of semiconductor packages, We will introduce the trends of these technologies and our initiative for the advanced package.

<Speaker Profile>

After graduating from Tohoku University Graduate School of Engineering, started work at SHINKO ELECTRIC INDUSTRIES Co., Ltd. in 2001. Since, engaged in the development of embedded substrate, fine pitch flip-chip and organic interposer assembly technology.

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Substrate Solution Technology Delivering High-speed and High-performance for 3D Packaging
Yoshikazu Uehara
Dept. Manager,
Board Solution and Development Dept,. Engineering and Development Div., Corporate Organic Materials Semiconductor Components Group,
KYOCERA Corp.

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<Details>

3D packaging requires co-design of chip, package and board for high-density design and optimal power/signal quality. In addition to package-board co-design, Kyocera works with ASIC vendors and power supply vendors to achieve the optimal overall system design.

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Technologies That Support Post-5G/6G

Jan. 26 (Thu)
 
12:30
 - 
14:00
Free Session
English/Japanese
ISP-5
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 5
Course Leader:Shinichi Kajiya, Sumitomo Bakelite Co., Ltd.
Sub Course Leader:Takashi Matsumoto, DENSO Corp.
Technology for Antenna-array Integrated Module and Initiative for Terahertz Communication
Hideki Ueda
Principal Researcher,
mmWave Business Promotion Dept., Communication Modules Div.,
Murata Manufacturing Co., Ltd.

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<Details>

Antenna-array integrated module (AiM) which integrates antennas, RFIC, connector, etc. is used at the millimeter-wave band. The author will present the background of the AiM utilization and technologies for AiM. Feasibilities for the terahertz communication will also be presented.

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Heterogeneous Integration of III-V Devices for Si Photonics Circuits
Shinji Matsuo
Senior Distinguished Researcher,
NTT Corp.

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<Details>

Research and development for the integration of heterogeneous materials with compound semiconductors is being actively pursued for further advancement of silicon photonics technology. In this talk, we will describe the hetero-integration technology using compound semiconductor membrane devices at NTT.

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Exploring the Technology Trends of the Latest Semiconductor Packaging That Lead the DX Revolution in Post-COVID-19

Jan. 27 (Fri)
 
10:00
 - 
11:30
Free Session
English/Japanese
ISP-6
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 6
Course Leader:Shigeki Sako, Amkor Technology Japan, Inc.
Sub Course Leader:Shinichi Kajiya, Sumitomo Bakelite Co., Ltd.
Technology Trends of the Chiplet Package Technology toward Dx/ Society 5.0
Toshihiko Nishio
CEO,

SBR Technology Co., Ltd.

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<Details>

Toward the society 5.0 Era., various types of chiplet packages will be deployed to realize the high performance of scalable AI accelerators, CPUs and Network ICs. This will also be rolled out in infrastructure and client products. Future developments of various chiplet packages, their advantages and roadmaps, and chip-to-chip connection design rules and standardization will be explained.

<Speaker Profile>

1988: IBM Japan
2011: STATSChipPAC Japan
2015: SBR Technology

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Optical Packaging Technology for the Silicon Photonics Optical Transceiver IOCore and Development Trends
Kazuhiko Kurata
CTO, Board of Directors,
AIO Core CO., LTD.

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<Details>

AIOCore develops, manufactures and markets the "IOCore" ultra-compact optical transceiver. Currently, the development up to 128Gbps (32Gbps/ch) has been completed and sales have started, and the next model is being developed.
The singularity of optical mounting technology comes down to optical connections. Trends and future prospects are introduced focusing on the implementation technology applied to "IOCore".

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Latest Market and Technology Trend of 5G Smartphones

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
PWB-1
PWB EXPO Technical Session 1
Course Leader:Hirofumi Matsumoto, FlexLink Technology Co., Ltd.
Sub Course Leader:Masaki Yamaguchi, Showa Denko Materials Co., Ltd.
The Current Situation of mmWave 5G Smartphone Which Does Not Attract Attention
Hirotaka Ueda
Representative,

Semi Consult

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<Details>

Though the mmWave 5G service was started on April 5, 2019, it does not show the actual situation of the service in other countries. Through my teardown analysis, I introduce the current situation of the terminal technology of mmWave 5G smartphone which passed through nearly three years from service in.

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Smartphone Sector Outlook
Yasuo Nakane
Global Head of Technology Research/Senior Analyst,
Equity Research Dept.,
Mizuho Securities Co., Ltd.

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<Details>

I analyze the latest smartphone sector situation and outlook for 2023 onwards from various different perspectives such as 1) Brand incl. Samsung, Apple, Oppo and Xiaomi, 2) Milliwave and Sub6, 3)Semiconductor incl. APs, 4) Displays such as LCD, OLED and touch panels, 5) Form factor incl. foldable, 6)Cameras, 7)Watches and peripherals such as AR goggles.

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Latest Electronics Technologies for Automotive Applications

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
PWB-2
PWB EXPO Technical Session 2
Course Leader:Koji Ikawa, CMK Corp.
Sub Course Leader:Mitsuaki Toda, Meiko Electronics Co., Ltd.
In-car Networking Analysis, from Teardown of Tesla Model 3, VW ID.3 and Toyota MIRAI
TADASHI NAKAMICHI
Editor in Chief of Nikkei Electronics,

Nikkei BP Inc.

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<Details>

Nikkei BP has disassembled and analyzed the Tesla Model 3, the Volkswagen ID.3, and the Toyota Mirai (with Advanced Drive). In this lecture, the speakers will present their analysis of the topology of the automotive network, the configuration of ECUs, and the design philosophies of each manufacturer.

<Speaker Profile>

Joined Nikkei BP in 1997. After working as a technical reporter at Nikkei BYTE, Nikkei Communications, and Nikkei Electronics, he served as Deputy Editor of Nikkei Electronics and Editor-in-Chief of the Real Kaihastukaigi before assuming his current position in January 2020.

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Current Status and Technology Trends of Printed Wiring Boards for Automobiles
Hideyuki Ohtsuka
Team Leader,
Planning & Public relations Team Development Marketing Section Development Technology Dept.,
CMK Co., Ltd.

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<Details>

With the rapid computerization and electrification of automobiles, the requirements for printed wiring boards are diversifying. This time, we will introduce the features of printed wiring boards that meet these demands and future technological trends.

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SiC Power Semiconductors and High-current & High-heat Dissipation PCBs for Evs

Jan. 25 (Wed)
 
15:30
 - 
17:00
Free Session
English/Japanese
PWB-3
PWB EXPO Technical Session 3
Course Leader:Mitsuaki Toda, Meiko Electronics Co., Ltd.
Sub Course Leader:Koji Ikawa, CMK Corp.
SiC Solutions for Automotive and Industrial Market
Ryo Fuchizaki
Engineer,

ROHM Co., Ltd.

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<Details>

Silicon Carbide (SiC) devices have emerged as the most viable candidate for next-generation, low-loss semiconductors due to its low ON resistance and superior high-temperature, high-frequency, and high-voltage performance when compared to silicon.
This presentation will introduce the trends of SiC devices in the automotive and industrial equipment markets.

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Printed Circuit Boards for Power Electronic Applications
Thomas Gottwald
Vice President Technology,

Schweizer Electronic AG

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<Details>

Increasing power demand for Automotive applications brings new challenges for Printed circuit boards. It will be presented, how new PCB technologies can help to carry highest currents, to dissipate power losses and to help in miniaturization to achieve high power denities.

<Speaker Profile>

Thomas Gottwald started his career at Schweizer Electronic AG in 1991. In his current role as Vice President Technology, he is responsible for the departments Front End, Product Management and Innovations. His technical focus is on embedding technologies, power electronics, electronic materials, and thermal management.

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Technology Development Trends That Support the Development of Next-gen. In-vehicle High-frequency Devices

Jan. 26 (Thu)
 
10:00
 - 
11:30
Free Session
PWB-4
PWB EXPO Technical Session 4
Course Leader:Yuki Hirokawa, Panasonic Industry Co., Ltd.
Sub Course Leader:Hirofumi Matsumoto, FlexLink Technology Co., Ltd.
Halogen-free Ultra-low Transmission Loss Multi-layer Circuit Board Material for mm-Wave Radar, XPEDION1
Daigo Hiratsuka
Staff Engineer,
Product Development Dept., Circuit Board Materials Business Unit., Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.

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<Details>

As the development of ADAS (advanced driver assistance system) and autonomous driving progresses, millimeter wave radar is used as a sensing technology that supports them. Low transmission loss is required for antenna substrates that transmit and receive millimeter waves. At present, fluororesin substrate materials are mainly used for antennas, but due to the characteristics of resin, processing during substrate manufacturing is difficult and expensive.
At this time, we introduce "halogen-free ultra-low transmission loss substrate material XPEDION1" that achieves both excellent low transmission loss and processabillity by utilizing our original resin design technology and low-roughened copper foil bonding technology.

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R&D Activities for Low Transmission Loss Base Materials for mmWave Applications
Henry Utsunomiya
CEO,

Interconnection Technologies, Inc.

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<Details>

mmWave radar is under production for both automotive and industrial applications. The long range radar is enable to ADAS, however improvement is required for autonomous driving. The base materials for this application required smaller Dk/Df with smooth conductor surface. R&D activities of base materials will be discussed.

<Speaker Profile>

Co-chairman of iNEMI roadmap organic substrate TG, Chairman of JPCA Technology Roadmap for PWBs, Working Group Chairman of Jisso Technology Roadmap (JEITA) for more than 20 years.

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Latest Technology Trends of Cutting-edge Package Substrates That Achieves High Density

Jan. 26 (Thu)
 
10:00
 - 
11:30
Free Session
PWB-5
PWB EXPO Technical Session 5
Course Leader:Masaki Yamaguchi, Showa Denko Materials Co., Ltd.
Sub Course Leader:Hiroshi Iinaga, OKI Circuit Technology Co., Ltd.
The Latest Lithography Technologies Required for Advanced Packaging Substrate
Koichiro Saito

Sales Dept., Photon Process GBU, System Solution Div.,
USHIO Inc.

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<Details>

Semiconductor package substrates are based on PWB technology, but also require extremely high density. In recent years, this trend has accelerated due to the evolution of chiplets and the like. In this session, the exposure technology required for such advanced package substrates and the strategies of Ushio Inc. will be introduced.

<Speaker Profile>

Joined Ushio Inc. in April 2017. Since then, he has been involved with expanding sales of steppers for advanced package substrates, the UX-5 series, and exposure equipment for wafers, the UX-4 series. Since 2021, he has been in charge of package substrate market strategy, up to the present.

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Semiconductor Package Development Enabling High Density Integration
Noritaka Katagiri
Senior Director,
Research & Development Div.,
Shinko Electric Industries Co., Ltd.

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<Details>

In semiconductor package substrate, high density integration is further progressing. This trend can realize by the structures that allow chips with multiple functions mounted on the same substrate, such as chiplets. We will present the status of elemental technology development for higher integration of substrates.

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Photosensitive Films for High Density PKG
Kenichi Iwashita
Senior Researcher,
Photosensitive Materials R&D Dept.,
Showa Denko Materials Co., Ltd.

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<Details>

To accelerate high-speed communication in advanced semiconductor packages, Cu wiring is becoming narrower. The required rule is below 10 micron. We will report on development methods and future trends of photosensitive films that can achieve fine pattern formation.

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Trends of Next-gen Fluorine Resin Materials in the 6G and Terahertz Era

Jan. 27 (Fri)
 
12:30
 - 
14:00
Free Session
PWB-6
PWB EXPO Technical Session 6
Course Leader:Hiroshi Iinaga, OKI Circuit Technology Co., Ltd.
Sub Course Leader:Yuki Hirokawa, Panasonic Industry Co., Ltd.
Low Loss Fluoropolymer CCL for High Frequency Band
Takaoki Maeyama
Manager,

Chukoh Chemical Industries, Ltd.

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<Details>

The core technology of Chukoh Chemical Industries, Ltd. is the processing for fluoropolymer products, and our fluoropolymer copper clad laminate is the product that makes use of this technology. This time, we will introduce the types and characteristics of the fluoropolymer CCL for high-frequency bands, which has extremely low-loss characteristics among materials.

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Next Generation PTFE Substrate and New Solution of Using Same
Tatsunari Koyama
Manager,
Tokyo Sales Engineering Group,
Nippon Pillar Packing Co., Ltd.

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<Details>

Conventionally PTFE substrates have been recognized attractive thanks to low Dk and Df, but for multi-layered PCB, PTFE have some difficulty on fabrication. In this session, we propose new PTFE build-up multi-layered PCB with thermosetting bonding film fabricated with usual PCB process. Additionally, we introduce some key development results from material and design points of view. 

<Speaker Profile>

He graduated Osaka university in 1999. He has over 15 years experience in developing analog semiconductor. From 2016, he engaged in developing PTFE substrate and now is a sales engineer.

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Low Loss Adhesive Film for Multilayer PTFE Substrate AS-400HS
Masaki Yamaguchi
Senior Researcher,
Laminate Materials R&D Dept., R&D Center, Electronics Business Headquarters,
Resonac Corp.

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<Details>

Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising in beyond 5G and 6G society. With these background, we have developed a bonding film for PTFE multilayer substrate.

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Technology Development for Achieving Carbon Neutrality and Circular Economy

                Early Bird Rate: 24,000JPY until Wed. December 21st! (Regular price: 27,000JPY)
Jan. 25 (Wed)
 
10:30
 - 
11:40
Paid Session
English/Japanese
AUTO-K
AUTOMOTIVE WORLD Conference Keynote Session
Toward Achieving Carbon Neutrality in 2050
Hirofumi Inoue
President, Advanced R&D and Engineering Company,
Senior General Manager, Technical Project Field, Vehicle Technology Field,
Toyota Motor Corp.

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<Details>

To achieve carbon neutrality by 2050, it is necessary to focus on the life cycle of a product, from the planning stage to manufacturing and disposal, as well as its use. It is also important to consider the transition to a more effective recycling society without wasting resources used for products. We would like to work hand in hand with many people to build a sustainable society.

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Komatsu's Technology Development for Carbon Neutrality
Seiichi Fuchita
Senior Executive Officer, Chief Technology Officer (CTO), President, Development Div.,
Komatsu Ltd.

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<Details>

Construction and mining equipment are in harsh environments and must can be operated for a long time. Customer applications and site environments vary, requiring the use of hydrogen engines besides batteries and fuel cells emit no CO2. Since our equipment are used for 15~20 years, we must consider carbon-neutral biofuels and synthetic fuels. We promote R&D for carbon neutrality by incorporating cutting-edge technologies to solve problems and listening to customers.

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Software Defined Vehicle: Latest Cases in the World

Jan. 26 (Thu)
 
10:00
 - 
11:10
Free Session
English/Japanese
AUTO-S1
AUTOMOTIVE WORLD Conference Special Session 1
Software Defined Vehicles: Current State and Future Trends
Lei Zhou
Partner,
Business Strategy Practice Leader,
Deloitte Tohmatsu Consulting LLC/
Affiliate Professor,
Osaka Metropolitan University

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<Details>

The rapidly advancing trend for software defined vehicles in the automotive industry will lead to major changes in existing software and hardware development.
Firstly, software development will be based on vehicle OS and middleware, which will be done in a virtual environment, isolated from hardware. Moreover, the expansion of data types used in automotive development and data-oriented development infrastructure will be essential since the quantity and quality of data, as well as the computing resources for analyzing and learning data, will make a significant contribution to the performance of application.
Next, the role of hardware will also change with the transition to software defined vehicles. In order to make the every feature of vehicle functions customizable with software, it is necessary to have "programmable hardware" which is a common component but still has flexibility for personalization. In addition, there is an increasing demand for more durable hardware as OTA updates allow vehicles to retain their value after sale and lengthen the replacement span.
In this talk, I will discuss the future of automotive development in the era of software-defined, taking into account various trends in the automotive industry, as well as roles of automotive OEMs and hardware/software players and ways to enhance their competitiveness.

<Speaker Profile>

Lei specializes in industries related to automotive/ICT/electronics/mobility services. While based in Tokyo, he has worked in projects across several countries including the U.S., Europe, China, and India. He has experiences in all aspects of consulting from upstream projects - such as those related to corporate, technology, and overseas business development strategy; to downstream operations such as constructing detailed business management systems. Lei has a Ph.D. in economics. He is fluent in English and Japanese, and is native in Chinese.

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How to Grow Digital-savvy Human Resources and Improve Development Efficiency in the SDV Era

Jan. 27 (Fri)
 
10:00
 - 
11:10
Free Session
English/Japanese
AUTO-S2
AUTOMOTIVE WORLD Conference Special Session 2
The Key to Digital-savvy Human Resources: Reskilling for Automotive
Klaus Meder
President and Representative Director,

Bosch Corp., Japan K.K.

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<Details>

Competence management, especially for engineers became vital in the automotive industry which is in a big wave of transformation. Bosch provides employees with extensive Upskilling and Reskilling programs, so that each employee can obtain an attitude continue to learn throughout one's life.

<Speaker Profile>

Klaus Meder has a high level of insight and extensive experiences in the automotive industry and he has been in his current position since 2017.

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How to Deal with Ever-increasingly Complex Software
Yohei Nagao
Project General Manager,
BR Software Business Promoting Dept.,
Toyota Motor Corp.

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<Details>

The challenges of automotive software development are how to address diversified needs, stemmed from different car models and geographies as well as how to create development structures to address massive development scale. This lecture explains TOYOTA MOTOR CORPORATION's initiatives to tackle these challenges in order to meet customer's expectations in different geographies.

<Speaker Profile>

Joined TOYOTA MOTOR CORPORATION in 2017, concurrently serving Woven Planet Holdings, Inc. from 2019, where he is responsible for the system development strategy related to automotive system and software, as an expert in software engineering and highly reliable software development methodology. He is involved in vehicle system development and software development improvement and transformation.

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New Mobility Business: Its Shape and Potential

Jan. 27 (Fri)
 
12:30
 - 
13:40
Free Session
English/Japanese
AUTO-S3
AUTOMOTIVE WORLD Conference Special Session 3
JAL Air Mobility Business as ESG Strategy
Hitoshi Murakoshi
Vice President,
Air Mobility Business Creation Dept., Digital Innovation Div.,
Japan Airlines Co., Ltd.

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<Details>

Next-generation Air Mobility (Drones, and e-VTOL) is expected to be a new infrastructure that will solve various social issues. The JAL Group's Air Mobility ongoing initiatives are being introduced with a view to future outlook and challenges.

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Initiatives for Honda Solution System "AWV Case Study"
Tsutomu Wakitani
Vice President, Executive Chief Engineer,
Solution System, R&D Business Unit,
American Honda Motor Co., Inc.

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<Details>

Honda aims to solve social issues through a "Honda Solution System" as one of the means of achieving the Honda 2030 vision, serve people worldwide with the "joy of expanding their life's potential". We will introduce the frontline status and challenges of efforts to make it a reality.

<Speaker Profile>

1996 Joined Honda R&D Power Products R&D center, new business design dep
2013 Honda R&D Euro (Deutschland) President
2016 Honda innovation Lab. Tokyo, THINK general manager, Executive chief engineer
2017 Honda R&D-X Operating Officer
2019 Honda R&D Life creation center, Robotics unit officer, Executive chief engineer
2022 American Honda Motor Co., Inc. Solution system, R&D business unit Vice President, Executive Chief Engineer

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EVs in Logistics and Transportation

Jan. 26 (Thu)
 
12:30
 - 
13:10
Free Session
AUTO-S4
AUTOMOTIVE WORLD Conference Special Session 4
Overcoming EV Fleet & EV Supply Chain Challenges
Masashi Omae
Industry Development Manager,
Enterprise Sales,
DHL Japan, Inc.

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<Details>

Although the share of EV vehicles (Battery EV) in the Japanese passenger car market is still on the early stage, sales are growing rapidly. In such environment, how do we, as a logistics company, promote the shift to EVs as a non-carbon strategy and how we should take environmentally friendly actions. We will showcase how we can support the global supply chain transformation of the automotive industry from procurement to production to after-sales service.

<Speaker Profile>

Entered DHL in 1992. Since 2007, in charge of the automotive sector in Enterprise Sales Group, then in 2017 transferred to DHL Supply Chain to get involved in the 3PL business. 2018 to present, the same role back to DHL Japan. Have a total over 15 years experience of communication in Automotive industry's customers as an expert.

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Latest Trends of Technology Development Aimed to Reduce Traffic Accidents to Zero

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 25 (Wed)
 
10:30
 - 
11:40
Paid Session
English/Japanese
AUTO-1
AUTOMOTIVE WORLD Conference Technical Session 1
State of Autonomous Driving and Its Diversion to Other System
Kazuo Shimizu
CEO,

Technomedia Inc.

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<Details>

The second phase of SIP-adus will end this year, but we will trace the nine years since 2014, when the first phase began, and summarize the results as of 2022. In addition, we will try to predict how this technology will be implemented in society in the future, with high expectations.

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Advanced Driver Assistance System Aiming at a Collision-free Society
Yoichi Sugimoto
Executive Chief Engineer, Head of Computer Science domain,
Innovative Research Excellence/Software Defined Mobility Development Supervisory Unit, Business Development Operations,
Honda R&D Co., Ltd./
Honda Motor Co., Ltd.

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<Details>

Honda aims at zero traffic fatality globally by 2050. The world's 1st Level 3 automated driving was deployed in 2021. Honda keeps struggling to realize a collision-free society as soon as possible, accelerating evolution of ADAS with technologies and knowledge acquired through development of the automated driving.

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Cyber Security from the Perspectives of Hackers and Automakers

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 25 (Wed)
 
15:30
 - 
16:40
Paid Session
English/Japanese
AUTO-2
AUTOMOTIVE WORLD Conference Technical Session 2
Engaging Security Researchers to Secure Automotive Platforms - Lessons from Pwn2Own
Brian Gorenc
Sr. Director, Vulnerability Research,

Trend Micro

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<Details>

The automotive industry finds itself with some unique challenges when trying to engage with the research community through hacking competitions, like Pwn2Own. In this session, we look back at lessons learned and examine methods to engage the research community to better protect automotive technology.

<Speaker Profile>

Brian Gorenc is the Sr. Director of Vulnerability Research with Trend Micro. In this role, Gorenc leads the Zero Day Initiative (ZDI) program, which represents the world's largest vendor-agnostic bug bounty program. Brian is also responsible for organizing and adjudicating the ever-popular Pwn2Own hacking competitions.

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Key Points of Vehicular Cybersecurity Measures from the Viewpoint of Technological Development
Keisaku Hayashi
General Manager,
Electronics Platform Eng., R&D Dept., Electronics Platform Systems R&D Div.,
DENSO Corp.

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<Details>

In this lecture, I will explain the concept of countermeasures needed to protect vehicles from cyber-attacks and give an overview of technologies. Then, I will explain the involved technologies and their necessity. Finally, I will discuss countermeasures needed in the future by drawing on my experience in developing such technologies in our company.

<Speaker Profile>

Mr. Keisaku Hayashi joined DENSO Corp. in 1995 and worked in the development of mobile phones, navigation maps, and telematics services in Japan and US at DENSO and an OEM. Since 2014, he joined the team of promoting the advanced development, process construction and technology standardization of automobile cybersecurity. In 2019, he served as the head of the office managing the organization. He is the member of JASPAR Information Security Promotion Working Group and the JSAE Automotive Cybersecurity Course, and he is promoting the standardization of security measures.

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Solid-state Battery and Semi-solid-state Battery : Its Evolution & Commercialization

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 26 (Thu)
 
12:30
 - 
13:40
Paid Session
English/Japanese
AUTO-3
AUTOMOTIVE WORLD Conference Technical Session 3
Commercialization of SemiSolid Lithium Ion Batteries for EV Applications
Naoki Ota
President & CEO,

24M Technologies, Inc.

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<Details>

The basic lithium-ion battery cell manufacturing method and product design have not changed in the past 30 years, and significant cost reductions cannot be expected simply by expanding volume. The SemiSolid battery platform developed by 24M will provide the key to expanding electric vehicles' volume: lower cost, larger size, higher reliability and safety, and improved material recyclability of lithium-ion batteries.

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The Potential of All-solid-state Batteries - Current Status and Future of Research and Technological Development
Ryoji Kanno
Director / Institute Professor,
Research Center for All-Solid-State Battery, Institute of Innovative Research,
Tokyo Institute of Technology

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<Details>

All-solid-state batteries, which consist entirely of solids components, are being developed as the energy storage devices for the next generation. This lecture reviews the research and technological development history of this device and provides topics related to solid-state batteries, including future development and new science that can be expected when batteries become solid-state.

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Global Trends of E/E Architecture

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 26 (Thu)
 
15:00
 - 
16:10
Paid Session
English/Japanese
AUTO-4
AUTOMOTIVE WORLD Conference Technical Session 4
E&E Architecture: "True North"
Camille Vuillaume
General Manager,
Cross-Domain Computing Solutions Japan, Advanced Network Solutions, Head of Regional Business Unit,
Bosch Corp.

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<Details>

Many car manufacturers are introducing powerful vehicle computers in order to harness increasing software complexity and enable new software-driven revenue streams. We will discuss how improvements in the E&E architecture will make it possible to offset some of the additional costs introduced by vehicle computers.

<Speaker Profile>

Camille Vuillaume is head of the business unit "Advanced Network Solutions" at Bosch in Japan. He has been in Japan since 2005, initially working in the field of cyber-security before he joined Bosch group in 2013. He obtained his PhD in 2007.

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To be Announced
Michael Niklas-Höret


AUTOSAR

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<Speaker Profile>

Michael Niklas-Höret is an active member of the AUTOSAR Steering Committee representing Continental and the current AUTOSAR Deputy Chairperson.
Michael Niklas-Höret has been active in AUTOSAR Standardization since 2013 in various roles, including being the AUTOSAR Steering Committee representative for Continental for four years.
Michael Niklas-Höret is interested in preparing the AUTOSAR standard to meet the challenges of the automotive industry and guiding the organization through the journey of the Software-Defined Vehicle.

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e-Axle: Its Technological Evolution

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 27 (Fri)
 
10:00
 - 
11:10
Paid Session
English/Japanese
AUTO-5
AUTOMOTIVE WORLD Conference Technical Session 5
Restraints to the Proliferation of Electric Vehicles and the Challenges BluE Nexus Tackles -- eAxle for bZ4X, New Electric Drive Module for New Crown, and More --
Shizuo Abe
Executive Director, Member of the Board,

BluE Nexus Corp./
CEL(Chief Electric Leader), Executive Adviser,
Power Train Company,
AISIN Corp.

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<Details>

Electrification of cars is essential to achieve carbon neutrality. Various powertrains exist as means of electrification, including HEVs, PHEVs, BEVs, and FCVs, but they are also burdened with their respective many challenges. And such challenges are also marked by region-specific characteristics in many cases on a global basis and, therefore, cannot be solved by a single means.
This presentation will touch on the current status and future prospects of electrification challenges, while introducing an overview of the newly developed eAxle and new electric drive modules adopted in the bZ4X and the New Crown, and explain how BluE Nexus will contribute to the realization of carbon neutrality.

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Resource Saved Next-gen. e-Axle for EVs - Challenges for Miniaturization Based on Material Technologies -
Aki Watarai
Group Manager,
EV Motor Development Group, Frontier Research and Development Div., Development Headquarters,
Aichi Steel Corp.

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<Details>

As a response to the shortage of resources due to electrification, we have succeeded for the world's first in experimentally proofs of ultra-compact and lightweight next generation e-axle, with use of Dy-free Nd anisotropic bonded magnets and high-strength gear steel. This technology contributes to the reduction of major materials of motor, such as rare earth, Nd, electromagnetic steel and Cu.

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Thermal Management of EV

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 27 (Fri)
 
12:30
 - 
13:40
Paid Session
English/Japanese
AUTO-6
AUTOMOTIVE WORLD Conference Technical Session 6
Thermal Management - Enabling the Success of E-mobility
Joachim Baczewski
Vice President, Thermal Management Asia 1,

MAHLE Group/
President and Representative Director,
MAHLE Behr Japan K.K.

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<Details>

MAHLE has responded with a large number of innovations for the thermal management of electrically powered vehicles. Striking a balance between performance, installation space requirements, comfort, and systems costs is key. MAHLE meets these challenges by taking a holistic approach in the design of the entire thermal system and optimizing the interactions of each component. This session will explain MAHLE's approach and solutions.

<Speaker Profile>

Graduated University of Technology RWTH Aachen, Germany in 1993. Ph.D. Course at Keio University, Faculty of Science and Technology, Japan in 1996. Served as President and Representative Director at Bosch Packaging Technology K.K., Japan and Knorr-Bremse Commercial Vehicle Systems Japan Ltd. Joined MAHLE in March 2022 as Vice President to oversea Thermal Management for Japan and Thailand.

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DENSO's Approach to Thermal Management System of Electric Mobility
Yasuhiro Mizuno
General Manager,
Thermal Management Systems R&D Div., R&D Dept. 1,
DENSO Corp.

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<Details>

To realize CN and accelerate electrification face challenges of thermal technology. Future electric mobility society envisioned by DENSO and development efforts of thermal management system are introduced.

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New City Development Achieved by Urban MaaS

Jan. 25 (Wed)
 
15:30
 - 
16:40
Free Session
AUTO-M1
MaaS Forum 1
Tokyo Metro "my! Tokyo MaaS" Initiative
Koichi Kawakami
Director,
Corporate Value Enhancing Dept., Corporate Planning Headquarters,
Tokyo Metro Co., Ltd.

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<Details>

The Covid-19 has significantly reduced people's mobility and railway operators have been severely affected. This presentation will describe the current state of transport in Tokyo, the provision of real-time congestion information, various linkages and other measures aimed at stimulating future mobility as a MaaS.

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Regarding the Conception of an Urban MaaS System Osaka Metro Group Aims for
Koji Kamishinbara
Executive Officer (Urban MaaS Strategy),

Osaka Metro Co., Ltd.

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<Details>

Osaka Metro is working to develop an urban MaaS system to aim at the improvement of the quality of life of users and the further development and revitalization of Osaka by connecting various means of transportation seamlessly and providing new value of transfer and services according to creating a next-generation transportation infrastructure.

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Latest Cases of Tourism-type MaaS: To Make Tourist Area More Attractive

Jan. 26 (Thu)
 
15:00
 - 
16:10
Free Session
AUTO-M2
MaaS Forum 2
Efforts of Public-private Partnership in Nagasaki City for Regional Revitalization
Hiroshi Kubo
Manager,

Nagasaki City Office

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<Details>

Amid a rapidly changing society, local governments are facing ever-worsening issues: declining birthrates, aging populations and population decline. Local governments must work together with the private sector to achieve regional revitalization and solve challenges peculiar to public entities.
I will introduce a case study of Nagasaki that includes background context, initiatives, and future outlooks, in hopes that it will stimulate local revitalization nationwide.

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MaaS Initiatives by JR East
Yuichiro Tokunaga
Executive Officer, Director General of MaaS,
Marketing Headquarters,
East Japan Railway Co.

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<Details>

JR East aims to realize seamless mobility through the development of a MaaS platform and the performance of field trials in Tohoku (Northeastern Japan), in Karuizawa of Nagano Prefecture, etc. The presentation will introduce initiatives that not only revitalize tourism mobility through the promotion of DX, but also support local lifestyles by making them even more convenient by linking them to such solutions as the Suica card payment system.

<Speaker Profile>

TOKUNAGA Yuichiro Joined JR East in 1989. After engaging in the maintenance of rolling stock, serving as a conductor and train dispatcher, he was involved in the relocation of the Tokyo Control Operation Center, the construction of Tokyo's Autonomous decentralized Transport Operation control System (ATOS), and led the improvement of handy ticketing terminals for conductors, new ticketing and inspectionless seating system on Shinkansen and express trains. Since April 2019, he has supervised JR East's MaaS business division, promoting the expansion of digital services related to mobility as well as facilitating deeper collaboration with local communities. He has held his current post since June 2022.

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Key to MaaS Success Resides in City Development and Infrastructure

Jan. 27 (Fri)
 
15:00
 - 
16:10
Free Session
AUTO-M3
MaaS Forum 3
Initiatives in the Field of Mobility at Digital Agency
Takahiro Suzuki
Director for Policy Planning,
Group of Service for Citizens,
Digital Agency

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<Details>

Digital Agency was launched on September 1, 2021. This section introduces the activities of the Digital Agency in the field of mobility, contents of the "Study Group on Digital Transportation Society" which received opinions from experts about the ideal form of mobility in the digital age from the perspective of each citizen, and a new document "Vision of Mobility and Society 2022" that takes over "Public-Private ITS Initiative/Roadmaps".

<Speaker Profile>

In 1998, he joined Ministry of Transport (now Ministry of Land, Infrastructure, Transport and Tourism). Engaged in traffic administration, regional development, international cooperation, etc. In September 2021, he assumed his current position with the establishment of Digital Agency.

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How OpenStreet Expands Shared Mobility
Tomoaki Kudo
Representative director and President, CEO,

OpenStreet Co., Ltd.

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<Details>

We are an operation system for urban space that creates the future of life with Data x Mobility. We will talk about our track record of service-in of shared bicycles, shared scooters, and shared ultra-compact EVs, as well as our vision for the future of mobility and shared mobility.

<Speaker Profile>

He joined OpenStreet and served as CFO and CMO before being appointed CEO in October 2021, where he remains to this day.

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Lightweight Technology Innovation Forum Supervisor:
Teruo Kishi, President, Innovative Structural Materials Association (METI)/Professor Emeritus, The University of Tokyo

Lightweight Body of New Vehicles and Latest Case Studies

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 25 (Wed)
 
13:00
 - 
13:40
Paid Session
English/Japanese
ALT-1
Lightweight Technology Innovation Forum 1
Development of Light Weight and High-rigidity Body Structure of MAZDA CX-60.
Tadashi Yamazaki

Body Shell Development Gr., Body Development Dept., Vehicle Development Div.,
Mazda Motor Corp.

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<Details>

Mazda CX-60 is first model of Large product group to adopt longitudinal engine and plug in hybrid system.
This presentation introduces an approach of the vehicle performance development and technology of lightweight body.

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Latest Examples and Current Development Status of Ultra-high Tensile Steel That Accelerates Lightweight

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 26 (Thu)
 
10:00
 - 
11:10
Paid Session
English/Japanese
ALT-2
Lightweight Technology Innovation Forum 2
The Adoption of 1.5Gpa Cold Ultra-high-strength Steel in Vehicle
Hirokazu Maeda
Project Manager,
Body Technology Development Dept. No.2., Body Technology Development Div., Vehicle Development Center,
Toyota Motor Corp.

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<Details>

The need for vehicle weight reduction is increasing due to electrification and performance improvement. In consequence, body frame mass optimization gained importance. NX has achieved a lightweight, highly rigid body frame that supports the Lexus driving style. This document will describe the contribution of ultra-high-strength steel to the NX mass and performance upgrade.

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Current Status of Development of Ultra-high-strength Steel Sheets and Application Technology Contributing to Automobile Weight Reduction
Yasunobu Nagataki
Fellow,
Steel Research Lab.,
JFE Steel Corp.

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<Details>

Demand for weight reduction of automobile body has been getting stronger toward the coming carbon neutral society. The latest status of the development of ultra-high-strength steel sheets and application technologies in JFE Steel contributing to automobile weight reduction will be shown in this presentation.

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Materials and Countermeasures to Galvanic Corrosion That Achieve Multi-material Vehicles

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 26 (Thu)
 
15:00
 - 
16:10
Paid Session
English/Japanese
ALT-3
Lightweight Technology Innovation Forum 3
Application of Innovative Materials and Technologies to Multi-material Body
Kouji Chiba
Project Manager,

Innovative Structural Materials Association (ISMA)

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<Details>

ISMA has been commissioned by NEDO to develop innovative structural materials and technologies for 10 years from 2013 to 2022 in response to social needs for CO2 reduction. This time, with the aim of applying the developed materials and technology to multi-material car bodies, we have verified practical application issues, so we will explain the results. In addition, each part and technology will be exhibited at the exhibition hall.

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Joining Technology in Multi-material Car Body
Yoshinori Hirata
Project Manager,

Innovative Structural Materials Association (ISMA)

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<Details>

Multi-material structured car body has been evolved in technologies of design, material and joining for these 10 years. The features of various joining technologies, which have been developed for joining dissimilar materials of steel, aluminum alloy and CFRTP, will be introduced.

<Speaker Profile>

In 1976, Master of Eng., Graduate School of Eng. Osaka University, retirement of Prof. of Osaka University in 2016, then, specially appointed prof. till 2022, Prof. Emeritus. In 2013 ISMA coordinator, in 2016 ISMA project manager.

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Galvanic Corrosion Due to the Contact of Dissimilar Materials and Its Countermeasures in Automobiles
Sakae Fujita
Project Manager,

Innovative Structural Materials Association (ISMA)

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<Details>

ISMA has developed new galvanic corrosion testing methods and numerical simulation technology to reproduce actual automobile corrosion. The current status and prospects of these technologies, focusing on the research results at ISMA for predicting the lifespan of automobile rust prevention will be described.

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Forefront of Material Development That Contributes to Carbon Neutrality and Sustainability

                Early Bird Rate: 15,000JPY until Wed. December 21st! (Regular price: 18,000JPY)
Jan. 27 (Fri)
 
15:00
 - 
16:10
Paid Session
English/Japanese
ALT-4
Lightweight Technology Innovation Forum 4
Material Development Using Bio-filler
Hitoshi Uchida

Carbon Neutrality Development Promotion Dept., Material Engineering Div.,
TOYODA GOSEI Co., Ltd.

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<Details>

Cellulose nanofiber (CNF), which is a biofiller, is a highly functional material made from forest resources and is expected to contribute to global warming countermeasures. Toyoda Gosei has developed a composite material of polypropylene (PP) and CNF to contribute to improving fuel efficiency while driving vehicles by making the product lighter.

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Current Status and Future Prospects of Ultra-High Strength Steel Development to Reduce Vehicle Weight and Environmental Impact
Nobuhiro Fujita
Head of Labs., Steel Research Labs.,
Managing Executive Officer,
NIPPON STEEL Corp.

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<Details>

Steel products account for almost half of vehicle body in weight. Because increasing strength of steel can lead to weight reduction of vehicle body, application of higher strength steel has progressed in recent years.
In addition, steel can give less greenhouse gas emission comparing with other materials so that more applications of higher strength steel greatly contribute to the reduction of environmental impact. In this presentation, development status of next-generation steel materials for further weight reduction of vehicle body, as well as efforts to reduce greenhouse gas emissions toward the realization of a carbon-neutral society will be explained.

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WEARABLE EXPO Conference Supervisor:
Masahiko Tsukamoto, Professor, Dept. of Electrical and Electronics Engineering, Faculty of Engineering, Graduate School of Engineering, Kobe University

How Does Metaverse Change the World? Top Players Talk about Now and Future

                Early Bird Rate: 24,000JPY until Wed. December 21st! (Regular price: 27,000JPY)
Jan. 26 (Thu)
 
12:30
 - 
13:40
Paid Session
English/Japanese
WEA-K
WEARABLE EXPO Conference Keynote Session
Let's Innovate Together to Create the Metaverse
Yiwan Wong
Director, Technology Partnerships,
Realty Labs,
Meta Platforms Inc.

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<Details>

In this talk, I would like to share Meta's vision of what the Metaverse will look like and the values the Metaverse can bring to the user communities. I will provide a high-level view of some of the key technology challenges we face, and the innovations needed to make the Metaverse a reality.

<Speaker Profile>

Yiwan Wong is the Director of Technology Partnerships at Meta Platforms' Realty Labs, responsible for formation of engagement strategy and establishment of technical partnerships with external parties for Realty Labs' product development activities. Prior to that Yiwan help executive and management positions at leading technology companies including Samsung Electronics, Qualcomm, and Texas Instruments, among others.

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XR & Metaverse Frontiers Envisioned by NTT Group
Mikio Iwamura
Executive Vice President,

NTT QONOQ Inc.

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<Details>

NTT group envisions a future where XR provides an immersive medium for sharing ideas, and sets a mission to offer a business platform that enables editing of the physical and virtual spaces using XR. The talk puts such post-smartphone XR frontiers into perspective.

<Speaker Profile>

Mikio has over 20 years of experience at NTT DOCOMO, especially in the field of R&D including 3G/4G/5G standardization and development, and is currently an Executive Vice President at NTT QONOQ (established on 1 Oct 2022 as NTT DOCOMO subsidiary), responsible for developing XR businesses leveraging concepts of metaverse, digital twin, and XR devices. He is passionate about creating new experiences and business frontiers through provision of XR services, platform, and devices, that eventually elevates civilization into a new era.

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Smart Glasses Achieve DX in Manufacturing Sites!

Jan. 25 (Wed)
 
15:30
 - 
16:40
Free Session
WEA-S1
WEARABLE EXPO Conference Special Session 1
Manufacturing Site DX at Nissan Intelligent Factory
Yuichi Murai
Deputy General Manager,
Powertrain Production Engineering and Development Div.,
Nissan Motor Co., Ltd.

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<Details>

At the manufacturing site of the new Ariya e-powertrain assembly line, which is part of the Nissan Intelligent Factory, a work learning support system using mixed reality technology was introduced, and the learning period was reduced by 50%, and the instruction time was reduced by 90%. We will explain the issues at the time of introduction and future prospects.

<Speaker Profile>

April 1991 Joined Nissan Motor Co., Ltd. Since joining the company, he has consistently engaged in operations in the powertrain production department. In 2020, he assumed the position of Deputy General Manager of the Powertrain Production Technology Development Division after working on factory automation, the launch of an EV battery factory, and plans to introduce IoT into factories. He is in charge of planning, developing, and promoting the use of DX.

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DX for On-site Work with Wearables
Atsunari Tsuda
Deputy General Administrative Manager,
DX Div.,
Seiko Epson Corp.

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<Details>

While global economic is moved due to the effect of COVID-19 and the risk of geopolitics, a decentral society and the new era that can embrace diversity is coming, and our working style is also shifting. This document shows the current relation between the digital and the wearable that keep evolving in a changing environment with actual example.

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Forefront of Sleep Tech.: Improvement of Sleep Changes the World

Jan. 26 (Thu)
 
10:00
 - 
11:10
Free Session
WEA-S2
WEARABLE EXPO Conference Special Session 2
Sleep Sensing, History and Future
Seiji Nishino
Prodessor of Psychiatry & Behavioral Sciences,

Stanford Univresity School of Medicine/
Founder and Research Advisor,
Brain Sleep Co., Ltd.

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<Details>

The accuracy of wearable sleep sensing has been significantly improved thanks to heart rate variability analysis. The most important issue right now is how we use these data. The future of wearable sleep sensing from the point of view of sleep medicine will be discussed.

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From Good Sleep to Well-Being - Sleep is the foundation of health and performance.
Masashi Yanagisawa
President, CEO
International Institute for Integrative Sleep Medicine (WPI-IIIS), The University of Tsukuba
S'UIMIN Inc.
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Evolving Smart Factories with Technologies and Unique Challenges

                Early Bird Rate: 24,000JPY until Wed. December 21st! (Regular price: 27,000JPY)
Jan. 25 (Wed)
 
15:30
 - 
16:40
Paid Session
English/Japanese
FIW-K
FACTORY INNOVATION Week Keynote Session
Smart Factories a Lighthouse Journey toward Resilience
Erik Simonsson
Head of Industry 4.0,

Ericsson

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<Details>

Start with imagining what is possible when introducing state of the art technologies in a factory built from scratch.
Now hear the story in real time how Ericsson drives Smart Manufacturing and technology leadership in our own factories.
This talk will take you through our lighthouse Journey for the USA 5G Smart factory and give highlights on key use cases from our factories around the world.

<Speaker Profile>

Simonsson currently heads up Ericsson's global Industry 4.0 organization, including Industry 4.0 implementations, data strategies, and 5G adoption in manufacturing processes. He has more than 21 years of experience within Ericsson in various positions, primarily in manufacturing and R&D, located in Sweden (Stockholm), the United States (Dallas) and Estonia (Tallinn). Simonsson was educated in business and economics at Stockholm University.

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"Mazda's Monotsukuri" Flexible Production That Continues to Evolve with the Production Building Block Concept
Taketo Hironaka
Executive Officer, In charge of Production Engineering, Business Logistics, Carbon Neutrality and Cost Innovation,

Mazda Motor Corp.

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<Details>

Mazda has been promoting efficient production that can respond to major environmental changes such as CN and CASE responses through a production system of "valuing existing production assets and building up new assets as a block."
This presentation introduces the concept and the examples of the building block concept of flexible production.

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Issues and Keys of Introduction of Robot in Medium/Small Businesses

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
ROBO-S1
RoboDEX Conference Special Session 1
Trend in System Integration (SI) Development Is Digital Simulation -- Providing Valuable Information to Customers with Frontloading --
Kazuo Kubota
President,

Sanmei Mechanical Inc./
Chairman,
FA & Robot System Integrator Association

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<Details>

Front-loading, which makes full use of digital 3D simulation, will become the mainstream in future manufacturing. Simulate the customer's required specifications in a virtual space, check the operation according to the sequence, verify the takt time, and verify the robot program.

<Speaker Profile>

Joined Sanmei Mechanical Inc. in 1981, 1981 General Manager of Design Dept., 1986 General Manager of Manufacturing Dept., 1991 Managing Director, 1997 President and Representative Director.
Vice Chairman of Japan Robot Association, Chairman of FA / Robot System Integrator Association.

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Robot Policy Pursued by Ministry of Economy, Trade and Industry -- Toward the Realization of a Robot-friendly Environment --
Yohei Itabashi
Principal Deputy Director,
Robotics Policy Office, Industrial Machinery Div.,
Ministry of Economy, Trade and Industry

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<Details>

Promoting the introduction of robots in all industries is the key to coping with the megatrend of DX, social issues such as labor shortages, and the need for noncontact solutions due to the coronavirus pandemic. With such being the situation, the Ministry of Economy, Trade and Industry (METI) is promoting efforts to build robot-friendly environments, in which robots are introduced not by adapting them to given environments, but rather by making the business processes and facility environments of the introducing side transformed into those conducive to the deployment of robots. In addition, the presenter will introduce the robot policy that the Ministry of Economy, Trade and Industry (METI) is working on, including human resource development and R&D.

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The Robot Is a Labor Saving Device of the Limited Production of Diversified Products
Tadashi Takamaru
Representative Director,

Takamaru Engineers Co., Ltd.

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<Details>

From the standpoint of a robot system integrator, how to promote successful robotization, such as how to utilize robots for high-mix low-volume production, actual introduction cases at manufacturing companies nationwide, investment effects, characteristics of robots of each robot manufacturer, etc. The points and development examples are introduced.

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The Change of the Approach for the Robot
Hitoshi Nakiri
Production Director,

Ueda Brake Co., Ltd.

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<Details>

I introduce a description of strenuous efforts to begin with an easy idea that I can introduce it with the spread of robots in-house in a viewpoint from the user side with a real introduction example.

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Next-gen Robots From Overseas!

Jan. 26 (Thu)
 
12:30
 - 
13:40
Free Session
English/Japanese
ROBO-S2
RoboDEX Conference Special Session 2
Next Generation Legged Robotics
Roger Hebert
Sales Manager,

Boston Dynamics Inc.

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<Details>

Robots are becoming more widely used in our daily lives, and technology is moving very quickly. We will showcase the capabilities and applications of robots at Boston Dynamics that are available to today while highlighting robots that are still in development.

<Speaker Profile>

Roger Hebert is responsible for market development and sales of the Spot robot at Boston Dynamics. He holds a mechanical engineering degree from Virginia Tech and, throughout his career, was instrumental in launching new products for both the Smart Grid and Enterprise Asset Management markets. He has been involved in software and embedded control systems for over 20 years.

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Robots to the rescue - tackling labor shortage with next generation automation
Jason Barton
VP of Parcel Vertical Partnerships & Global Channels,

Dexterity, Inc.

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<Details>

The long-fabled "lights out warehouse" might be closer than you think. in order to make the warehouse of the future meet increasing speed and volume demands in the supply chain, we need to change our assumptions about what automation can do to solve the increasing need to deliver speed and scale with fewer resources. Dexterity solution with robot rescue these problem.

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Jan. 27 (Fri)
 
15:00
 - 
16:10
Free Session
ROBO-S3
RoboDEX Conference Special Session 3
Tomokazu Ichiriki
Consutant

Panasonic Connect Co., Ltd.

Promoting Simple and Slim Automation
Toshiya Shinoda
Chief Project General Manager,
PRODUCTION INNOVATION DEPT.,
AISIN Corp.

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<Details>

AISIN is promoting smart factories with the aim of creating efficient and pleasant factories. In promoting automation, we are focusing on optimization through the process and simple and slim modularization incorporating karakuri elements.
We will introduce the specific details of these activities.

<Speaker Profile>

After joining Aisin Seiki (now Aisin) in 1982, he was in charge of equipment planning and design. After that, as the factory manager of the prototype/machinery department, he promoted the development and introduction of innovative equipment and molds that greatly improved productivity. Since 2019, as CP (Chief Project General Manager), he has led the Aisin Group's labor-saving promotion activities.

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Metaverse & Digital Twin's Impact on Manufacturing

Jan. 25 (Wed)
 
13:00
 - 
14:10
Free Session
SFE-S1
SMART FACTORY Expo Conference Special Session 1
Digital Utilization Activities in the Manufacturing Field of Asahi-Kasei
Masahiko Nakayama
Senior General Manager,
Smart Factory Initiative, Digital Value Co-Creation,
Asahi Kasei Corp.

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<Details>

In manufacturing fields, we are facing variety of issues to be solved not only improving quality and yielding but also reducing CO2 emission, adapting to working population decline, safer operation of aged plants. To solve these issues, we pursue data-driven plants. I'll present our activities with some struggling and efforts.

<Speaker Profile>

I am an IT expert and I have more than 30 years of experience in utilizing the digital technology into the variety of fields. Beginning from 2018, I focus on realizing the industrial digital transformation of Asahi Kasei, one of the largest chemical companies in Japan.

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Realization of Digital Twin and Industrial Metaverse
Motoaki Nishiwaki
Evangelist,
Corporate Strategy and Planning,
Microsoft Japan Co., Ltd.

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<Details>

We will introduce the Industrial Metaverse, which combines the realization of the Digital Twin through IoT and Big Data with virtual reality. Attendees will gain an in-depth understanding of the digital twin and industrial metaverse, which will have a significant impact on all industries as well as manufacturing factories.

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Smart Factory Case Study : Solve Challenges and Generate Value

Jan. 26 (Thu)
 
12:30
 - 
13:40
Free Session
SFE-S2
SMART FACTORY Expo Conference Special Session 2
Digital and Circular Manufacturing, Mitsubishi Electric's DX and Its Implementation
Yuji Ichioka
General Manager,
Software System Dept., Nagoya Works,
Mitsubishi Electric Corp.

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<Details>

Mitsubishi Electric, a component supplier, is turning the helm to digital solutions at a stroke due to a sense of urgency about data utilisation and DX. The need for and initiatives in this area will be explained, together with practical details.

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Soft-ware Package for Guarantee of Quality, NAVINECT Corresponding to the Data Integrity
Hiroshi Matsumoto
Manager,
NAVINECT Sales Promotion,
TOPPAN Inc.

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<Details>

As a social problem, food HACCP, pharmaceutical GMP, CSV, product liability law and inspection of the overall manufacturer have a forged problem. As correspondence is possible, in NAVINECT , I introduce in how to fit for a data integrity, qualification by NAVINECT soft-ware combination of abundant package group.

<Speaker Profile>

Working for Toppan Printing 30 years. Sales manager, the manager of Business Strategy Dept., production control manager, the manager of Sales Promotion Dept.

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Smart Cosmetics Factories: Latest Cases

Jan. 26 (Thu)
 
15:00
 - 
16:10
Free Session
SFE-S3
SMART FACTORY Expo Conference Special Session 3
Shiseido's Manufacturing to Be Strived -After the Start-up of Fukuoka Kurume Factory-
Nozomu Oikawa
General Manager,
Fukuoka Kurume Factory,
SHISEIDO Co., Ltd.

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<Details>

Shiseido, which celebrated its 150th anniversary in 2022, is currently implementing the mid-to-long-term strategy "WIN 2023 and Beyond", and is working to expand sales of premium skin beauty brands based on market recovery and improve cost rate. We are going to introduce Shiseido's Manufacturing to be strived for continued structural reforms and further expansion of profitability and productivity with the case of Fukuoka Kurume Factory started up in 2022.

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How to Start Green Factories: Why Now?

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
GFE-S1
GREEN FACTORY Expo Conference Special Session 1
GX for Japan's Manufacturing Industry - Toward Decarbonizing Entire Value Chain
Issui Ihara
Partner, Public Sector,

Deloitte Tohmatsu Consulting LLC

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<Details>

The decarbonization of the value chain is required, not just the thorough implementation of on-site energy conservation and the procurement of renewable energy and the introduction of generators.
This section will discuss GX beyond the company's own framework from the viewpoints of energy and material flows.

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Japan's Strategy for Carbon Neutral in 2050
Yuko Miwata
Director, Energy and Environment Innovation Strategy Office,
Environmental Policy Div., Industrial Science and Technology, Policy and Environment Bureau,
Ministry of Economy, Trade and Industry

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<Details>

Toward 2050 Carbon Neutrality, The Interim Clean Energy Strategy was compiled in 2022 May. This presentation provides an overview of the Strategy and related recent government actions.

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How to Achieve Carbon Neutrality in Factories : Case Studies from SMEs and Big Companies

Jan. 26 (Thu)
 
10:00
 - 
11:10
Free Session
GFE-S2
GREEN FACTORY Expo Conference Special Session 2
Asahi Tekko's CN Promotion by IoT Data on Operation and Power Consumption
Tetsuya Kimura
President CEO,

i Smart Technologies Co., Ltd./
President,
ASAHI Tekko Co., Ltd.

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<Details>

Asahi Tekko has reduced labor costs by 400 million yen a year and reduced power consumption by 22% through kaizen using IoT data on operation and power consumption. In this presentation, Asahi Tekko's CN promotion method will be explained together with specific examples of consumption reduction.

<Speaker Profile>

1992 Graduated from the University of Tokyo Graduate School, engaged in vehicle technology development and Toyota Production System practice at Toyota Motor Corp. Transferred to Asahi Tekko in 2013, implemented DX based on self-developed IoT, greatly improved profitability through Kaizen activities, and established i Smart Technologies, a new company that provides IoT systems and Kaizen know-how.

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Suntory Group's Decarbonization Strategy and Initiatives
Shigeaki Kazama
Executive Officer,
Deputy Division COO,
Sustainability Management Div.,
Suntory Holdings Ltd.

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<Details>

Suntory, whose corporate philosophy is "To Create Harmony with People and Nature", aims to achieve net zero GHG emissions across the whole value chain by 2050 and reduce GHG emissions from our direct operations by 50%. We would like to introduce our strategy and examples of our initiatives.

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For RE100 -- Key for Success & Concrete Plans

Jan. 27 (Fri)
 
12:30
 - 
13:40
Free Session
GFE-S3
GREEN FACTORY Expo Conference Special Session 3
Deployment of the RE100 Solutions Utilizing Pure Hydrogen Fuel Cell
Mitsutoshi Shigeta
Executive Officer, CGXO, Vice President / Energy Business, Electric Works Company, Director, Energy Systems Business Div.,

Panasonic Corp.

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<Details>

Aiming for the RE100 realization that doesn't depend on the grid power, Panasonic's fuel cell factory started demonstration of "The RE100 Solutions utilizing Pure Hydrogen Fuel Cell".
We'll introduce development of the green factory, its system specifications, the advantages of hydrogen utilization and the analysis of its operational data.

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Sony Group's 100% Renewable Electricity Procurement
Tetsu Inoue
Senior Manager,
EHS Group, Corporate Workplace Solutions Dept.,
Sony Group Corp.

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<Details>

We will explain Sony Group's 100% Renewable Electricity procurement, policy, target, and the way of procurement.

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Carbon Neutrality and Sustainable Management in the Logistics Industry

                Early Bird Rate: 24,000JPY until Wed. December 21st! (Regular price: 27,000JPY)
Jan. 25 (Wed)
 
13:00
 - 
14:10
Paid Session
SLE-K
SMART LOGISTICS Expo Conference Keynote Session
Modal Shift Efforts in Freight Railway Transportation
Jun Yoshizawa
Managing Director,
Railway Business Headquarters,
Japan Freight Railway Co.

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<Details>

Freight rail transport has the excellent environmental characteristics of having the lowest CO2 emissions, and has the efficiency of being able to carry a large amount of freight with a single driver. Based on the "JR Freight Group Long-Term Vision 2030," we will utilize the advantages of these characteristics to promote environmentally friendly business operations and contribute to the realization of a green society, carbon-neutral in 2050.

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Yamato Group's Commitment to Sustainable Management
Yoshiko Akiyama
Executive Officer (Sustainability Promotion Dept. Manager),

Yamato Transport Co., Ltd.

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<Details>

Committed to sustainable management under the environmental vision "Connecting, Delivering the Future, Green Logistics", aiming to achieve practically zero greenhouse gas emissions on an intra-company basis by 2050. Environmental issues are a theme that should be addressed by the industry as a whole. We are determined to lead the industry toward "green logistics" in cooperation with stakeholders.

<Speaker Profile>

In April 1988, joined Yamato Transport Co. In 2010, served as head of Environment Promotion Office of CSR Promotion Department. In 2014, as Vice President of the Kansai Branch. In 2018, as Executive Officer and General Manager of the Chugoku Branch. In 2020, as Managing Executive Officer in charge of sales and services. In January 2021, announced Sustainable Medium-Term Plan 2023 [Environment and Society] and has been in her current position since April of the same year.

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Year 2024 Problem: What to Work for DC in Logistics

Jan. 26 (Thu)
 
15:00
 - 
16:10
Free Session
SLE-S1
SMART LOGISTICS Expo Conference Special Session 1
Countdown 2024 Problem! What Manager of Logistics Company Should Tackle by the End of the Year.
Naoyuki Hashimoto
Managing Director,

Funai Soken Logistics Inc.

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<Details>

1 year left until 2024. Explain the measures that small and medium-sized logistics companies should take to survive such as optimizing freight rates and transportation conditions, reforming the wage system, promoting human resource recruitment, and promoting new sales, while introducing advanced concrete examples.

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What Is the Logistics DX Platform That Japan Post and Rakuten Are Aiming for?
Yoshihiro Gomi
Logistics Strategy Div.,
Executive Officer,
JAPAN POST Co., Ltd.

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<Details>

In 2021, Japan Post and Rakuten jointly established JP Rakuten Logistics. What is the logistics DX that Japan Post and Rakuten are aiming for, and what we are doing through JP Rakuten Logistics.

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Toshiharu Sato
Director,
Commerce Company Logistics Business,
Rakuten Group Inc.
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Warehouse DX and Robotics Technology in Manufacturing Industry: Case Studies

Jan. 27 (Fri)
 
10:00
 - 
11:10
Free Session
SLE-S2
SMART LOGISTICS Expo Conference Special Session 2
Smart Inventory System
Takuya Tanaka

Raw Materials & Resources Group, Business Development Office, Purchase & Logistics Div.,
AGC Inc.

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<Details>

Glass factories procure raw materials and fuels. But, it took a lot of time to check inventory to respond to complicated production plans. "Smart Inventory System" is the automatic management system developed by AGC, which enables real-time grasping of warehouses and remote monitoring of remaining tanks.

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AutoStore Next Stage
Masaaki Nakamura
Business Development Manager,

AutoStore System

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<Details>

AutoStore was founded in Norway in 1996 and established its Japanese subsidiary in 2019. It is a global company with 1000+ installations worldwide and 50+ in Japan. The company invented the "Cube Storage Automation" and continues to be a pioneer in this field.

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Latest Trends of Rapidly Evolving in-vehicle Electronics and Mounting Technologies

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
English/Japanese
ISP-1
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 1
Course Leader:Chiaki Takubo, KIOXIA Corp.
Sub Course Leader:Shigeki Sako, Amkor Technology Japan, Inc.
Roadmap for Next Generation xEV in 2030 and Its Technical Trend of Power Devices Applications
Masayoshi Yamamoto
Professor,
Institute of Materials and Systems for Sustainability (IMaSS),
Nagoya University

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<Details>

Power electronics technical trends and predictions for Next Generation xEVs in 2030 will discuss from the power semiconductor device module techniques, the current sensor application techniques and the material application techniques point of views for the e-Axle and the in-wheel motor systems.

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Trends of Automotive Semiconductors for CASE and Challenges in Packaging Technology
Shinji Baba
Senior Principal Specialist,
Packaging Technology Div., Production and Technology Unit,
Renesas Electronics Corp.

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<Details>

Semiconductors such as SoCs for thinking, MCUs for control, and Analog/Power devices for actuating have various packaging technology challenges. The examples are high speed signaling, electromigration by high current, and isolation for high voltage. We introduce trends in the safe and secure packaging technologies we are pursuing, focusing on autonomous driving and electrification.

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3D Packaging Technology for the Latest Logic and Power Devices

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
English/Japanese
ISP-2
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 2
Course Leader:Tsutomu Sekiya, C. Uyemura & Co., Ltd.
Sub Course Leader:Keiichiro Kata, Renesas Electronics Corp.
Advanced 3D Packaging and Integration Technology
Takafumi Fukushima
Associate Professor,

Tohoku University

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<Details>

From the dichotomization between TSV-less FOWLP and CoWoS with TSV, advanced interposers and technologies that fuse the two have emerged one after another, bringing us to an era in which semiconductor system performance is determined by microelectronics packaging. The latest trends in these technologies, including solderless Cu-Cu hybrid bonding, will be discussed.

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Advanced Sinter Joining for Power Devices
Katsuaki Suganuma
Director,
Flexible 3D System Integration Lab.,
Osaka University

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<Details>

With the commercialization of SiC, the advance in packaging material technology is remarkable. Silver (Ag) sinter joining is applied to wiring and TIM developments not only to die attach in order to improve heat dissipation. There is no need to use nanoparticles, and high performance can be realized without any concern in affordability.

<Speaker Profile>

He received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center of ISIR in 2007-2009, the director of ISIR in 2018-2020. He is currently Specially Appointed Professor and Professor Emeritus of Osaka University.

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Semiconductor Power Devices (Si, SiC) That will Achieve Low-carbon Society

Jan. 25 (Wed)
 
15:30
 - 
17:00
Free Session
English/Japanese
ISP-3
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 3
Course Leader:Takashi Matsumoto, DENSO Corp.
Sub Course Leader:Chiaki Takubo, KIOXIA Corp.
Power Device Development Trends Supporting the Realization of a Low-carbon Society
Shinichi Izuo
Dept. manager,
Mitsubishi Electric Corp.

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<Details>

To realize a low-carbon society, power electronics technology has a wide range of applications, including in the automotive, railway, industrial, consumer, and renewable energy sectors. Power devices as key parts are evolving to meet various market needs such as small size, high function, light weight and long life by applying not only Si but also wide bandgap semiconductors such as SiC. Technological developments supporting these evolutions are introduced.

<Speaker Profile>

Shinichi Izuo received his BSc and MSc in material engineering from Kyoto University, Japan in 1996 and 1998, respectively. In the same year, he joined Mitsubishi Electric Corporation, Japan. He has been engaged in the development of microfabrication technology and automotive sensors. He had been involved in power module development since 2010 and assumed his current position since April 2022.

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Chinese Government' Support for the Semiconductor Industry and the Latest Trends of SiC for Vehicle
Yao Ying
General Manager,

Beijing Fuji Chimera Consulting

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<Details>

Based on the Chinese government's support for the semiconductor industry, the latest trends of SiC and GaN attracting attention toward the dual carbon goals, will be introduced as well as the application cases of automobile industry and development direction of local semiconductor manufacturers.

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Key to the 3D Package Supply Chain: Development Trends and Future Perspective on the Latest Substrate Technology

Jan. 26 (Thu)
 
12:30
 - 
14:00
Free Session
English/Japanese
ISP-4
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 4
Course Leader:Keiichiro Kata, Renesas Electronics Corp.
Sub Course Leader:Katsuhiko Suzuki, Showa Denko Materials Co., Ltd.
Semiconductor Package Substrate Development Trends Driving Heterogeneous Integration
Kiyoshi Oi
Senior Manager,
Process Development dept., RESEARCH & DEVELOPMENT Div.,
SHINKO ELECTRIC INDUSTRIES Co., Ltd.

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<Details>

Increasing size, density, and multi-device integration of semiconductor packages have come to play a role in improving the characteristics of electronic devices. Substrate and assembly technology are key elements in the evolution of semiconductor packages, We will introduce the trends of these technologies and our initiative for the advanced package.

<Speaker Profile>

After graduating from Tohoku University Graduate School of Engineering, started work at SHINKO ELECTRIC INDUSTRIES Co., Ltd. in 2001. Since, engaged in the development of embedded substrate, fine pitch flip-chip and organic interposer assembly technology.

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Substrate Solution Technology Delivering High-speed and High-performance for 3D Packaging
Yoshikazu Uehara
Dept. Manager,
Board Solution and Development Dept,. Engineering and Development Div., Corporate Organic Materials Semiconductor Components Group,
KYOCERA Corp.

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<Details>

3D packaging requires co-design of chip, package and board for high-density design and optimal power/signal quality. In addition to package-board co-design, Kyocera works with ASIC vendors and power supply vendors to achieve the optimal overall system design.

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Technologies That Support Post-5G/6G

Jan. 26 (Thu)
 
12:30
 - 
14:00
Free Session
English/Japanese
ISP-5
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 5
Course Leader:Shinichi Kajiya, Sumitomo Bakelite Co., Ltd.
Sub Course Leader:Takashi Matsumoto, DENSO Corp.
Technology for Antenna-array Integrated Module and Initiative for Terahertz Communication
Hideki Ueda
Principal Researcher,
mmWave Business Promotion Dept., Communication Modules Div.,
Murata Manufacturing Co., Ltd.

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<Details>

Antenna-array integrated module (AiM) which integrates antennas, RFIC, connector, etc. is used at the millimeter-wave band. The author will present the background of the AiM utilization and technologies for AiM. Feasibilities for the terahertz communication will also be presented.

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Heterogeneous Integration of III-V Devices for Si Photonics Circuits
Shinji Matsuo
Senior Distinguished Researcher,
NTT Corp.

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<Details>

Research and development for the integration of heterogeneous materials with compound semiconductors is being actively pursued for further advancement of silicon photonics technology. In this talk, we will describe the hetero-integration technology using compound semiconductor membrane devices at NTT.

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Exploring the Technology Trends of the Latest Semiconductor Packaging That Lead the DX Revolution in Post-COVID-19

Jan. 27 (Fri)
 
10:00
 - 
11:30
Free Session
English/Japanese
ISP-6
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 6
Course Leader:Shigeki Sako, Amkor Technology Japan, Inc.
Sub Course Leader:Shinichi Kajiya, Sumitomo Bakelite Co., Ltd.
Technology Trends of the Chiplet Package Technology toward Dx/ Society 5.0
Toshihiko Nishio
CEO,

SBR Technology Co., Ltd.

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<Details>

Toward the society 5.0 Era., various types of chiplet packages will be deployed to realize the high performance of scalable AI accelerators, CPUs and Network ICs. This will also be rolled out in infrastructure and client products. Future developments of various chiplet packages, their advantages and roadmaps, and chip-to-chip connection design rules and standardization will be explained.

<Speaker Profile>

1988: IBM Japan
2011: STATSChipPAC Japan
2015: SBR Technology

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Optical Packaging Technology for the Silicon Photonics Optical Transceiver IOCore and Development Trends
Kazuhiko Kurata
CTO, Board of Directors,
AIO Core CO., LTD.

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<Details>

AIOCore develops, manufactures and markets the "IOCore" ultra-compact optical transceiver. Currently, the development up to 128Gbps (32Gbps/ch) has been completed and sales have started, and the next model is being developed.
The singularity of optical mounting technology comes down to optical connections. Trends and future prospects are introduced focusing on the implementation technology applied to "IOCore".

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Latest Market and Technology Trend of 5G Smartphones

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
PWB-1
PWB EXPO Technical Session 1
Course Leader:Hirofumi Matsumoto, FlexLink Technology Co., Ltd.
Sub Course Leader:Masaki Yamaguchi, Showa Denko Materials Co., Ltd.
The Current Situation of mmWave 5G Smartphone Which Does Not Attract Attention
Hirotaka Ueda
Representative,

Semi Consult

See More Details▼

<Details>

Though the mmWave 5G service was started on April 5, 2019, it does not show the actual situation of the service in other countries. Through my teardown analysis, I introduce the current situation of the terminal technology of mmWave 5G smartphone which passed through nearly three years from service in.

Close▲


Smartphone Sector Outlook
Yasuo Nakane
Global Head of Technology Research/Senior Analyst,
Equity Research Dept.,
Mizuho Securities Co., Ltd.

See More Details▼

<Details>

I analyze the latest smartphone sector situation and outlook for 2023 onwards from various different perspectives such as 1) Brand incl. Samsung, Apple, Oppo and Xiaomi, 2) Milliwave and Sub6, 3)Semiconductor incl. APs, 4) Displays such as LCD, OLED and touch panels, 5) Form factor incl. foldable, 6)Cameras, 7)Watches and peripherals such as AR goggles.

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Latest Electronics Technologies for Automotive Applications

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
PWB-2
PWB EXPO Technical Session 2
Course Leader:Koji Ikawa, CMK Corp.
Sub Course Leader:Mitsuaki Toda, Meiko Electronics Co., Ltd.
In-car Networking Analysis, from Teardown of Tesla Model 3, VW ID.3 and Toyota MIRAI
TADASHI NAKAMICHI
Editor in Chief of Nikkei Electronics,

Nikkei BP Inc.

See More Details▼

<Details>

Nikkei BP has disassembled and analyzed the Tesla Model 3, the Volkswagen ID.3, and the Toyota Mirai (with Advanced Drive). In this lecture, the speakers will present their analysis of the topology of the automotive network, the configuration of ECUs, and the design philosophies of each manufacturer.

<Speaker Profile>

Joined Nikkei BP in 1997. After working as a technical reporter at Nikkei BYTE, Nikkei Communications, and Nikkei Electronics, he served as Deputy Editor of Nikkei Electronics and Editor-in-Chief of the Real Kaihastukaigi before assuming his current position in January 2020.

Close▲


Current Status and Technology Trends of Printed Wiring Boards for Automobiles
Hideyuki Ohtsuka
Team Leader,
Planning & Public relations Team Development Marketing Section Development Technology Dept.,
CMK Co., Ltd.

See More Details▼

<Details>

With the rapid computerization and electrification of automobiles, the requirements for printed wiring boards are diversifying. This time, we will introduce the features of printed wiring boards that meet these demands and future technological trends.

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SiC Power Semiconductors and High-current & High-heat Dissipation PCBs for Evs

Jan. 25 (Wed)
 
15:30
 - 
17:00
Free Session
English/Japanese
PWB-3
PWB EXPO Technical Session 3
Course Leader:Mitsuaki Toda, Meiko Electronics Co., Ltd.
Sub Course Leader:Koji Ikawa, CMK Corp.
SiC Solutions for Automotive and Industrial Market
Ryo Fuchizaki
Engineer,

ROHM Co., Ltd.

See More Details▼

<Details>

Silicon Carbide (SiC) devices have emerged as the most viable candidate for next-generation, low-loss semiconductors due to its low ON resistance and superior high-temperature, high-frequency, and high-voltage performance when compared to silicon.
This presentation will introduce the trends of SiC devices in the automotive and industrial equipment markets.

Close▲


Printed Circuit Boards for Power Electronic Applications
Thomas Gottwald
Vice President Technology,

Schweizer Electronic AG

See More Details▼

<Details>

Increasing power demand for Automotive applications brings new challenges for Printed circuit boards. It will be presented, how new PCB technologies can help to carry highest currents, to dissipate power losses and to help in miniaturization to achieve high power denities.

<Speaker Profile>

Thomas Gottwald started his career at Schweizer Electronic AG in 1991. In his current role as Vice President Technology, he is responsible for the departments Front End, Product Management and Innovations. His technical focus is on embedding technologies, power electronics, electronic materials, and thermal management.

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Technology Development Trends That Support the Development of Next-gen. In-vehicle High-frequency Devices

Jan. 26 (Thu)
 
10:00
 - 
11:30
Free Session
PWB-4
PWB EXPO Technical Session 4
Course Leader:Yuki Hirokawa, Panasonic Industry Co., Ltd.
Sub Course Leader:Hirofumi Matsumoto, FlexLink Technology Co., Ltd.
Halogen-free Ultra-low Transmission Loss Multi-layer Circuit Board Material for mm-Wave Radar, XPEDION1
Daigo Hiratsuka
Staff Engineer,
Product Development Dept., Circuit Board Materials Business Unit., Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.

See More Details▼

<Details>

As the development of ADAS (advanced driver assistance system) and autonomous driving progresses, millimeter wave radar is used as a sensing technology that supports them. Low transmission loss is required for antenna substrates that transmit and receive millimeter waves. At present, fluororesin substrate materials are mainly used for antennas, but due to the characteristics of resin, processing during substrate manufacturing is difficult and expensive.
At this time, we introduce "halogen-free ultra-low transmission loss substrate material XPEDION1" that achieves both excellent low transmission loss and processabillity by utilizing our original resin design technology and low-roughened copper foil bonding technology.

Close▲


R&D Activities for Low Transmission Loss Base Materials for mmWave Applications
Henry Utsunomiya
CEO,

Interconnection Technologies, Inc.

See More Details▼

<Details>

mmWave radar is under production for both automotive and industrial applications. The long range radar is enable to ADAS, however improvement is required for autonomous driving. The base materials for this application required smaller Dk/Df with smooth conductor surface. R&D activities of base materials will be discussed.

<Speaker Profile>

Co-chairman of iNEMI roadmap organic substrate TG, Chairman of JPCA Technology Roadmap for PWBs, Working Group Chairman of Jisso Technology Roadmap (JEITA) for more than 20 years.

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Latest Technology Trends of Cutting-edge Package Substrates That Achieves High Density

Jan. 26 (Thu)
 
10:00
 - 
11:30
Free Session
PWB-5
PWB EXPO Technical Session 5
Course Leader:Masaki Yamaguchi, Showa Denko Materials Co., Ltd.
Sub Course Leader:Hiroshi Iinaga, OKI Circuit Technology Co., Ltd.
The Latest Lithography Technologies Required for Advanced Packaging Substrate
Koichiro Saito

Sales Dept., Photon Process GBU, System Solution Div.,
USHIO Inc.

See More Details▼

<Details>

Semiconductor package substrates are based on PWB technology, but also require extremely high density. In recent years, this trend has accelerated due to the evolution of chiplets and the like. In this session, the exposure technology required for such advanced package substrates and the strategies of Ushio Inc. will be introduced.

<Speaker Profile>

Joined Ushio Inc. in April 2017. Since then, he has been involved with expanding sales of steppers for advanced package substrates, the UX-5 series, and exposure equipment for wafers, the UX-4 series. Since 2021, he has been in charge of package substrate market strategy, up to the present.

Close▲


Semiconductor Package Development Enabling High Density Integration
Noritaka Katagiri
Senior Director,
Research & Development Div.,
Shinko Electric Industries Co., Ltd.

See More Details▼

<Details>

In semiconductor package substrate, high density integration is further progressing. This trend can realize by the structures that allow chips with multiple functions mounted on the same substrate, such as chiplets. We will present the status of elemental technology development for higher integration of substrates.

Close▲


Photosensitive Films for High Density PKG
Kenichi Iwashita
Senior Researcher,
Photosensitive Materials R&D Dept.,
Showa Denko Materials Co., Ltd.

See More Details▼

<Details>

To accelerate high-speed communication in advanced semiconductor packages, Cu wiring is becoming narrower. The required rule is below 10 micron. We will report on development methods and future trends of photosensitive films that can achieve fine pattern formation.

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Trends of Next-gen Fluorine Resin Materials in the 6G and Terahertz Era

Jan. 27 (Fri)
 
12:30
 - 
14:00
Free Session
PWB-6
PWB EXPO Technical Session 6
Course Leader:Hiroshi Iinaga, OKI Circuit Technology Co., Ltd.
Sub Course Leader:Yuki Hirokawa, Panasonic Industry Co., Ltd.
Low Loss Fluoropolymer CCL for High Frequency Band
Takaoki Maeyama
Manager,

Chukoh Chemical Industries, Ltd.

See More Details▼

<Details>

The core technology of Chukoh Chemical Industries, Ltd. is the processing for fluoropolymer products, and our fluoropolymer copper clad laminate is the product that makes use of this technology. This time, we will introduce the types and characteristics of the fluoropolymer CCL for high-frequency bands, which has extremely low-loss characteristics among materials.

Close▲


Next Generation PTFE Substrate and New Solution of Using Same
Tatsunari Koyama
Manager,
Tokyo Sales Engineering Group,
Nippon Pillar Packing Co., Ltd.

See More Details▼

<Details>

Conventionally PTFE substrates have been recognized attractive thanks to low Dk and Df, but for multi-layered PCB, PTFE have some difficulty on fabrication. In this session, we propose new PTFE build-up multi-layered PCB with thermosetting bonding film fabricated with usual PCB process. Additionally, we introduce some key development results from material and design points of view. 

<Speaker Profile>

He graduated Osaka university in 1999. He has over 15 years experience in developing analog semiconductor. From 2016, he engaged in developing PTFE substrate and now is a sales engineer.

Close▲


Low Loss Adhesive Film for Multilayer PTFE Substrate AS-400HS
Masaki Yamaguchi
Senior Researcher,
Laminate Materials R&D Dept., R&D Center, Electronics Business Headquarters,
Resonac Corp.

See More Details▼

<Details>

Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising in beyond 5G and 6G society. With these background, we have developed a bonding film for PTFE multilayer substrate.

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Select this seminar
 

Latest Market and Technology Trend of 5G Smartphones

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
PWB-1
PWB EXPO Technical Session 1
Course Leader:Hirofumi Matsumoto, FlexLink Technology Co., Ltd.
Sub Course Leader:Masaki Yamaguchi, Showa Denko Materials Co., Ltd.
The Current Situation of mmWave 5G Smartphone Which Does Not Attract Attention
Hirotaka Ueda
Representative,

Semi Consult

See More Details▼

<Details>

Though the mmWave 5G service was started on April 5, 2019, it does not show the actual situation of the service in other countries. Through my teardown analysis, I introduce the current situation of the terminal technology of mmWave 5G smartphone which passed through nearly three years from service in.

Close▲


Smartphone Sector Outlook
Yasuo Nakane
Global Head of Technology Research/Senior Analyst,
Equity Research Dept.,
Mizuho Securities Co., Ltd.

See More Details▼

<Details>

I analyze the latest smartphone sector situation and outlook for 2023 onwards from various different perspectives such as 1) Brand incl. Samsung, Apple, Oppo and Xiaomi, 2) Milliwave and Sub6, 3)Semiconductor incl. APs, 4) Displays such as LCD, OLED and touch panels, 5) Form factor incl. foldable, 6)Cameras, 7)Watches and peripherals such as AR goggles.

Close▲

Select this seminar
 

Latest Electronics Technologies for Automotive Applications

Jan. 25 (Wed)
 
13:00
 - 
14:30
Free Session
PWB-2
PWB EXPO Technical Session 2
Course Leader:Koji Ikawa, CMK Corp.
Sub Course Leader:Mitsuaki Toda, Meiko Electronics Co., Ltd.
In-car Networking Analysis, from Teardown of Tesla Model 3, VW ID.3 and Toyota MIRAI
TADASHI NAKAMICHI
Editor in Chief of Nikkei Electronics,

Nikkei BP Inc.

See More Details▼

<Details>

Nikkei BP has disassembled and analyzed the Tesla Model 3, the Volkswagen ID.3, and the Toyota Mirai (with Advanced Drive). In this lecture, the speakers will present their analysis of the topology of the automotive network, the configuration of ECUs, and the design philosophies of each manufacturer.

<Speaker Profile>

Joined Nikkei BP in 1997. After working as a technical reporter at Nikkei BYTE, Nikkei Communications, and Nikkei Electronics, he served as Deputy Editor of Nikkei Electronics and Editor-in-Chief of the Real Kaihastukaigi before assuming his current position in January 2020.

Close▲


Current Status and Technology Trends of Printed Wiring Boards for Automobiles
Hideyuki Ohtsuka
Team Leader,
Planning & Public relations Team Development Marketing Section Development Technology Dept.,
CMK Co., Ltd.

See More Details▼

<Details>

With the rapid computerization and electrification of automobiles, the requirements for printed wiring boards are diversifying. This time, we will introduce the features of printed wiring boards that meet these demands and future technological trends.

Close▲

Select this seminar
 

SiC Power Semiconductors and High-current & High-heat Dissipation PCBs for Evs

Jan. 25 (Wed)
 
15:30
 - 
17:00
Free Session
English/Japanese
PWB-3
PWB EXPO Technical Session 3
Course Leader:Mitsuaki Toda, Meiko Electronics Co., Ltd.
Sub Course Leader:Koji Ikawa, CMK Corp.
SiC Solutions for Automotive and Industrial Market
Ryo Fuchizaki
Engineer,

ROHM Co., Ltd.

See More Details▼

<Details>

Silicon Carbide (SiC) devices have emerged as the most viable candidate for next-generation, low-loss semiconductors due to its low ON resistance and superior high-temperature, high-frequency, and high-voltage performance when compared to silicon.
This presentation will introduce the trends of SiC devices in the automotive and industrial equipment markets.

Close▲


Printed Circuit Boards for Power Electronic Applications
Thomas Gottwald
Vice President Technology,

Schweizer Electronic AG

See More Details▼

<Details>

Increasing power demand for Automotive applications brings new challenges for Printed circuit boards. It will be presented, how new PCB technologies can help to carry highest currents, to dissipate power losses and to help in miniaturization to achieve high power denities.

<Speaker Profile>

Thomas Gottwald started his career at Schweizer Electronic AG in 1991. In his current role as Vice President Technology, he is responsible for the departments Front End, Product Management and Innovations. His technical focus is on embedding technologies, power electronics, electronic materials, and thermal management.

Close▲

Select this seminar
 

Technology Development Trends That Support the Development of Next-gen. In-vehicle High-frequency Devices

Jan. 26 (Thu)
 
10:00
 - 
11:30
Free Session
PWB-4
PWB EXPO Technical Session 4
Course Leader:Yuki Hirokawa, Panasonic Industry Co., Ltd.
Sub Course Leader:Hirofumi Matsumoto, FlexLink Technology Co., Ltd.
Halogen-free Ultra-low Transmission Loss Multi-layer Circuit Board Material for mm-Wave Radar, XPEDION1
Daigo Hiratsuka
Staff Engineer,
Product Development Dept., Circuit Board Materials Business Unit., Electronic Materials Business Div.,
Panasonic Industry Co., Ltd.

See More Details▼

<Details>

As the development of ADAS (advanced driver assistance system) and autonomous driving progresses, millimeter wave radar is used as a sensing technology that supports them. Low transmission loss is required for antenna substrates that transmit and receive millimeter waves. At present, fluororesin substrate materials are mainly used for antennas, but due to the characteristics of resin, processing during substrate manufacturing is difficult and expensive.
At this time, we introduce "halogen-free ultra-low transmission loss substrate material XPEDION1" that achieves both excellent low transmission loss and processabillity by utilizing our original resin design technology and low-roughened copper foil bonding technology.

Close▲


R&D Activities for Low Transmission Loss Base Materials for mmWave Applications
Henry Utsunomiya
CEO,

Interconnection Technologies, Inc.

See More Details▼

<Details>

mmWave radar is under production for both automotive and industrial applications. The long range radar is enable to ADAS, however improvement is required for autonomous driving. The base materials for this application required smaller Dk/Df with smooth conductor surface. R&D activities of base materials will be discussed.

<Speaker Profile>

Co-chairman of iNEMI roadmap organic substrate TG, Chairman of JPCA Technology Roadmap for PWBs, Working Group Chairman of Jisso Technology Roadmap (JEITA) for more than 20 years.

Close▲

Select this seminar
 

Latest Technology Trends of Cutting-edge Package Substrates That Achieves High Density

Jan. 26 (Thu)
 
10:00
 - 
11:30
Free Session
PWB-5
PWB EXPO Technical Session 5
Course Leader:Masaki Yamaguchi, Showa Denko Materials Co., Ltd.
Sub Course Leader:Hiroshi Iinaga, OKI Circuit Technology Co., Ltd.
The Latest Lithography Technologies Required for Advanced Packaging Substrate
Koichiro Saito

Sales Dept., Photon Process GBU, System Solution Div.,
USHIO Inc.

See More Details▼

<Details>

Semiconductor package substrates are based on PWB technology, but also require extremely high density. In recent years, this trend has accelerated due to the evolution of chiplets and the like. In this session, the exposure technology required for such advanced package substrates and the strategies of Ushio Inc. will be introduced.

<Speaker Profile>

Joined Ushio Inc. in April 2017. Since then, he has been involved with expanding sales of steppers for advanced package substrates, the UX-5 series, and exposure equipment for wafers, the UX-4 series. Since 2021, he has been in charge of package substrate market strategy, up to the present.

Close▲


Semiconductor Package Development Enabling High Density Integration
Noritaka Katagiri
Senior Director,
Research & Development Div.,
Shinko Electric Industries Co., Ltd.

See More Details▼

<Details>

In semiconductor package substrate, high density integration is further progressing. This trend can realize by the structures that allow chips with multiple functions mounted on the same substrate, such as chiplets. We will present the status of elemental technology development for higher integration of substrates.

Close▲


Photosensitive Films for High Density PKG
Kenichi Iwashita
Senior Researcher,
Photosensitive Materials R&D Dept.,
Showa Denko Materials Co., Ltd.

See More Details▼

<Details>

To accelerate high-speed communication in advanced semiconductor packages, Cu wiring is becoming narrower. The required rule is below 10 micron. We will report on development methods and future trends of photosensitive films that can achieve fine pattern formation.

Close▲

Select this seminar
 

Trends of Next-gen Fluorine Resin Materials in the 6G and Terahertz Era

Jan. 27 (Fri)
 
12:30
 - 
14:00
Free Session
PWB-6
PWB EXPO Technical Session 6
Course Leader:Hiroshi Iinaga, OKI Circuit Technology Co., Ltd.
Sub Course Leader:Yuki Hirokawa, Panasonic Industry Co., Ltd.
Low Loss Fluoropolymer CCL for High Frequency Band
Takaoki Maeyama
Manager,

Chukoh Chemical Industries, Ltd.

See More Details▼

<Details>

The core technology of Chukoh Chemical Industries, Ltd. is the processing for fluoropolymer products, and our fluoropolymer copper clad laminate is the product that makes use of this technology. This time, we will introduce the types and characteristics of the fluoropolymer CCL for high-frequency bands, which has extremely low-loss characteristics among materials.

Close▲


Next Generation PTFE Substrate and New Solution of Using Same
Tatsunari Koyama
Manager,
Tokyo Sales Engineering Group,
Nippon Pillar Packing Co., Ltd.

See More Details▼

<Details>

Conventionally PTFE substrates have been recognized attractive thanks to low Dk and Df, but for multi-layered PCB, PTFE have some difficulty on fabrication. In this session, we propose new PTFE build-up multi-layered PCB with thermosetting bonding film fabricated with usual PCB process. Additionally, we introduce some key development results from material and design points of view. 

<Speaker Profile>

He graduated Osaka university in 1999. He has over 15 years experience in developing analog semiconductor. From 2016, he engaged in developing PTFE substrate and now is a sales engineer.

Close▲


Low Loss Adhesive Film for Multilayer PTFE Substrate AS-400HS
Masaki Yamaguchi
Senior Researcher,
Laminate Materials R&D Dept., R&D Center, Electronics Business Headquarters,
Resonac Corp.

See More Details▼

<Details>

Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising in beyond 5G and 6G society. With these background, we have developed a bonding film for PTFE multilayer substrate.

Close▲

Select this seminar
 

Latest Trends of Rapidly Evolving in-vehicle Electronics and Mounting Technologies

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
English/Japanese
ISP-1
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 1
Course Leader:Chiaki Takubo, KIOXIA Corp.
Sub Course Leader:Shigeki Sako, Amkor Technology Japan, Inc.
Roadmap for Next Generation xEV in 2030 and Its Technical Trend of Power Devices Applications
Masayoshi Yamamoto
Professor,
Institute of Materials and Systems for Sustainability (IMaSS),
Nagoya University

See More Details▼

<Details>

Power electronics technical trends and predictions for Next Generation xEVs in 2030 will discuss from the power semiconductor device module techniques, the current sensor application techniques and the material application techniques point of views for the e-Axle and the in-wheel motor systems.

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Trends of Automotive Semiconductors for CASE and Challenges in Packaging Technology
Shinji Baba
Senior Principal Specialist,
Packaging Technology Div., Production and Technology Unit,
Renesas Electronics Corp.

See More Details▼

<Details>

Semiconductors such as SoCs for thinking, MCUs for control, and Analog/Power devices for actuating have various packaging technology challenges. The examples are high speed signaling, electromigration by high current, and isolation for high voltage. We introduce trends in the safe and secure packaging technologies we are pursuing, focusing on autonomous driving and electrification.

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3D Packaging Technology for the Latest Logic and Power Devices

Jan. 25 (Wed)
 
10:30
 - 
12:00
Free Session
English/Japanese
ISP-2
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 2
Course Leader:Tsutomu Sekiya, C. Uyemura & Co., Ltd.
Sub Course Leader:Keiichiro Kata, Renesas Electronics Corp.
Advanced 3D Packaging and Integration Technology
Takafumi Fukushima
Associate Professor,

Tohoku University

See More Details▼

<Details>

From the dichotomization between TSV-less FOWLP and CoWoS with TSV, advanced interposers and technologies that fuse the two have emerged one after another, bringing us to an era in which semiconductor system performance is determined by microelectronics packaging. The latest trends in these technologies, including solderless Cu-Cu hybrid bonding, will be discussed.

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Advanced Sinter Joining for Power Devices
Katsuaki Suganuma
Director,
Flexible 3D System Integration Lab.,
Osaka University

See More Details▼

<Details>

With the commercialization of SiC, the advance in packaging material technology is remarkable. Silver (Ag) sinter joining is applied to wiring and TIM developments not only to die attach in order to improve heat dissipation. There is no need to use nanoparticles, and high performance can be realized without any concern in affordability.

<Speaker Profile>

He received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center of ISIR in 2007-2009, the director of ISIR in 2018-2020. He is currently Specially Appointed Professor and Professor Emeritus of Osaka University.

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Semiconductor Power Devices (Si, SiC) That will Achieve Low-carbon Society

Jan. 25 (Wed)
 
15:30
 - 
17:00
Free Session
English/Japanese
ISP-3
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 3
Course Leader:Takashi Matsumoto, DENSO Corp.
Sub Course Leader:Chiaki Takubo, KIOXIA Corp.
Power Device Development Trends Supporting the Realization of a Low-carbon Society
Shinichi Izuo
Dept. manager,
Mitsubishi Electric Corp.

See More Details▼

<Details>

To realize a low-carbon society, power electronics technology has a wide range of applications, including in the automotive, railway, industrial, consumer, and renewable energy sectors. Power devices as key parts are evolving to meet various market needs such as small size, high function, light weight and long life by applying not only Si but also wide bandgap semiconductors such as SiC. Technological developments supporting these evolutions are introduced.

<Speaker Profile>

Shinichi Izuo received his BSc and MSc in material engineering from Kyoto University, Japan in 1996 and 1998, respectively. In the same year, he joined Mitsubishi Electric Corporation, Japan. He has been engaged in the development of microfabrication technology and automotive sensors. He had been involved in power module development since 2010 and assumed his current position since April 2022.

Close▲


Chinese Government' Support for the Semiconductor Industry and the Latest Trends of SiC for Vehicle
Yao Ying
General Manager,

Beijing Fuji Chimera Consulting

See More Details▼

<Details>

Based on the Chinese government's support for the semiconductor industry, the latest trends of SiC and GaN attracting attention toward the dual carbon goals, will be introduced as well as the application cases of automobile industry and development direction of local semiconductor manufacturers.

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Key to the 3D Package Supply Chain: Development Trends and Future Perspective on the Latest Substrate Technology

Jan. 26 (Thu)
 
12:30
 - 
14:00
Free Session
English/Japanese
ISP-4
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 4
Course Leader:Keiichiro Kata, Renesas Electronics Corp.
Sub Course Leader:Katsuhiko Suzuki, Showa Denko Materials Co., Ltd.
Semiconductor Package Substrate Development Trends Driving Heterogeneous Integration
Kiyoshi Oi
Senior Manager,
Process Development dept., RESEARCH & DEVELOPMENT Div.,
SHINKO ELECTRIC INDUSTRIES Co., Ltd.

See More Details▼

<Details>

Increasing size, density, and multi-device integration of semiconductor packages have come to play a role in improving the characteristics of electronic devices. Substrate and assembly technology are key elements in the evolution of semiconductor packages, We will introduce the trends of these technologies and our initiative for the advanced package.

<Speaker Profile>

After graduating from Tohoku University Graduate School of Engineering, started work at SHINKO ELECTRIC INDUSTRIES Co., Ltd. in 2001. Since, engaged in the development of embedded substrate, fine pitch flip-chip and organic interposer assembly technology.

Close▲


Substrate Solution Technology Delivering High-speed and High-performance for 3D Packaging
Yoshikazu Uehara
Dept. Manager,
Board Solution and Development Dept,. Engineering and Development Div., Corporate Organic Materials Semiconductor Components Group,
KYOCERA Corp.

See More Details▼

<Details>

3D packaging requires co-design of chip, package and board for high-density design and optimal power/signal quality. In addition to package-board co-design, Kyocera works with ASIC vendors and power supply vendors to achieve the optimal overall system design.

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Technologies That Support Post-5G/6G

Jan. 26 (Thu)
 
12:30
 - 
14:00
Free Session
English/Japanese
ISP-5
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 5
Course Leader:Shinichi Kajiya, Sumitomo Bakelite Co., Ltd.
Sub Course Leader:Takashi Matsumoto, DENSO Corp.
Technology for Antenna-array Integrated Module and Initiative for Terahertz Communication
Hideki Ueda
Principal Researcher,
mmWave Business Promotion Dept., Communication Modules Div.,
Murata Manufacturing Co., Ltd.

See More Details▼

<Details>

Antenna-array integrated module (AiM) which integrates antennas, RFIC, connector, etc. is used at the millimeter-wave band. The author will present the background of the AiM utilization and technologies for AiM. Feasibilities for the terahertz communication will also be presented.

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Heterogeneous Integration of III-V Devices for Si Photonics Circuits
Shinji Matsuo
Senior Distinguished Researcher,
NTT Corp.

See More Details▼

<Details>

Research and development for the integration of heterogeneous materials with compound semiconductors is being actively pursued for further advancement of silicon photonics technology. In this talk, we will describe the hetero-integration technology using compound semiconductor membrane devices at NTT.

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Exploring the Technology Trends of the Latest Semiconductor Packaging That Lead the DX Revolution in Post-COVID-19

Jan. 27 (Fri)
 
10:00
 - 
11:30
Free Session
English/Japanese
ISP-6
IC & SENSOR PACKAGING TECHNOLOGY EXPO Technical Session 6
Course Leader:Shigeki Sako, Amkor Technology Japan, Inc.
Sub Course Leader:Shinichi Kajiya, Sumitomo Bakelite Co., Ltd.
Technology Trends of the Chiplet Package Technology toward Dx/ Society 5.0
Toshihiko Nishio
CEO,

SBR Technology Co., Ltd.

See More Details▼

<Details>

Toward the society 5.0 Era., various types of chiplet packages will be deployed to realize the high performance of scalable AI accelerators, CPUs and Network ICs. This will also be rolled out in infrastructure and client products. Future developments of various chiplet packages, their advantages and roadmaps, and chip-to-chip connection design rules and standardization will be explained.

<Speaker Profile>

1988: IBM Japan
2011: STATSChipPAC Japan
2015: SBR Technology

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Optical Packaging Technology for the Silicon Photonics Optical Transceiver IOCore and Development Trends
Kazuhiko Kurata
CTO, Board of Directors,
AIO Core CO., LTD.

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AIOCore develops, manufactures and markets the "IOCore" ultra-compact optical transceiver. Currently, the development up to 128Gbps (32Gbps/ch) has been completed and sales have started, and the next model is being developed.
The singularity of optical mounting technology comes down to optical connections. Trends and future prospects are introduced focusing on the implementation technology applied to "IOCore".

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